Abstract: Apparatus and methods are used to calibrate an array of individually controllable elements within a lithographic apparatus. A calibration unit can switch between a first state in which the modulated beam of radiation passes into a projection system for projecting the modulated beam of radiation onto a substrate and a second state in which a portion of the modulated beam of radiation is inspected by the calibration unit. The calibration unit generates calibration data, or alternatively, updates calibration data, based on the inspection of the modulated beam of radiation. An array controller uses the calibration data to provide control signals to elements of an array of individually controllable elements, which are subsequently configured in response to the control signals.

Abstract: A method of reducing contamination generated by a hydrogen radical generator and deposited on an optical element of a lithographic apparatus includes passing molecular hydrogen over a first part of a metal filament of the hydrogen radical generator, the first part including a metal-oxide, when the temperature of the first part of the metal filament is at a reduction temperature less than or equal to an evaporation temperature of the metal-oxide.

Abstract: A method for performing a tilted focus test includes the steps of providing a target object, providing a projection beam of radiation using a radiation source, providing a reflective device to introduce a projected projection beam of radiation onto the target portion, introducing a first projected projection beam of radiation onto the target object using the reflective device in a first orientation, using a tilting device for tilting the reflective device to a second orientation to provide a second projection beam with a tilt relative to said first projection beam, introducing a second projected projection beam of radiation onto the target object, and determining a lateral shift of the first and second projected projection beams on the target object and determining from said lateral shift a defocus of the target object with respect to the projected projection beam.

Abstract: Apparatus and methods are used to calibrate an array of individually controllable elements within a lithographic apparatus. A calibration unit can switch between a first state in which the modulated beam of radiation passes into a projection system for projecting the modulated beam of radiation onto a substrate and a second state in which a portion of the modulated beam of radiation is inspected by the calibration unit. The calibration unit generates calibration data, or alternatively, updates calibration data, based on the inspection of the modulated beam of radiation. An array controller uses the calibration data to provide control signals to elements of an array of individually controllable elements, which are subsequently configured in response to the control signals.

Abstract: The present invention relates to an exposure apparatus that includes an illumination system for providing a projection beam of radiation, a support structure for supporting a device provided with a pattern, the device serving to impart the projection beam with a pattern in its cross-section; a table for holding a target object, a projection system for projecting the patterned beam onto the target object and a tilting device for providing the projection beam with a tilt. The tilting device is provided substantially in a pupil plane of the projection system.

Abstract: A lithographic apparatus includes a measurement system including at least one optical component and at least one electrical component. The electrical component is configured to dissipate heat. The optical component is mounted on a first frame of the apparatus, and the electrical component is mounted on a second frame of the apparatus that is thermally and mechanically decoupled from the first frame. An optical coupling is provided between the first frame and the second frame.

Abstract: A lithographic projection apparatus according to an embodiment of the invention includes a measurement system configured to determine a position of a target portion of a substrate, using at least one among an optical sensing operation and an optical detecting operation. The position is determined via an optical path that includes at least one catoptrical system arranged to have an imaging function of at least one dioptrical element.

Abstract: According to one embodiment, a method of calibrating level sensors of at least two lithographic projection apparatus to correct machine to machine level sensor process dependency includes using a first lithographic projection apparatus to measure a first set of leveling data for a reference substrate and a second set of leveling data for a substrate processed according to a selected process, and using a second lithographic projection apparatus to measure a third set of leveling data for the reference substrate and a fourth set of leveling data for the processed substrate. The method also includes calculating, based on the first, second, third and fourth sets of leveling data, a set of level sensor parameters corresponding to machine to machine level sensor differences for the selected process, wherein the machine to machine level sensor differences are measured and stored as intrafield values.

Abstract: A lithographic projection apparatus according to an embodiment of the invention includes a measurement system configured to determine a position of a target portion of a substrate, using at least one among an optical sensing operation and an optical detecting operation. The position is determined via an optical path that includes at least one catoptrical system arranged to have an imaging function of at least one dioptrical element.