Patents by Inventor Rodney L. Alley
Rodney L. Alley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10267822Abstract: A sensor having a particle barrier is described. In an example, a sensor includes: first and second electrode sets respectively disposed upon a planar support surface and a proof mass that is compliantly displaceable along a first axis substantially parallel to the planar support surface; and a first barrier disposed on the planar support around the first electrode set having a height less than a gap between the planar support and the proof mass to mitigate particle migration into the first or second electrode set.Type: GrantFiled: January 31, 2013Date of Patent: April 23, 2019Assignee: Hewlett-Packard Development Company, L.P.Inventors: Jennifer Wu, Rodney L. Alley, Robert G. Walmsley, Donald J. Milligan
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Patent number: 10137687Abstract: Printing apparatus and methods of producing such a device are disclosed. An example printhead die includes a first resistor (404) to cause fluid to be ejected out of a first nozzle (142; 205; 305) and a second resistor (405) to cause fluid to be ejected out of a second nozzle (142, 205, 305). The example printhead die also includes a first cavitation plate (408) to cover the first resistor (404) and a second cavitation plate (412) to cover the second resistor (405), the first cavitation plate (408) spaced from the second cavitation plate (412).Type: GrantFiled: October 30, 2014Date of Patent: November 27, 2018Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Laurie A Coventry, Rodney L Alley, David R Thomas
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Patent number: 9856137Abstract: The present disclosure includes bonded wafer structures and methods of forming bonded wafer structures. One example of a forming a bonded wafer structure includes providing a first wafer (202, 302) and a second wafer (204, 304) to be bonded together via a bonding process that has a predetermined wafer gap (216, 316) associated therewith, and forming a mesa (215, 315, 415) on the first wafer (202, 302) prior to bonding the first wafer (202, 302) and the second wafer (204, 304) together, wherein a height (220, 320, 420) of the mesa (215, 315, 415) is determined based on a target element gap (217, 317) associated with the bonded wafer structure.Type: GrantFiled: May 9, 2011Date of Patent: January 2, 2018Assignee: Hewlett-Packard Development Company, L.P.Inventors: Rodney L. Alley, Donald J. Milligan
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Publication number: 20170305168Abstract: Printing apparatus and methods of producing such a device are disclosed. An example printhead die includes a first resistor (404) to cause fluid to be ejected out of a first nozzle (142; 205; 305) and a second resistor (405) to cause fluid to be ejected out of a second nozzle (142, 205, 305). The example printhead die also includes a first cavitation plate (408) to cover the first resistor (404) and a second cavitation plate (412) to cover the second resistor (405), the first cavitation plate (408) spaced from the second cavitation plate (412).Type: ApplicationFiled: October 30, 2014Publication date: October 26, 2017Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Laurie A Coventry, Rodney L Alley, David R Thomas
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Patent number: 9571008Abstract: The present disclosure includes structures and methods of forming structures for restricting out-of-plane travel.Type: GrantFiled: June 28, 2011Date of Patent: February 14, 2017Assignee: Hewlett-Packard Development Company, L.P.Inventors: Donald J. Milligan, Rodney L. Alley, Peter G. Hartwell, Robert G. Walmsley
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Publication number: 20150355223Abstract: A sensor having a particle barrier is described. In an example, a sensor includes: first and second electrode sets respectively disposed upon a planar support surface and a proof mass that is compliantly displaceable along a first axis substantially parallel to the planar support surface; and a first barrier disposed on the planar support around the first electrode set having a height less than a gap between the planar support and the proof mass to mitigate particle migration into the first or second electrode set.Type: ApplicationFiled: January 31, 2013Publication date: December 10, 2015Inventors: Jennifer Wu, Rodney L. Alley, Robert G. Walmsley, Donald J. Milligan
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Patent number: 8776337Abstract: The present disclosure includes methods of forming capacitive sensors. One method includes forming a first electrode array of the capacitive sensor on a first structure. Forming the first electrode array can include: forming a dielectric material on a substrate material; forming an electrode material on the dielectric material; removing portions of the electrode material to form a number of electrodes separated from each other; and removing at least a portion of the dielectric material from between the number of electrodes. The method can include bonding the first structure to a second structure having a second electrode array of the capacitive sensor formed thereon such that the number of electrodes of the first electrode array face a number of electrodes of the second electrode array.Type: GrantFiled: July 30, 2010Date of Patent: July 15, 2014Assignee: Hewlett-Packard Development Company, L.P.Inventors: Brian D. Homeijer, Robert G. Walmsley, Rodney L. Alley, Dennis M. Lazaroff, Sara J. Homeijer
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Publication number: 20140042869Abstract: The present disclosure includes structures and methods of forming structures for restricting out-of-plane travel.Type: ApplicationFiled: June 28, 2011Publication date: February 13, 2014Inventors: Donald J. Milligan, Rodney L. Alley, Peter G. Hartwell, Robet G. Walmsley
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Publication number: 20140042596Abstract: The present disclosure includes bonded wafer structures and methods of forming bonded wafer structures. One example of a forming a bonded wafer structure includes providing a first wafer (202, 302) and a second wafer (204, 304) to be bonded together via a bonding process that has a predetermined wafer gap (216, 316) associated therewith, and forming a mesa (215, 315, 415) on the first wafer (202, 302) prior to bonding the first wafer (202, 302) and the second wafer (204, 304) together, wherein a height (220, 320, 420) of the mesa (215, 315, 415) is determined based on a target element gap (217, 317) associated with the bonded wafer structure.Type: ApplicationFiled: May 9, 2011Publication date: February 13, 2014Inventors: Rodney L. Alley, Donald Milligan
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Publication number: 20130019678Abstract: A micro electromechanical systems (MEMS) device includes a proof mass and a frame. The proof mass is to movably travel within the frame.Type: ApplicationFiled: July 22, 2011Publication date: January 24, 2013Inventors: Dennis M. Lazaroff, Rodney L. Alley, Brian D. Horneijer, John L. Williams, Donald J. Milligan
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Publication number: 20120199920Abstract: A structured glass wafer for packaging a microelectromechanical-system (MEMS) wafer. The structured glass wafer includes a sheet of glass, and an access hole. The sheet of glass has a first side and a second side, and is configured to provide a protective covering for MEMS devices. The access hole extends through the sheet of glass from the first side to the second side of the sheet of glass, and is configured to provide access to a group of electrical contacts of a group of MEMS devices. A packaged MEMS wafer including the structured glass wafer, and a method for fabricating a packaged MEMS wafer are also provided.Type: ApplicationFiled: February 3, 2011Publication date: August 9, 2012Inventors: Zhuqing ZHANG, Rodney L. Alley
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Publication number: 20120025851Abstract: The present disclosure includes capacitive sensors and methods of forming capacitive sensors. One capacitive sensor includes a first substrate structure having a first dielectric material formed thereon and electrodes of a first electrode array formed on the first dielectric material. The sensor includes a second substrate structure facing the first substrate structure and having a second dielectric material formed thereon and electrodes of a second electrode array formed on the second dielectric material. The sensor includes a removed portion of the first dielectric material forming a recess between adjacent electrodes of the first electrode array, and the first substrate structure is moveable with respect to the second substrate structure.Type: ApplicationFiled: July 30, 2010Publication date: February 2, 2012Inventors: Brian D. Homeijer, Robert G. Walmsley, Rodney L. Alley, Dennis M. Lazaroff, Sara J. Homeijer
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Patent number: 5954079Abstract: A microminiature valve having an actuator member that includes a central body suspended on radially spaced legs, with each leg having first and second layers of materials having substantially different coefficients of thermal expansion. The legs include heating elements and are fixed at one end to allow radial compliance as selected heating of the legs causes flexure. An actuator member includes a boss having an actuator face. A seat substrate having a flow via defined by a valve seat is aligned with the actuator face. Asymmetrical thermal actuation of the actuator member moves the actuator face from the valve seat in a rotational displacement relative to the flow orifice, thereby offering improved control of the fluid flow through the orifice.Type: GrantFiled: April 30, 1996Date of Patent: September 21, 1999Assignee: Hewlett-Packard Co.Inventors: Phillip W. Barth, Tak Kui Wang, Rodney L. Alley
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Patent number: 5403665Abstract: A micromachine is lubricated in a fluid-based process. The known fluid-based process of releasing a sacrificial layer from a micromachine is followed by a fluid-based hydrophilic processing of the micromachine surfaces. A lubricating monolayer surface is then formed on the resultant hydrophilic micromachine surfaces. Afterwards, the surfaces are dried through conventional means.Type: GrantFiled: June 18, 1993Date of Patent: April 4, 1995Assignee: Regents of the University of CaliforniaInventors: Rodney L. Alley, Roger T. Howe, Kyriakos Komyopoulos