Patents by Inventor Rodney Sprinkles

Rodney Sprinkles has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic assembly with controlled solder joint thickness
    Publication number: 20060255476
    Abstract: An electronic assembly includes a bare IC die or a leadless electronic component having at least one electrically conductive contact formed on a surface of the component and a leadframe or a substrate having at least one electrically conductive trace. The conductive contact of the component is electrically and mechanically coupled to the conductive trace with a solder joint. The solder joint includes a plurality of solid electrically conductive metal particles having a substantially spherical shape and a diameter ranging from about one mil to about ten mils.
    Type: Application
    Filed: May 16, 2005
    Publication date: November 16, 2006
    Inventors: Frederick Kuhlman, Richard Parker, Shing Yeh, Bradley Carter, Steven Middleton, Rodney Sprinkles