Abstract: The disclosed technology includes systems and methods of identifying and managing sensitive information. The method can include detecting data entered into a form on a user interface, and generating, by a natural language understanding model, comprehension data based on the data entered into the form. The method can include determining, by a machine learning model, a risk score of the data and determining whether the risk score is greater than or equal to a threshold risk score. In response to determining that the risk score is greater than or equal to the threshold risk score, the method can include outputting a message to the user interface to alert a user that the data likely comprises sensitive information. The method can include receiving an input from the user interface indicative of whether the data comprises sensitive information and storing the data, the risk score, and the input in a database.

Abstract: A sensor assembly comprises a rigid substrate with a circuit subassembly wrapped therearound. The circuit subassembly includes a flexible substrate with conductive traces and interconnects formed thereon, and when wrapped around the rigid substrate, the conductive traces may overlap one another so as to form capacitive sensor elements. The interconnects connect the conductive traces to one or more components, such as a printed circuit board attached to a portion of the flexible substrate. The sensor assembly maybe installed in an opening formed in a host device panel of a host device, such as a smart phone, with the sensor assembly optionally peripherally surrounded by a spacer frame, and covered by a cover element. The circuit subassembly may include a host connector tab for electrically connecting the sensor assembly to electrical components of a host device.

Abstract: A fingerprint sensor assembly includes a capacitive fingerprint sensor disposed beneath a thin layer of glass and a reinforcement layer of a material of relatively high dielectric constant bonded to the glass between the glass layer and the sensor.

Abstract: A sensor assembly comprises a rigid substrate with a circuit subassembly wrapped therearound. The circuit subassembly includes a flexible substrate with conductive traces and interconnects formed thereon, and when wrapped around the rigid substrate, the conductive traces may overlap one another so as to form capacitive sensor elements. The interconnects connect the conductive traces to one or more components, such as a printed circuit board attached to a portion of the flexible substrate. The sensor assembly maybe installed in an opening formed in a host device panel of a host device, such as a smart phone, with the sensor assembly optionally peripherally surrounded by a spacer frame, and covered by a cover element. The circuit subassembly may include a host connector tab for electrically connecting the sensor assembly to electrical components of a host device.

Abstract: Disclosed is an electrical connector having a substrate and movable electrical contacts which are mounted to the substrate and extend a distance D from the substrate. A layer of compressible material (such as a foam or elastomeric material) is positioned on the substrate adjacent at least some of the electrical contacts and ideally has an uncompressed thickness slightly greater than the distance D to provide for protection of the electrical contacts. When a mating electrical device such as an electrical connector or other circuit member is mated to the electrical connector with its electrical contacts and its layer of compressible material, the layer of compressible material is compressed to a thickness less than the distance D, allowing the contacts to make a suitable electrical interconnection to the mating electrical device.

Abstract: A sensor assembly comprises a rigid substrate with a circuit subassembly wrapped therearound. The circuit subassembly includes a flexible substrate with conductive traces and interconnects formed thereon, and when wrapped around the rigid substrate, the conductive traces may overlap one another so as to form capacitive sensor elements. The interconnects connect the conductive traces to one or more components, such as a printed circuit board attached to a portion of the flexible substrate. The sensor assembly maybe installed in an opening formed in a host device panel of a host device, such as a smart phone, with the sensor assembly optionally peripherally surrounded by a spacer frame, and covered by a cover element. The circuit subassembly may include a host connector tab for electrically connecting the sensor assembly to electrical components of a host device.

Abstract: A fingerprint sensor assembly includes a capacitive fingerprint sensor disposed beneath a thin layer of glass and a reinforcement layer of a material of relatively high dielectric constant bonded to the glass between the glass layer and the sensor.

Abstract: Disclosed is an electrical connector having a substrate and movable electrical contacts which are mounted to the substrate and extend a distance D from the substrate. A layer of compressible material (such as a foam or elastomeric material) is positioned on the substrate adjacent at least some of the electrical contacts and ideally has an uncompressed thickness slightly greater than the distance D to provide for protection of the electrical contacts. When a mating electrical device such as an electrical connector or other circuit member is mated to the electrical connector with its electrical contacts and its layer of compressible material, the layer of compressible material is compressed to a thickness less than the distance D, allowing the contacts to make a suitable electrical interconnection to the mating electrical device.

Abstract: A sensor assembly comprises a rigid substrate with a circuit subassembly wrapped therearound. The circuit subassembly includes a flexible substrate with conductive traces and interconnects formed thereon, and when wrapped around the rigid substrate, the conductive traces may overlap one another so as to form capacitive sensor elements. The interconnects connect the conductive traces to one or more components, such as a printed circuit board attached to a portion of the flexible substrate. The sensor assembly maybe installed in an opening formed in a host device panel of a host device, such as a smart phone, with the sensor assembly optionally peripherally surrounded by a spacer frame, and covered by a cover element. The circuit subassembly may include a host connector tab for electrically connecting the sensor assembly to electrical components of a host device.

Abstract: Disclosed is an electrical connector having a substrate and movable electrical contacts which are mounted to the substrate and extend a distance D from the substrate. A layer of compressible material (such as a foam or elastomeric material) is positioned on the substrate adjacent at least some of the electrical contacts and ideally has an uncompressed thickness slightly greater than the distance D to provide for protection of the electrical contacts. When a mating electrical device such as an electrical connector or other circuit member is mated to the electrical connector with its electrical contacts and its layer of compressible material, the layer of compressible material is compressed to a thickness less than the distance D, allowing the contacts to make a suitable electrical interconnection to the mating electrical device.

Abstract: A modular, expandable, no-tools pump assembly having precise computer control for controlling dispensing volumes and flow characteristics of the dispensed fluid.

Abstract: A cylinder head for an internal combustion engine (ICE) includes a lower cooling jacket, an upper cooling jacket and an exhaust manifold disposed therebetween. The exhaust manifold enables exhaust of combustion gas from cylinders of the ICE. The lower cooling jacket has coolant flow paths in fluid communication with coolant flow paths of a cylinder block of the ICE. Coolant flow paths of the upper cooling jacket are in fluid communication with those of the lower cooling jacket through one of a plurality of passages. The passages can be selectively plugged to define coolant flow direction through the cylinder head. The upper and lower cooling jackets are in heat exchange relationship with surfaces of the exhaust manifold to cool exhaust gas flowing therethrough.

Abstract: A method and system for filling small volume containers, tubes, and wells while maintaining a clean room environment around such containers, tubes, and wells by isolating all engaging moving components of the drive mechanism from the environmental area containing the containers, tubes, or wells. A unitary nozzle support arm extends through a base unit housing the drive mechanism and out over the containers, tubes, or wells intended to be filled. A nozzle mounted to the support arm is preferably in fluid communication with a source of the fluid that is to be analyzed. Optionally, such source may comprise an electronically controlled pump which interfaces with the control unit for the filling system so that both components may be controlled from a single operator interface.