Patents by Inventor Rogelio Ruiz

Rogelio Ruiz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Downward-facing optical component module
    Patent number: 8804368
    Abstract: A motherboard for an electronic device comprising a main printed circuit board (PCB) with a through-hole extending between the upper component surface and the lower surface. The motherboard includes a carrier PCB having a top surface and a bottom surface, and at least one component, e.g. an optical device, sensor, or the like, coupled to the top surface. The carrier PCB is mounted in an in an inverted orientation with respect to the main PCB such that the top surface of the carrier PCB faces the upper component surface of the main PCB. The carrier PCB is aligned with the main PCB such that the component is substantially aligned with the through hole of the main PCB and is visible from the lower surface of the PCB.
    Type: Grant
    Filed: April 30, 2009
    Date of Patent: August 12, 2014
    Assignees: Sony Corporation, Sony Electronics Inc.
    Inventors: Yoshinari Matsuda, Ramon Osuma, Ivan Cazarez, Rogelio Ruiz
  • Surface mount device jumper and surface mount device jumper assembly
    Patent number: 8087953
    Abstract: A surface mount device jumper includes a base member and an electrode member. The base member is fabricated from a resin laminate. The electrode member is fabricated from an electrically-conductive material and is formed in a generally C-shaped configuration to define an opening therethrough. The opening is sized to receive the base member such that the electrode member partially wraps around and clamps to the base member to retain the base member in the opening.
    Type: Grant
    Filed: April 1, 2008
    Date of Patent: January 3, 2012
    Assignees: Sony Corporation, Sony Electronics Inc.
    Inventors: Yoshinari Matsuda, Rogelio Ruiz
  • DOWNWARD-FACING OPTICAL COMPONENT MODULE
    Publication number: 20100277883
    Abstract: A motherboard for an electronic device comprising a main printed circuit board (PCB) with a through-hole extending between the upper component surface and the lower surface. The motherboard includes a carrier PCB having a top surface and a bottom surface, and at least one component, e.g. an optical device, sensor, or the like, coupled to the top surface. The carrier PCB is mounted in an in an inverted orientation with respect to the main PCB such that the top surface of the carrier PCB faces the upper component surface of the main PCB. The carrier PCB is aligned with the main PCB such that the component is substantially aligned with the through hole of the main PCB and is visible from the lower surface of the PCB.
    Type: Application
    Filed: April 30, 2009
    Publication date: November 4, 2010
    Inventors: Yoshinari Matsuda, Ramon Osuna, Ivan Cazarez, Rogelio Ruiz
  • Surface mount device jumper and surface mount device jumper assembly
    Publication number: 20090242237
    Abstract: A surface mount device jumper includes a base member and an electrode member. The base member is fabricated from a resin laminate. The electrode member is fabricated from an electrically-conductive material and is formed in a generally C-shaped configuration to define an opening therethrough. The opening is sized to receive the base member such that the electrode member partially wraps around and clamps to the base member to retain the base member in the opening.
    Type: Application
    Filed: April 1, 2008
    Publication date: October 1, 2009
    Applicants: SONY CORPORATION, SONY ELECTRONICS, INC.
    Inventors: Yoshinari Matsuda, Rogelio Ruiz