Abstract: Techniques for efficient alignment of a semiconductor laser in a Photonic Integrated Circuit (PIC) are disclosed. In some embodiments, a photonic integrated circuit (PIC) may include a semiconductor laser that includes a laser mating surface, and a substrate that includes a substrate mating surface. A shape of the laser mating surface and a shape of the substrate mating surface may be configured to align the semiconductor laser with the substrate in three dimensions.

Abstract: Techniques for efficient alignment of a semiconductor laser in a Photonic Integrated Circuit (PIC) are disclosed. In some embodiments, a photonic integrated circuit (PIC) may include a semiconductor laser that includes a laser mating surface, and a substrate that includes a substrate mating surface. A shape of the laser mating surface and a shape of the substrate mating surface may be configured to align the semiconductor laser with the substrate in three dimensions.

Abstract: Techniques for efficient alignment of a semiconductor laser in a Photonic Integrated Circuit (PIC) are disclosed. In some embodiments, a photonic integrated circuit (PIC) may include a semiconductor laser that includes a laser mating surface, and a substrate that includes a substrate mating surface. A shape of the laser mating surface and a shape of the substrate mating surface may be configured to align the semiconductor laser with the substrate in three dimensions.

Abstract: Techniques for efficient alignment of a semiconductor laser in a Photonic Integrated Circuit (PIC) are disclosed. In some embodiments, a photonic integrated circuit (PIC) may include a semiconductor laser that includes a laser mating surface, and a substrate that includes a substrate mating surface. A shape of the laser mating surface and a shape of the substrate mating surface may be configured to align the semiconductor laser with the substrate in three dimensions.

Abstract: Techniques for efficient alignment of a semiconductor laser in a Photonic Integrated Circuit (PIC) are disclosed. In some embodiments, a photonic integrated circuit (PIC) may include a semiconductor laser that includes a laser mating surface, and a substrate that includes a substrate mating surface. A shape of the laser mating surface and a shape of the substrate mating surface may be configured to align the semiconductor laser with the substrate in three dimensions.

Abstract: According to one embodiment, a system for transmitting differential optical signals can include an optical modulation device, a multi-core optical waveguide, and a balanced optical receiver. The optical modulation device can include at least one optical input port and multiple optical output ports. The optical modulation device can transform the optical input signal into multiple complimentary modulated optical signals that are transmitted from the multiple optical output ports. The multi-core optical waveguide can include multiple cores disposed within a cladding material. The multiple cores, the cladding material, or both can be configured to mitigate transmission of optical energy between the multiple cores. The balanced optical receiver can include multiple photodetectors. The balanced optical receiver can be communicatively coupled to the multiple cores of the multi-core optical waveguide.

Abstract: According to one embodiment, a system for transmitting differential optical signals can include an optical modulation device, a multi-core optical waveguide, and a balanced optical receiver. The optical modulation device can include at least one optical input port and multiple optical output ports. The optical modulation device can transform the optical input signal into multiple complimentary modulated optical signals that are transmitted from the multiple optical output ports. The multi-core optical waveguide can include multiple cores disposed within a cladding material. The multiple cores, the cladding material, or both can be configured to mitigate transmission of optical energy between the multiple cores. The balanced optical receiver can include multiple photodetectors. The balanced optical receiver can be communicatively coupled to the multiple cores of the multi-core optical waveguide.

Abstract: A channeled substrate for forming integrated optical devices that employ optical fibers and at least one active optical component is disclosed. The channeled substrate includes a substrate member having an upper surface one or more grooves formed therein, and a transparent sheet. The transparent sheet, which is preferably made of thin glass, is fixed to the substrate member upper surface to define, in combination with the one or more grooves, one or more channels. The channels are each sized to accommodate an optical fiber to allow for optical communication through the transparent sheet between the active optical component and the optical fibers. Channeled substrates formed by molding and by drawing are also presented. Integrated optical devices that employ the channeled substrate are also disclosed.

Abstract: A method and system for reducing arbitration latency employs speculative transmission (STX) without prior arbitration in combination with routing fabric scheduled arbitration. Packets are sent from source locations to a routing fabric through scheduled arbitration, and also through speculative arbitration, to non-contentiously allocate outputs that were not previously reserved in the routing fabric to the speculatively transmitted packets.

Abstract: A fiber assembly having at least one photonic band-gap fiber and opto-electronic devices coupled to the at least one fiber at either end. The opto-electronic devices serve as electrical-to-optical (EO) and optical-to-electrical (OE) converters and provide industry-standard electrical interfaces to respective electronic devices. The photonic band-gap fiber has a hollow core so that light travels through air rather than glass, thereby providing a number of advantages over glass-based optical fiber assemblies used to connect electronic devices. A bent optical fiber coupler for use in the fiber assembly is also disclosed.

Abstract: A modular active board subassembly for coupling a waveguide array to an electrical component on a printed wiring board may include a substrate board with a sidewall extending around at least a portion of an attachment surface of the substrate board and forming a component cavity on the attachment surface. A transceiver may be disposed in the component cavity proximate an inboard edge of the substrate board. The transceiver may be electrically coupled to conductors on the attachment surface and electrically coupled to electrical contacts on an upper surface of the sidewall. A waveguide may be positioned in the component cavity and extend from the outboard edge of the substrate to the transceiver. The waveguide may be coupled to the transceiver.

Abstract: A channeled substrate for forming integrated optical devices that employ optical fibers and at least one active optical component is disclosed. The channeled substrate includes a substrate member having an upper surface one or more grooves formed therein, and a transparent sheet. The transparent sheet, which is preferably made of thin glass, is fixed to the substrate member upper surface to define, in combination with the one or more grooves, one or more channels. The channels are each sized to accommodate an optical fiber to allow for optical communication through the transparent sheet between the active optical component and the optical fibers. Channeled substrates formed by molding and by drawing are also presented. Integrated optical devices that employ the channeled substrate are also disclosed.

Abstract: A bent optical fiber coupler (100) that employs at least one optical fiber (10) is disclosed. The coupler includes a curved optical fiber guide channel (200) having a strong curve. The optical fiber(s) held within the optical fiber guide channel have a bend corresponding to the guide channel curve. The fiber end portions are optionally disposed within a straight fiber guide (160) at a coupler input/output end, which is preferably configured to have a standard connector geometry. Use of nanostructured fibers for the at least one optical fiber allows for strong bends having tight radii of curvature without imparting significant attenuation. Coupler assemblies that include the coupler optically coupled to at least one opto-electronic device (310) are also disclosed.

Abstract: A bent optical fiber coupler (100) that employs at least one optical fiber (10) is disclosed. The coupler includes a curved optical fiber guide channel (200) having a strong curve. The optical fiber(s) held within the optical fiber guide channel have a bend corresponding to the guide channel curve. The fiber end portions are optionally disposed within a straight fiber guide (160) at a coupler input/output end, which is preferably configured to have a standard connector geometry. Use of nanostructured fibers for the at least one optical fiber allows for strong bends having tight radii of curvature without imparting significant attenuation. Coupler assemblies that include the coupler optically coupled to at least one opto-electronic device (310) are also disclosed.

Abstract: Glass-based micropositioning systems and methods are disclosed. The micropositioning systems and methods utilize microbumps (40) formed in a glass substrate (12 or 100). The microbumps are formed by subjecting a portion of the glass substrate to localized heating, which results in local rapid expansion of glass where the heat was applied. The height and shape of the microbumps depend on the type of glass substrate and the amount and form of heat delivered to the substrate. The microbumps allow for active or passive micropositioning of optical elements, including planar waveguides and optical fibers. Optical assemblies formed using microbump micropositioners are also disclosed.

Abstract: The present invention is directed to a protection switch for use in a node of a two-fiber optical shared protection ring. The two-fiber optical shared protection ring propagates at least one bi-directional channel. Each bi-directional channel includes a working first wavelength signal and a working second wavelength signal. One fiber in the two-fiber optical channel shared protection ring propagates the working first wavelength signal in a first direction and the other fiber in the two-fiber optical channel shared protection ring propagating the working second wavelength signal in a second direction opposite the first direction. The switch includes an N×N optical switch fabric system disposed in the node. The N×N optical switch fabric includes 2N input/output (I/O) ports, wherein N is four, or an integer multiple of four. Each optical switch fabric is configured to switch at least one bi-directional channel. At least N three-port optical devices are coupled to N of the I/O ports.

Abstract: The present invention is directed to a protection switch for use in a node of a two-fiber optical shared protection ring. The two-fiber optical shared protection ring propagates at least one bi-directional channel. Each bi-directional channel includes a working first wavelength signal and a working second wavelength signal. One fiber in the two-fiber optical channel shared protection ring propagates the working first wavelength signal in a first direction and the other fiber in the two-fiber optical channel shared protection ring propagating the working second wavelength signal in a second direction opposite the first direction. The switch includes an N×N optical switch fabric system disposed in the node. The N×N optical switch fabric includes 2N input/output (I/O) ports, wherein N is four, or an integer multiple of four. Each optical switch fabric is configured to switch at least one bi-directional channel. At least N three-port optical devices are coupled to N of the I/O ports.

Abstract: A distributed matrix switch comprises a number of collimators each comprising a ferrule and a GRIN lens. A partially reflective coating is provided at the GRIN lens surface to pass a portion of an incoming light beam and to reflect the remainder. If the reflected portion is conveyed by means of an optical path to another collimators of similar construction, selected percentages of an incoming beam may be distributed along two or more optical paths. A receiving channel is then moved to different positions for receiving the portion of the light that is passed by one of the collimators to accomplish switching.