Abstract: A laser cutting system including a chamber configured to provide a controlled environment while the laser is being used to cut a pattern into a material to reduce or eliminate heat and oxygen related changes to the mechanical characteristics of the material. A system for providing a gas to the controlled environment within the chamber, as well as a means for exhausting gas and cutting debris from the chamber is also described. A cutting mandrel that provides for flow of a shielding gas and also provides a means for dispersing a laser beam before it can produce unwanted damage to a section of tubing is also described.

Abstract: A laser cutting system including a chamber configured to provide a controlled environment while the laser is being used to cut a pattern into a material to reduce or eliminate heat and oxygen related changes to the mechanical characteristics of the material. A system for providing a gas to the controlled environment within the chamber, as well as a means for exhausting gas and cutting debris from the chamber is also described. A cutting mandrel that provides for flow of a shielding gas and also provides a means for dispersing a laser beam before it can produce unwanted damage to a section of tubing is also described.

Abstract: A modular frame assembly for a wafer fabrication system comprising at least one base casting and at least one upstanding pod door opening casting. The at least one base casting and at least one upstanding pod door opening casting are self registering and allow frames for wafer fabrication systems of any normally desired configuration to be produced out of a small number of cast modules. More specifically, in a preferred embodiment, frames configured to mate with one to four commercially available loaders may be readily assembled out of the aluminum castings.

Abstract: A modular frame assembly for a wafer fabrication system comprising at least one base casting and at least one upstanding pod door opening casting. The at least one base casting and at least one upstanding pod door opening casting are self registering and allow frames for wafer fabrication systems of any normally desired configuration to be produced out or a small number of cast modules. More specifically, in a preferred embodiment, frames configured to mate with one to four commercially available loaders may be readily assembled out of the aluminum castings.

Abstract: A wafer carrier adapter for use with a 200 millimeter wafer carrier and a pod door opener to a front end of a semiconductor processing environment. The 200 millimeter wafer carrier has a bottom surface and is provided with a plurality of recesses extending through the bottom surface in a predetermined configuration and a front opening for accessing silicon wafers in the wafer carrier. The pod door opener has a platform with a kinematic coupling which includes a plurality of pins extending upwardly in a predetermined pattern from the platform for aligning and supporting 300 millimeter wafer carriers relative to a port in the pod door opener. The wafer carrier adapter comprises a support structure having top and bottom surfaces. The support structure is provided with a plurality of recesses extending through the bottom surface adapted to receive the plurality of pins.