Patents by Inventor Roger A. Liptak

Roger A. Liptak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Achieving mechanical and thermal stability in a multi-chip package
    Patent number: 8421217
    Abstract: A system and method system for achieving mechanical and thermal stability in a multi-chip package. The system utilizes a lid and multiple thermal interface materials. The method includes utilizing a lid on a multi-chip package and utilizing multiple thermal interface materials on the multi-chip package.
    Type: Grant
    Filed: March 14, 2012
    Date of Patent: April 16, 2013
    Assignee: International Business Machines Corporation
    Inventors: Jon A. Casey, John S. Corbin, Jr., David Danovitch, Isabelle Depatie, Virendra R. Jadhav, Roger A. Liptak, Kenneth C. Marston, Jennifer V. Muncy, Sylvain Ouimet, Eric Salvas
  • SYSTEM AND METHOD OF ACHIEVING MECHANICAL AND THERMAL STABILITY IN A MULTI-CHIP PACKAGE
    Publication number: 20120175766
    Abstract: A system and method system for achieving mechanical and thermal stability in a multi-chip package. The system utilizes a lid and multiple thermal interface materials. The method includes utilizing a lid on a multi-chip package and utilizing multiple thermal interface materials on the multi-chip package.
    Type: Application
    Filed: March 14, 2012
    Publication date: July 12, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jon A. Casey, John S. Corbin, JR., David Danovitch, Isabelle Dépatie, Virendra R. Jadhav, Roger A. Liptak, Kenneth C. Marston, Jennifer V. Muncy, Sylvain Ouimet, Eric Salvas
  • Achieving mechanical and thermal stability in a multi-chip package
    Patent number: 8202765
    Abstract: A system and method system for achieving mechanical and thermal stability in a multi-chip package. The system utilizes a lid and multiple thermal interface materials. The method includes utilizing a lid on a multi-chip package and utilizing multiple thermal interface materials on the multi-chip package.
    Type: Grant
    Filed: January 22, 2009
    Date of Patent: June 19, 2012
    Assignee: International Business Machines Corporation
    Inventors: Jon A. Casey, John S. Corbin, Jr., David Danovitch, Isabelle Depatie, Virendra R. Jadhav, Roger A. Liptak, Kenneth C. Marston, Jennifer V. Muncy, Sylvain Ouimet, Eric Salvas
  • System and Method of Achieving Mechanical and Thermal Stability in a Multi-Chip Package
    Publication number: 20100181665
    Abstract: A system and method system for achieving mechanical and thermal stability in a multi-chip package. The system utilizes a lid and multiple thermal interface materials. The method includes utilizing a lid on a multi-chip package and utilizing multiple thermal interface materials on the multi-chip package.
    Type: Application
    Filed: January 22, 2009
    Publication date: July 22, 2010
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jon A. CASEY, John S. CORBIN, JR., David DANOVITCH, Isabelle DEPATIE, Virendra R. JADHAV, Roger A. LIPTAK, Kenneth C. MARSTON, Jennifer V. MUNCY, Sylvain OUIMET, Eric SALVAS