Abstract: An integrated circuit package that contains a fan assembly which is mounted to the package. The package includes a printed circuit board substrate which has a top surface, an opposite bottom surface and an inner die cavity. A plurality of pins extend from the bottom surface of the substrate so that the package can be connected to an external printed circuit board. A metal lid may be mounted to the top surface to enclose an integrated circuit located within the die cavity of the substrate. The integrated circuit may be mounted to the lid and is electrically coupled to the pins by various routing features of the package. The package includes a plurality of metal disks that are soldered to corresponding surface pads on the top surface of the substrate. The lid exposes the disks. A fan assembly is mounted to the lid and connected to the disks so that the fan receives electrical current through the package.