Abstract: A printed circuit manufacturing process includes starting with a piece of conductive material such as copper. One side of the conductive material is chemically machined or cut to form grooves corresponding to the desired design of the printed circuit. A dielectric material is then injection molded onto the conductive material so that the dielectric material fills the grooves that have been formed in one side of the conductive material. The opposite side of the conductive material is then subjected to a process to form the grooves that correspond to the desired printed circuit design. The grooves formed during this latter step preferably are coincident with those formed in a previous machining step. In one embodiment, more than one assembly of dielectric and conductive material are adhered together to form a double faced circuit.