Patents by Inventor Roger A. McKay

Roger A. McKay has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Island etched filter passages
    Patent number: 10086317
    Abstract: A method comprises forming etching islands on a substrate and exposing the substrate with etching islands to a solution that reacts with the etching islands to form a filter passage of interconnected pores in the substrate. The filter passage has an inlet into the substrate and an outlet from the substrate.
    Type: Grant
    Filed: October 30, 2013
    Date of Patent: October 2, 2018
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Roger A. McKay, Patrick W. Sadik
  • Substrate etch
    Patent number: 9988263
    Abstract: An example provides a method including sputtering a metal catalyst onto a substrate, exposing the substrate to a solution that reacts with the metal catalyst to form a plurality of pores in the substrate, and etching the substrate to remove the plurality of pores to form a recess in the substrate.
    Type: Grant
    Filed: August 30, 2013
    Date of Patent: June 5, 2018
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Patrick Wayne Sadik, Roger A. McKay
  • Nonparallel island etching
    Patent number: 9938139
    Abstract: Etching islands are formed on a first face of a substrate and a second face of the substrate non-parallel to the first face. The first face and the second face of the substrate are concurrently exposed to a solution that reacts with the etching islands to concurrently form porous regions extending into the first face and the second face.
    Type: Grant
    Filed: October 30, 2013
    Date of Patent: April 10, 2018
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Roger A. McKay, Patrick W. Sadik
  • Substrate etch
    Patent number: 9695515
    Abstract: An example provides a method including providing a substrate including an area having a plurality of pores and etching the area of the substrate to remove the plurality of pores to form a recess in the substrate. In some examples, the recess may form, at least in part, a device.
    Type: Grant
    Filed: August 30, 2013
    Date of Patent: July 4, 2017
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Roger A. McKay, Jr., Patrick Sadik
  • ISLAND ETCHED FILTER PASSAGES
    Publication number: 20160346714
    Abstract: A method comprises forming etching islands on a substrate and exposing the substrate with etching islands to a solution that reacts with the etching islands to form a filter passage of interconnected pores in the substrate. The filter passage has an inlet into the substrate and an outlet from the substrate.
    Type: Application
    Filed: October 30, 2013
    Publication date: December 1, 2016
    Inventor: Roger A. McKay
  • NONPARALLEL ISLAND ETCHING
    Publication number: 20160244885
    Abstract: Etching islands are formed on a first face of a substrate and a second face of the substrate non-parallel to the first face. The first face and the second face of the substrate are concurrently exposed to a solution that reacts with the etching islands to concurrently form porous regions extending into the first face and the second face.
    Type: Application
    Filed: October 30, 2013
    Publication date: August 25, 2016
    Inventors: Roger A. McKay, Patrick W. Sadik
  • Substrate Etch
    Publication number: 20160208394
    Abstract: An example provides a method including providing a substrate including an area having a plurality of pores and etching the area of the substrate to remove the plurality of pores to form a recess in the substrate. In some examples, the recess may form, at least in part, a device.
    Type: Application
    Filed: August 30, 2013
    Publication date: July 21, 2016
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Roger A. McKay Jr, Patrick Sadik
  • Substrate Etch
    Publication number: 20160208404
    Abstract: An example provides a method including sputtering a metal catalyst onto a substrate, exposing the substrate to a solution that reacts with the metal catalyst to form a plurality of pores in the substrate, and etching the substrate to remove the plurality of pores to form a recess in the substrate.
    Type: Application
    Filed: August 30, 2013
    Publication date: July 21, 2016
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Patrick Wayne Sadik, Roger A. McKay Jr
  • Substrate Etch
    Publication number: 20160200568
    Abstract: An example provides a method including sputtering a metal catalyst onto a substrate, exposing the substrate to a solution that reacts with the metal catalyst to form a plurality of pores in the substrate, and etching the substrate to remove the plurality of pores to form a recess in the substrate.
    Type: Application
    Filed: August 30, 2013
    Publication date: July 14, 2016
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Patrick Wayne Sadik, Roger A. McKay