Patents by Inventor Roee Barak

Roee Barak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12688142
    Abstract: A system and method of managing data communication over platform-level interconnect protocols may include receiving first and second requests from a source device, each optionally querying data from a destination device, encapsulating the requests as payload and tunnelling them as respective posted messages via a platform-level interconnect protocol. Embodiments may further include transmitting corresponding non-posted messages, triggered by the posted messages, obtaining queried data pertaining to the first request, and encapsulating the queried data as payload and tunnelling it to a sink device as a completion message associated with the second non-posted message. Embodiments may include a pro forma counter configured to increment upon transmission of each non-posted message and decrement upon reception of each completion message, thereby enabling retrieval of queried data while managing outstanding non-posted message limitations of the platform-level interconnect protocol.
    Type: Grant
    Filed: September 29, 2025
    Date of Patent: July 21, 2026
    Assignee: NEXT SILICON LTD.
    Inventors: Daniel Greenspan, Nemanja Kondic, Oren Nishry, Roee Barak