Abstract: Methods and devices for a wide-swing cascode current mirror with low headroom voltage and high output impedance are presented. An input leg of the current mirror includes a composite transistor in series connection with an intrinsic transistor. The composite transistor includes two series-connected regular transistors with respective sizes that are twice the size of the intrinsic transistor. An output leg of the current mirror includes a regular transistor in series connection with an intrinsic transistor. A gate voltage of the composite transistor, provided at a node that is common to gates of the two series-connected regular transistors, self-establishes when a reference current flows through the input leg. The self-established gate voltage is used to bias the regular transistor of the output leg. Biasing voltages to gates of the intrinsic transistors is provided by an intermediate node that provides the series connection of the regular transistors of the composite transistor.

Abstract: In one example in accordance with the present disclosure, a fluidic die is described. The fluidic die includes a substrate and fluid actuators, the fluid actuators being disposed on the substrate. The fluidic die also includes a bond pad region defined on the substrate. The bond pad region includes a high aspect ratio power delivery bond pad with multiple bonding sites and a high aspect ratio power return bond pad with multiple bonding sites.

Abstract: In some examples, a fluidic die includes fluidic actuators, switches, and electrically conductive lines in an electrically conductive layer of the fluidic die. The electrically conductive lines electrically connect the switches to respective actuators. A first dimension of a first electrically conductive line is different from a second dimension of a second electrically conductive line to match a first resistance of the first electrically conductive line having a first length to a second resistance of the second electrically conductive line having a second length different from the first length.

Abstract: Examples include a fluidic die. The fluidic die comprises an array of field effect transistors including field effect transistors of a first size and field effect transistors of a second size. At least one connecting member interconnects at least some of the field effect transistors of the array of field effect transistors. The fluidic die further comprises a first fluid actuator connected to a first set of field effect transistors having at least one field effect transistor of the first size. The die includes a second fluid actuator connected to a second respective set of field effect transistors having a first respective field effect transistor of the second size interconnected to at least one other field effect transistor of the array.

Abstract: A fluidic die includes fluid-transfer elements, and a temperature sensor to monitor a temperature on the fluidic die. The fluidic die includes a trickle-warming circuit to warm fluid transferrable by the fluid-transfer elements, and a pulse-warming circuit to warm the fluid. A warming control circuit selectively activates the trickle-warming and pulse-warming circuits.

Abstract: In various examples, a fluid ejection device may include a substrate with a fluid feed hole and a corrosion-detecting conductive path or sensor disposed behind a wall of the fluid feed hold. The corrosion-detecting conductive path or sensor may close a circuit in response being exposed to a fluid contained within the fluid feed hole.

Abstract: Examples include a fluidic die. The fluidic die comprises an array of field effect transistors. Connecting members electrically connect at least some of the field effect transistors of the array of field effect transistors, and the field effect transistors of the array are arranged into respective sets of field effect transistors. The fluidic die further comprises a first fluid actuator connected to a first set of field effect transistors having a first number of field effect transistors. The die includes a second fluid actuator connected to a second respective set of field effect transistors having a second number of field effect transistors that is different than the first number of field effect transistors.

Abstract: According to examples, an apparatus may include fluid chambers that each includes a fluid actuator and an electrode. The fluid actuators may operate at a first voltage level and a monitoring circuitry may operate at a second voltage level that is lower than the first voltage level. The monitoring circuitry may monitor a condition of each fluid chamber based on a selection signal for selecting an electrode associated with a fluid chamber. The monitoring circuitry including an analog multiplexer that includes, for each of the electrodes for the plurality of fluid chambers, a level shifter to receive the selection signal at the second voltage level and to shift a level of the selection signal. The analog multiplexer may also include an analog pass gate to selectively couple the electrode of a respective fluid chamber to the monitoring circuitry based on the level shifted selection signal.

Abstract: In one example in accordance with the present disclosure, a fluidic die is described. The fluidic die includes a substrate and fluid actuators, the fluid actuators being disposed on the substrate. The fluidic die also includes a bond pad region defined on the substrate. The bond pad region includes a high aspect ratio power delivery bond pad with multiple bonding sites and a high aspect ratio power return bond pad with multiple bonding sites.

Abstract: In one example, a warming system for a region of multiple ejector elements on an inkjet printhead includes a warming circuit having a heating element distinct from any of the ejector elements and a controller programmed to selectively energize the heating element only upon determining none of the ejector elements in the region is active.

Abstract: A logic circuitry package for a replaceable print apparatus component comprises at least one logic circuit and an interface to communicate with a print apparatus logic circuit. The at least one logic circuit is configured to receive, via the interface, calibration parameters including an offset parameter and a sensor ID. The at least one logic circuit is configured to output, via the interface, a digital value corresponding to the sensor ID and offset based on the offset parameter.

Abstract: A thermal jet printhead die includes thermal zones. For each thermal zone, the printhead die includes a pair of relative size-scaled temperature sensors to differentially sense a temperature of the thermal zone. A scaling factor between the pair of relative size-scaled temperature sensors for each thermal zone is matched across the thermal zones.

Abstract: A fluidic die including fluid chambers, each including an electrode exposed to an interior of the fluid chamber and each having a corresponding fluid actuator operating at a first voltage level. Monitoring circuitry, operating at a second voltage level lower than the first voltage level, includes a select transistor and a pulldown transistor for each fluid chamber to selectively couple to the electrode, at least the select transistor being a high voltage tolerant transistor to operate at the second voltage in a normal operating condition and having a breakdown voltage level greater than the first voltage level to prevent a fault current from flowing into the select transistor from the electrode in a fault condition if the fluid actuator short-circuits to the electrode.

Abstract: In example implementations, an apparatus is provided. The apparatus includes a first low voltage control block, a second low voltage control block, a primitive level shifter coupled to the first low voltage control block, a plurality of nozzle level shifters coupled to the primitive level shifter and a second low voltage control block, and a high side switch (HSS) control coupled to each one of the plurality of nozzle level shifters and the second low voltage control block. The plurality of nozzle level shifters are communicatively coupled to each other. The primitive shifter is to enable a selected nozzle level shifter to fire a respective HSS control circuit of the selected nozzle level shifter and to direct a tail current from the selected nozzle level shifter.

Abstract: In example implementations, an apparatus is provided. The apparatus includes a power supply, a first switch coupled, a second switch, and a second resistor. The first switch is coupled to the power supply and a low voltage control block. The second switch is coupled to the power supply and the first switch. The second resistor is coupled to the second switch to generate heat in response to being energized. The first switch is to control activation of the second switch via a fire signal from the low voltage control block and through the first resistor to energize the second resistor and cause a nozzle chamber to dispense a printing fluid.

Abstract: In example implementations, an apparatus is provided. The apparatus includes a power supply, a first switch coupled to the power supply, a second switch coupled to the first switch, a third switch coupled to the power supply, the first switch, and the second switch, and a resistor coupled to the third switch. The first switch is to be controlled via a high voltage logic. The second switch is to be controlled via a low voltage logic. The resistor is to generate heat when energized. The first switch and the second switch are to control activation of the third switch to energize the resistor and cause a nozzle chamber to dispense a printing fluid.

Abstract: In various examples, a fluid ejection device may include a substrate with a fluid feed hole and a corrosion-detecting conductive path or sensor disposed behind a wall of the fluid feed hold. The corrosion-detecting conductive path or sensor may close a circuit in response being exposed to a fluid contained within the fluid feed hole.

Abstract: Example implementations relate to current leakage testing of a fluid ejection die. For example, a fluid ejection die may include plurality of nozzles, each nozzle among the plurality of nozzles including a nozzle sensor and a fluid ejector. The plurality of nozzle sensors may comprise a first subset and a second subset, each nozzle sensor among the plurality of nozzle sensors of the first subset may be electrically coupled to a first control line by a respective switch among a first group of switches, and each nozzle sensor among the plurality of nozzle sensors of the second subset may be electrically coupled to a second control line by a respective switch among a second group of switches. The fluid ejection die may include a control circuit to perform a current leakage test of the plurality of nozzles using the first control line and the second control line.

Abstract: Examples of a fluidic die for temperature sensing are described herein. In some examples, a fluidic die may include a plurality of thermal sense modules. In some examples, each of the thermal sense modules includes a diode connected between a first switch and a second switch. In some examples, the fluidic die includes a differential amplifier to output a temperature voltage signal. In some examples, a first input of the differential amplifier is connected to the first switch of each of the thermal sense modules and a second input of the differential amplifier is connected to the second switch of each of the thermal sense modules.

Abstract: Examples of a fluidic die for temperature sensing are described herein. In some examples, the fluidic die includes a plurality of resistor segments connected in series. In some examples, the fluidic die may include a plurality of first switches connected to a first side of each of the plurality of resistor segments. In some examples, the fluidic die includes a plurality of second switches connected to a second side of each of the plurality of resistor segments. In some examples, the fluidic die includes a differential amplifier to output a temperature voltage signal, where a first input of the differential amplifier is each of the first switches, and where a second input of the differential amplifier is connected each of the plurality of second switches.