Abstract: A three dimensional printing system for manufacturing a three dimensional article includes a print engine, a receptacle, a pump motor system, a removable conduit assembly, and a resin container. The receptacle includes an upper portion with an opening and a lower interface portion. The removable conduit assembly includes: a fluid inlet extending upwardly from the lower interface portion; a pump head removably coupled to the pump motor system; a fluid outlet for supplying resin to the print engine. The resin container includes an internal reservoir and a leading and trailing end relative to a direction of insertion of the resin container into the receptacle. The resin container includes a fluid outlet that extends downwardly from the leading end. Installation of the resin container includes passing the leading end through the opening and lowering and coupling the leading end to the lower interface portion.

Abstract: A kit enables an efficient and contamination-free method of changing a resin used in a three dimensional printer from a first resin to a second resin. The three dimensional printer includes a print engine and a receptacle. The kit includes a conduit assembly and a resin container. The conduit assembly includes a fluid inlet configured to be affixed in the receptacle in an upward orientation, a pump head configured to be coupled to a motorized pump actuator in the receptacle, a first conduit coupling the fluid inlet to the pump head, a fluid outlet configured to supply resin to the print engine, and a second conduit coupling the pump head to the fluid outlet.

Abstract: A three dimensional printing system for manufacturing a three dimensional article includes a print engine, a receptacle, a pump motor system, a removable conduit assembly, and a resin container. The receptacle includes an upper portion with an opening and a lower interface portion. The removable conduit assembly includes: a fluid inlet extending upwardly from the lower interface portion; a pump head removably coupled to the pump motor system; a fluid outlet for supplying resin to the print engine. The resin container includes an internal reservoir and a leading and trailing end relative to a direction of insertion of the resin container into the receptacle. The resin container includes a fluid outlet that extends downwardly from the leading end. Installation of the resin container includes passing the leading end through the opening and lowering and coupling the leading end to the lower interface portion.

Abstract: A resin container is configured to provide a photocurable resin to a three dimensional printing system. The three dimensional printing system includes a receptacle configured to provide the resin to a print engine. The resin container includes a housing enclosing an internal reservoir which contains an impeller. The resin container has a leading end and a trailing end relative to a direction of insertion or installation of the resin container into the receptacle. The leading end includes a fluid outlet extending downwardly from a first lateral location, an electrical connector extending downwardly from a second location, and a gear coupled to the impeller and extending downwardly from a third lateral location.

Abstract: A kit enables an efficient and contamination-free method of changing a resin used in a three dimensional printer from a first resin to a second resin. The three dimensional printer includes a print engine and a receptacle. The kit includes a conduit assembly and a resin container. The conduit assembly includes a fluid inlet configured to be affixed in the receptacle in an upward orientation, a pump head configured to be coupled to a motorized pump actuator in the receptacle, a first conduit coupling the fluid inlet to the pump head, a fluid outlet configured to supply resin to the print engine, and a second conduit coupling the pump head to the fluid outlet.

Abstract: A system and method is disclosed for manufacturing thin film resistors using a trench and chemical mechanical polishing. A trench is etched in a layer of dielectric material and a thin film resistor layer is deposited so that the thin film resistor layer lines the trench. A thin film resistor protection layer is then deposited to fill the trench. Then a chemical mechanical polishing process removes excess portions of the thin film resistor layer and the thin film resistor protection layer. An interconnect metal is then deposited and patterned to create an opening over the trench. A central portion of the thin film resistor protection material is removed down to the thin film resistor layer at the bottom of the trench. The resulting structure is immune to the effects of topography on the critical dimensions (CDs) of the thin film resistor.

Abstract: A gaming system having one or more reconfigurable gaming machines and reconfigurable gaming displays is disclosed herein. Each gaming machine includes three reconfigurable video screens, wherein the reconfigurable first video screen, the second reconfigurable video screen, and the third reconfigurable video screen display a first game, information associated with the first game, casino specific features, or combinations thereof. The one or more gaming machines are reconfigurable to display a second game on the three reconfigurable video screens in response to receiving a reconfiguration command and downloading the second game from a server via a network so that the first reconfigurable video screen, the second reconfigurable video screen, and the third reconfigurable video screen display the second game, information associated with the second game, casino specific features, or combinations thereof.

Abstract: A gaming system having one or more reconfigurable gaming machines and reconfigurable gaming displays is disclosed herein. Each gaming machine includes three reconfigurable video screens, wherein the reconfigurable first video screen, the second reconfigurable video screen, and the third reconfigurable video screen display a first game, information associated with the first game, casino specific features, or combinations thereof. The one or more gaming machines are reconfigurable to display a second game on the three reconfigurable video screens in response to receiving a reconfiguration command and downloading the second game from a server via a network so that the first reconfigurable video screen, the second reconfigurable video screen, and the third reconfigurable video screen display the second game, information associated with the second game, casino specific features, or combinations thereof.

Abstract: A gaming system having one or more reconfigurable gaming machines and reconfigurable gaming displays is disclosed herein. Each gaming machine includes three reconfigurable video screens, wherein the reconfigurable first video screen displays a first game located on the gaming machine, and wherein the second reconfigurable video screen and the third reconfigurable video screen display pay tables associated with the first game, artwork associated with the first game, or combinations thereof. The one or more gaming machines are reconfigurable to display a second game on the three reconfigurable video screens in response to receiving a reconfiguration command and downloading the second game from a server via a network so that the second game is displayed on the first reconfigurable video screen, and wherein the second reconfigurable video screen and the third reconfigurable video screen display pay tables associated with the second game, artwork associated with the second game, or combinations thereof.

Abstract: A gaming system having one or more reconfigurable gaming machines and reconfigurable gaming displays is disclosed herein. Each gaming machine includes three reconfigurable video screens, wherein the reconfigurable first video screen displays a first game located on the gaming machine, and wherein the second reconfigurable video screen and the third reconfigurable video screen display pay tables associated with the first game, artwork associated with the first game, or combinations thereof. The one or more gaming machines are reconfigurable to display a second game on the three reconfigurable video screens in response to receiving a reconfiguration command and downloading the second game from a server via a network so that the second game is displayed on the first reconfigurable video screen, and wherein the second reconfigurable video screen and the third reconfigurable video screen display pay tables associated with the second game, artwork associated with the second game, or combinations thereof.

Abstract: A gaming system having a reconfigurable gaming machines and reconfigurable gaming displays is disclosed herein. The gaming system comprises one or more gaming machines including one or more reconfigurable video displays where at least one display presents video content for a game of chance and one display presents game information. The gaming machines are capable of receiving and presenting downloadable information on the reconfigurable video displays. The gaming system also includes a configurable display sign associated with the gaming machines. The configurable display sign includes one or more video displays, and the configurable display sign is capable of receiving and presenting downloadable information on the video displays. The gaming system also includes a processor that is in communication with the gaming machines and the configurable display sign. The processor is capable of altering the content displayed on one or more of the reconfigurable video displays and the configurable display sign.

Abstract: The disclosed system and method provide a dynamic and scalable gaming system in which a plurality of gaming machines are connected to a network switch. The gaming switch has two sets of data ports configured into two virtual local area networks (VLANs). The gaming machines are connected through their network interfaces to a first set of data ports of the network switch to form a first VLAN. The gaming machines are connected through their serial interfaces and serial-to-network adapters to a second set of data ports of the network switch to form a second VLAN. The gaming machines are configured to communicate with devices external to the gaming network through their network interfaces. The gaming machines are configured to communicate with each other through their serial interfaces. External and internal communications within the gaming network are segregated both at the device and network levels.

Abstract: The disclosed system and method provide a dynamic and scalable gaming system in which a plurality of gaming machines are connected to a network switch to form a hybrid peer-to-peer gaming network. The gaming switch has two sets of data ports configured into two virtual local area networks (VLANs). The gaming machines are connected through their network interfaces to a first set of data ports of the network switch to form a first VLAN. The gaming machines are connected through their serial interfaces and serial-to-network adapters to a second set of data ports of the network switch to form a second VLAN. The gaming machines are configured to communicate with devices external to the gaming network through their network interfaces. The gaming machines are configured to communicate with each other through their serial interfaces. External and internal communications within the gaming network are segregated both at the device and network levels.

Abstract: A system and method is disclosed for providing a resistor protect layer to protect a thin film resistor in a semiconductor device. A thin film resistor is formed on a dielectric layer and a resistor protect layer is placed over the thin film resistor. An etch procedure is employed to facet the corners of the resistor protect layer. The faceted corners of the resistor protect layer reduce the step height of the resistor protect layer. Then a conductor is deposited over the resistor protect layer and the dielectric layer. When portions of the conductor are subsequently etched away, the resistor protect layer protects the underlying thin film resistor from being exposed to the etch process.

Abstract: A buried thin film resistor having end caps defined by a dielectric mask is disclosed. A thin film resistor is formed on an integrated circuit substrate. A resistor protect layer is formed over the thin film resistor. First and second portions of a first dielectric material are formed over the resistor protect layer over the first and second ends of the thin film resistor. The resistor protect layer is then wet etched using the first and second portions of the first dielectric material as a hard mask. Then a second dielectric layer is deposited. A first via mask and etch process is used to etch vias down to the underlying portions of the resistor protect layer over the ends of the thin film resistor. A second via mask and etch process is used to etch substrate vias to an underlying conductor layer.

Abstract: A system and method are disclosed for preventing metal corrosion on bond pads. During manufacture of an integrated circuit device an anti-reflective coating (ARC) layer is applied to a metal stack of a bond pad. A mask and etch process is applied to etch an aperture through the ARC layer down to the metal stack. Then a passivation layer is applied to cover the ARC layer and the aperture through the ARC layer. Then another mask and etch process is applied to etch a bond pad opening through the passivation layer inside the ARC layer aperture down to the metal stack. Interior edge portions of the passivation layer seal the interior edge portions of the ARC layer aperture to prevent corrosion of the ARC layer due to high temperatures, high humidity and corrosive materials encountered in subsequent assembly operations of the integrated circuit device.

Abstract: A system and method are disclosed for preventing metal corrosion on bond pads. During manufacture of an integrated circuit device an anti-reflective coating (ARC) layer is applied to a metal stack of a bond pad. A mask and etch process is applied to etch an aperture through the ARC layer down to the metal stack. Then a passivation layer is applied to cover the ARC layer and the aperture through the ARC layer. Then another mask and etch process is applied to etch a bond pad opening through the passivation layer inside the ARC layer aperture down to the metal stack. Interior edge portions of the passivation layer seal the interior edge portions of the ARC layer aperture to prevent corrosion of the ARC layer due to high temperatures, high humidity and corrosive materials encountered in subsequent assembly operations of the integrated circuit device.

Abstract: A method is disclosed for eliminating a mask layer during the manufacture of thin film resistor circuits. The method of the present invention enables the simultaneous etching of both deep vias and shallow vias using one mask layer instead of two mask layers. A high selectivity film layer of silicon nitride is formed on the ends of a thin film resistor layer. The thickness of the silicon nitride causes the etch time for a shallow via to the thin film resistor to be approximately equal to an etch time for a deep via that is etched through dielectric material to an underlying patterned metal layer.

Abstract: A buried thin film resistor having end caps defined by a dielectric mask is disclosed. A thin film resistor is formed on an integrated circuit substrate. A resistor protect layer is formed over the thin film resistor. A layer of dielectric material is formed over the resistor protect layer. The dielectric material is masked and dry etched to leave a first portion of dielectric material over a first end of the thin film resistor and a second portion of dielectric material over a second end of the thin film resistor. The resistor protect layer is then wet etched using the first and second portions of the dielectric material as a hard mask. Then a second dielectric layer is deposited and vias are etched down to the underlying portions of the resistor protect layer.

Abstract: A method is disclosed for applying a plasma etch process to facet a masking layer in a semiconductor device by creating sloped surfaces in the masking layer. The masking layer is plasma etched with a plasma that has a high sputter etch component. The plasma etch process removes material from vertical edges of the masking layer to form a sloped surface at each vertical edge of the masking layer. A layer of conductive material is then applied to the masking layer. When the layer of conductive material is subsequently removed by an overetch process the sloped profile of the masking layer facilitates the removal of stringers of conductive material without using an excessively lengthy overetch.