Patents by Inventor Rogelio Real

Rogelio Real has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Leadless packages and method of manufacturing same
    Patent number: 9012268
    Abstract: Embodiments of the present disclosure are directed to leadframe strips and methods of forming packages that include first separating adjacent leads of a leadframe strip and subsequently singulating components into individual packages. In one embodiment, the adjacent leads are separated by etching through the leads, thereby providing electrical isolation of the adjacent packages. In that regard, if desired, the individual adjacent packages may be electrically tested in leadframe strip form. Subsequently, the individual packages are formed by sawing through the encapsulation material.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: April 21, 2015
    Assignee: STMicroelectronics, Inc.
    Inventors: Jonathan Jaurigue, Rogelio Real, Francis Ann Llana, Ricky Calustre, Rodolfo Gacusan
  • LEADFRAME PACKAGE WITH WETTABLE SIDES AND METHOD OF MANUFACTURING SAME
    Publication number: 20150076675
    Abstract: Embodiments of the present disclosure are directed to leadframe packages with wettable sides and methods of manufacturing same. In one embodiment, the leads of the leadframe packages have recesses with a curved profile formed therein. The recesses are plated with a solder wettable layer of conductive material that enables solder to flow along the surface during surface mounting of the package to a board, such as a PCB.
    Type: Application
    Filed: September 16, 2013
    Publication date: March 19, 2015
    Applicant: STMicroelectronics, Inc.
    Inventors: Rogelio Real, William Cabreros
  • LEADLESS PACKAGES AND METHOD OF MANUFACTURING SAME
    Publication number: 20150001698
    Abstract: Embodiments of the present disclosure are directed to leadframe strips and methods of forming packages that include first separating adjacent leads of a leadframe strip and subsequently singulating components into individual packages. In one embodiment, the adjacent leads are separated by etching through the leads, thereby providing electrical isolation of the adjacent packages. In that regard, if desired, the individual adjacent packages may be electrically tested in leadframe strip form. Subsequently, the individual packages are formed by sawing through the encapsulation material.
    Type: Application
    Filed: June 28, 2013
    Publication date: January 1, 2015
    Inventors: Jonathan Jaurigue, Rogelio Real, Francis Ann Llana, Ricky Calustre, Rodolfo Gacusan