Patents by Inventor Roger Alan Emigh

Roger Alan Emigh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sputtering target with ultra-fine, oriented grains and method of making same
    Patent number: 5809393
    Abstract: A sputtering target comprising a body of metal such as aluminum and its alloy with an ultrafine grain size and small second phase. Also described is a method for making an ultra-fine grain sputtering target comprising melting, atomizing, and depositing atomized metal to form a workpiece, and fabricating the workpiece to form a sputtering target. A method is also disclosed that includes the steps of extruding a workpiece through a die having contiguous, transverse inlet and outlet channels of substantially identical cross section, and fabricating the extruded article into a sputtering target. The extrusion may be performed several times, producing grain size of still smaller size and controlled grain texture.
    Type: Grant
    Filed: October 30, 1995
    Date of Patent: September 15, 1998
    Assignee: Johnson Matthey Electronics, Inc.
    Inventors: John Alden Dunlop, Jun Yuan, Janine Kiyabu Kardokus, Roger Alan Emigh
  • Sputtering target with ultra-fine, oriented grains and method of making same
    Patent number: 5780755
    Abstract: A sputtering target comprising a body of metal such as aluminum and its alloy with an ultrafine grain size and small second phase. Also described is a method for making an ultra-fine grain sputtering target comprising melting, atomizing, and depositing atomized metal to form a workpiece, and fabricating the workpiece to form a sputtering target. A method is also disclosed that includes the steps of extruding a workpiece through a die having contiguous, transverse inlet and outlet channels of substantially identical cross section, and fabricating the extruded article into a sputtering target. The extrusion may be performed several times, producing grain size of still smaller size and controlled grain texture.
    Type: Grant
    Filed: October 30, 1995
    Date of Patent: July 14, 1998
    Assignee: Johnson Matthey Electronics, Inc.
    Inventors: John Alden Dunlop, Jun Yuan, Janine Kiyabu Kardokus, Roger Alan Emigh
  • Metal sputtering target assembly
    Patent number: 5687600
    Abstract: Described is a method of manufacturing a sputtering target or backing plate for a sputtering target that minimizes metal waste and reduces manufacturing steps. The target or backing plate is made from a substantially circular metal blank by progressively deforming circumferential bands until the blank is in the shape of a sputtering target or backing plate. The target and backing plate so produced are also described.
    Type: Grant
    Filed: August 1, 1996
    Date of Patent: November 18, 1997
    Assignee: Johnson Matthey Electronics, Inc.
    Inventors: Roger Alan Emigh, William Bryce Willett