Abstract: A heat sink assembly with an adjustable and customizable mounting clip is provided. The length of the mounting clip can be precisely adjusted to accommodate integrated circuit device sockets of varying lengths. Unused legs of the mounting clip can be completely removed to accommodate neighboring circuit board components. With the mounting clip adjusted and legs selected, a heat sink member is threaded through the top planar member of the mounting clip into flush thermal communication with the top surface of an integrated circuit device to effectuate heat dissipation therefrom.

Abstract: A heat sink assembly with an adjustable and customizable mounting clip is provided. The legs of the mounting clip are adjustable to accommodate heat sink members of different sizes and shapes. The overall height of the mounting clip is adjustable by selecting a particular radial flange for mounting to a flange seat on a universal top member. With the leg length selected, unwanted portions of the legs may be snapped off and discarded to leave a customized, low-profile heat sink assembly.

Abstract: System, including a U-shaped handle, that is swingable about an axis passing through the ends of its legs and selectably lockable in an operative position or an inoperative storage position.