Abstract: In accordance with exemplary embodiments, methods and systems are provided for designing a manufacturing system. In an exemplary embodiment, a method for designing a manufacturing system includes: identifying a potential hazard for the manufacturing system; evaluating, via a processor, the potential hazard with respect to a plurality of possible injuries associated with the potential hazard; and providing output, via instructions provided by the processor, with respect to the potential hazard based on the evaluating of the potential hazard with respect to the plurality of possible injuries associated with the potential hazard.

Abstract: In accordance with exemplary embodiments, methods and systems are provided for designing a manufacturing system. In an exemplary embodiment, a method for designing a manufacturing system includes: identifying a potential hazard for the manufacturing system; evaluating, via a processor, the potential hazard with respect to a plurality of possible injuries associated with the potential hazard; and providing output, via instructions provided by the processor, with respect to the potential hazard based on the evaluating of the potential hazard with respect to the plurality of possible injuries associated with the potential hazard.

Abstract: A method for forming small, isolated device structures by photolithography, utilizing overlapping bi-layer suspension-bridge shaped photomasks. The use of a suspended mask to define a device shape beneath it eliminates the problems associated with uneven undercutting of the usual bi-layer mask which is a stencil portion formed on a lower pedestal. In particular, the use of a suspended mask eliminates undesirable dielectric buildup around the device caused by an insufficiently undercut pedestal or of premature mask lift-off caused by an overly undercut pedestal.

Abstract: A method for forming a bi-layer lift-off mask for use in fabricating an abutted junction type GMR read-head sensor with a narrow trackwidth of less than 0.5 microns. The mask has a novel suspension bridge structure that avoids problems associated with bilayer lift-off masks of the prior art, namely insufficient or excessive undercutting of the lower layer that produces fence formations in the conducting lead layer or collapse of the mask structure rendering removal difficult.

Abstract: A structure for preventing and controlling Arcing Across Thin Dielectric Film in sputtering and other process that generate electric fields and cause arcing across conductive structures. In an embodiment, an extraneous window or two extraneous windows are formed in a second dielectric layer under at least of a portion of a lead to that a “hot spot” area is created where arcing is more likely to occur.

Abstract: A method for forming a bi-layer lift-off mask for use in fabricating an abutted junction type GMR read-head sensor with a narrow trackwidth of less than 0.5 microns. The mask has a novel suspension bridge structure that avoids problems associated with bi-layer lift-off masks of the prior art, namely insufficient or excessive undercutting of the lower layer that produces fence formations in the conducting lead layer or collapse of the mask structure rendering removal difficult.

Abstract: Methods and structures are disclosed which avoid electrostatic charge build up and subsequent electrostatic discharge (ESD) during the wafer fabrication process of magnetoresistive (MR) or giant magnetoresistive (GMR) read/write heads of magnetic disk drives. This is achieved by designing the wafer layout and process so that the MR/GMR sensor film is shorted to the magnetic shields of the head through shorting paths so that there is an equal potential between MR/GMR sensor film and magnetic shields during the entire fabrication process.

Abstract: A method and design for the fabrication of a laminated yoke for a high data rate magnetic read-write transducer head. A full film layer of first ferromagnetic material is formed on a base using either plating or sputtering. The base comprises a read head, a ferromagnetic pole piece, and a ferromagnetic shield which also serves as a pole piece. A patterned layer of first non-magnetic dielectric is then formed on the full film layer of first ferromagnetic material. A patterned layer of photoresist is then formed on the full film layer of first ferromagnetic material and the patterned non-magnetic dielectric and used as a frame for a frame plating deposition of a patterned layer of second ferromagnetic material. The full film layer of first ferromagnetic material and the non-magnetic dielectric are then patterned, using the patterned layer of second ferromagnetic material as a mask and ion beam etching.

Abstract: A method for preventing and controlling Arcing Across Thin Dielectric Film in sputtering and other process that generate electric fields and cause arcing across conductive structures. In a first embodiment, when the wafer is subjected to RF electric fields from a RF generating tool, the leads are oriented in a first direction which is perpendicular to the RF fields (in a second direction) generated by a RF generating tool (e.g., sputter tool). In a second embodiment, leads are shaped so that the leads extend on both sides of the ABS line so that the MR window 40 is close to the geometric center of the leads. In a third embodiment, an extraneous window or two extraneous windows are formed in a second dielectric layer under at least of a portion of a lead to that a “hot spot” area is created where arcing is more likely to occur.

Abstract: A method for preventing and controlling Arcing Across Thin Dielectric Film in sputtering and other process that generate electric fields and cause arcing across conductive structures. In a first embodiment, when the wafer is subjected to RF electric fields from a RF generating tool, the leads are oriented in a first direction which is perpendicular to the RF fields (in a second direction) generated by a RF generating tool (e.g., sputter tool). In a second embodiment, leads are shaped so that the leads extend on both sides of the ABS line so that the MR window 40 is close to the geometric center of the leads. In a third embodiment, an extraneous window or two extraneous windows are formed in a second dielectric layer under at least of a portion of a lead to that a “hot spot” area is created where arcing is more likely to occur.

Abstract: Disclosed are methods of allowing the current direction through the sensor or coil of a magneto resistive (MR) read/inductive write head to be consistent with the orienting magnetic field of the sensor or coil by allowing the current direction to be switched by a single mask layer change. This goal is achieved by creating additional connection sites to the non-magnetic mask layer to provide alternative means of connecting element leads to bonding pads and thus providing a choice in which direction to route the current through the sensor or coil of the read/write head.