Abstract: An improved system and apparatus is provided for cooling the energy source used in powering various types of semiconductor processing devices. The improved cooling system uses a solenoid valve which is electrically controlled by the processing equipment during times in which the energy source is on, or during times in which the user manually or automatically programs valve activation. The solenoid valve can be easily and readily retrofitted to any pre-existing processing device which uses an energy source and which can be electrically activated by the processing device or a user interface panel. An activated solenoid valve allows coolant to flow through the energy source in order to maintain optimal performing temperature of the energy source. An inactive valve will reroute coolant away from the energy source to ensure longevity of the system and to minimize condensation upon the energy source electrical components.

Abstract: An improved machine for performing a manufacturing process on a workpiece. The machine includes a cabinet defining an interior workspace for performing the manufacturing process. The workpiece is placed in the workspace by an operator. The cabinet is coupled with a gas source for receiving a flow of gas from the gas source. The improvement comprises a first aperture in the cabinet providing access to an interior chamber within the cabinet. The interior chamber has an interior surface and an open end aligned with the first aperture for storing a work-in-process unit. The interior chamber is accessible to the operator for transferring the work-in-process unit between the interior chamber and the workspace. The improvement further comprises a second aperture in the interior surface of the interior chamber, the second aperture admitting the flow of gas from the gas source to establish a laminar flow of the gas in the chamber intermediate the first aperture and the second aperture.

Abstract: A high precision electrode position controller is provided for use in a semiconductor etching device. The electrode position controller, system, and method of use can accurately and repeatedly position a dry etch electrode within the etch chamber without having to open the chamber and manually move the electrode. Moreover, the actual gap between electrodes can be calibrated each time the etching device is turned on. Frequent calibration of actual electrode position ensures the electrodes are positioned parallel to each other and at an optimal distance therebetween. Accurate positioning of the electrodes provides a more precise etch rate and a more uniform etch across the wafer surface. By repositioning the electrodes and maintaining parallelism, varying types of material can be accurately etched.

Abstract: A clip for removably securing a semi-conductor wafer to the treatment surface of a semi-conductor wafer processing pedestal. The clip is constructed with a pair of spaced apart, forwardly extending tines adapted to engage outer edges of a semi-conductor wafer supported upon the treatment surface. A clip tail is oppositely disposed from the tines and affords resilient movement of the tines toward and away from the edges of the pedestal treatment surface to enable the installation and removal of the wafer therefrom.

Abstract: A clip for removably securing a semi-conductor wafer to the treatment surface of a semi-conductor wafer processing pedestal. The clip is constructed with a pair of spaced apart, forwardly extending tines adapted to engage outer edges of a semi-conductor wafer supported upon the treatment surface. A clip tail is oppositely disposed from the tines and affords resilient movement of the tines toward and away from the edges of the pedestal treatment surface to enable the installation and removal of the wafer therefrom.