Abstract: An autocatalytic gold bath capable of depositing gold from solution onto a substrate, wherein the substrate has one or more metal layers thereon. The autocatalytic gold bath includes (a) a chelator; (b) a gold salt; and (c) a reducing agent, wherein the reducing agent comprises an organic molecule having more than one carbon atom on the organic molecule. A process of plating gold onto the surface of the one or more metal layers on the substrate is also included. The gold plating bath can be used to deposit a final finish to the surface of the one or more metal layers which can be formed in an ENIG, ENEPIG, EPAG, direct gold over copper or gold over silver process.

Abstract: A wireless proximity detection system employs short-range wireless communication to detect the proximity of a user device within a strictly defined wireless zone and as a result trigger a desired action. The proximity detection system may utilize one or more leaky feeders to define the wireless zone and the associated received signal strength(s) detected by the user's wireless device. Alternatively, a compact planar antenna structure coupled with a highly shielded radio transceiver is used to allow a similar precise low-power radio beam to be emitted defining a small location to enable identification of a wireless device such as a smartphone in a given area in front of the device. The planar antenna structure allows a compact and low-cost fabrication method and the use of common printed circuit fabrication methods provide an integrated solution.

Abstract: An electroless copper deposition composition, comprising: (a) a source of copper ions; (b) a chelator; (c) a source of alkalinity; (d) a reducing agent; (e) nickel ions; (f) a bipyridine; (g) optionally, an additional stabilizer; and (h) optionally, a water soluble polymer. The electroless copper deposition composition can be used to deposit a ductile copper deposit on a substrate that exhibits high % elongation and high tensile strength.

Abstract: An autocatalytic gold bath capable of depositing gold from solution onto a substrate, wherein the substrate has one or more metal layers thereon. The autocatalytic gold bath includes (a) a chelator; (b) a gold salt; and (c) a reducing agent, wherein the reducing agent comprises an organic molecule having more than one carbon atom on the organic molecule. A process of plating gold onto the surface of the one or more metal layers on the substrate is also included. The gold plating bath can be used to deposit a final finish to the surface of the one or more metal layers which can be formed in an ENIG, ENEPIG, EPAG, direct gold over copper or gold over silver process.

Abstract: A method of preparing a non-conductive substrate to allow metal plating thereon. The method includes the steps of a) contacting the non-conductive substrate with a conditioner comprising a conditioning agent; b) applying a carbon-based dispersion to the conditioned substrate, wherein the carbon-based dispersion comprises carbon or graphite particles dispersed in a liquid solution; and c) etching the non-conductive substrate. The etching step is performed before the liquid carbon-based dispersion dries on the non-conductive substrate.

Abstract: A method of preparing a non-conductive substrate to allow metal plating thereon. The method includes the steps of a) contacting the non-conductive substrate with a conditioner comprising a conditioning agent; b) applying a carbon-based dispersion to the conditioned substrate, wherein the carbon-based dispersion comprises carbon or graphite particles dispersed in a liquid solution; and c) etching the non-conductive substrate. The etching step is performed before the liquid carbon-based dispersion dries on the non-conductive substrate.

Abstract: A modular observation assembly and method of use are presented herein. The assembly includes a portable base member that can roll along the ground. The base member defines an interior volume used for storage of various members and portions of the assembly. The assembly also includes an elevating platform in communication with the base member. The elevating platform operates between a lowered position and an elevated position. The assembly is stabilized by one or more jacks and a hitch attachment assembly configured to secure the base member to the neighboring vehicle.

Abstract: A method of preparing a non-conductive substrate to allow metal plating thereon. The method includes the steps of a) contacting the non-conductive substrate with a conditioner comprising a conditioning agent; b) applying a carbon-based dispersion to the conditioned substrate, wherein the carbon-based dispersion comprises carbon or graphite particles dispersed in a liquid solution; and c) etching the non-conductive substrate. The etching step is performed before the liquid carbon-based dispersion dries on the non-conductive substrate.

Abstract: A modular observation assembly and method of use are presented herein. The assembly includes a portable base member that can roll along the ground. The base member defines an interior volume used for storage of various members and portions of the assembly. The assembly also includes an elevating platform in communication with the base member. The elevating platform operates between a lowered position and an elevated position. The assembly is stabilized by one or more jacks and a hitch attachment assembly configured to secure the base member to the neighboring vehicle.

Abstract: The present technology generally relates to copper plating solutions. Specifically, the present technology includes a copper plating solution comprising a source of copper ions and a conductivity salt wherein the copper plating solution has a pH between 1.7 and 3.5 as is essentially free of chloride ions. The present technology also relates to a method of using such copper plating solutions.

Abstract: For use as or in connection with a set-top box, a digital TV broadcast signal is decoded by processing its audio stream into and read from a FIFO buffer. According to certain embodiments, fullness of the FIFO buffer is compared to a reference fullness, which can be updated based on changes to the bit rate of the audio stream. In response to the FIFO buffer fullness, the set top box regulates the rate at which the audio stream is decoded. The disclosed decoding methods do not need to rely on the accuracy or presence of a system time encoded into the broadcast signal.

Abstract: For use as or in connection with a set-top box, a digital TV broadcast signal is decoded by processing its audio stream into and read from a FIFO buffer. According to certain embodiments, fullness of the FIFO buffer is compared to a reference fullness, which can be updated based on changes to the bit rate of the audio stream. In response to the FIFO buffer fullness, the set top box regulates the rate at which the audio stream is decoded. The disclosed decoding methods do not need to rely on the accuracy or presence of a system time encoded into the broadcast signal.

Abstract: A disposable, spin-on fluid filter is constructed and arranged to mount onto a base that is configured with a threaded mounting shaft. The base provides a fluid inlet flow to the filter and a fluid exit path from the filter. The filter construction includes a housing canister having a closed end and an opposite, open end and a fluid filtering media positioned within the housing canister. A mounting post is formed as part of the closed first end of the housing canister. The mounting post is constructed and arranged for assembly to the threaded mounting shaft of the base. The design focuses on the elimination of any nutplate and on repositioning the location where the fluid filter is connected to the head to the closed end of the canister.

Abstract: The invention is directed to a method and composition for providing roughened copper surfaces suitable for subsequent multilayer lamination. A smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition consisting essentially of an oxidizer, a pH adjuster, a topography modifier, and a uniformity enhancer. A coating promoter may be used in place of the uniformity enhancer or in addition to the uniformity enhancer. The adhesion promoting composition does not require a surfactant. The process may further comprise the step of contacting the uniform roughened copper surface with a post-dip, wherein the post-dip comprises an azole or silane compound or a combination of said azole and said silane. The post-dip may further comprise, alone or in combination, a titanate, zirconate, and an aluminate. The pH adjuster is preferably sulfuric acid and the oxidizer is preferably hydrogen peroxide.

Abstract: A method of stripping nickel from a stainless steel substrate comprises providing a stainless steel substrate with a nickel deposit on a surface and contacting the nickel deposit with phosphate ions and an oxidizer. An aqueous solution comprises ammonium ions, phosphate ions and an oxidizing agent present in amounts effective to strip nickel from a stainless steel substrate. An aqueous solution comprises about 1% to about 10% by weight hydrogen peroxide and about 5% to about 30% by weight of an ammonium phosphate. A method of pre-treating a stainless steel substrate comprises providing a stainless steel substrate and contacting the stainless steel substrate with phosphate ions, and an oxidizer.

Abstract: A method of stripping nickel from a printed wiring board comprises providing a printed wiring board with a nickel deposit on a surface and contacting the nickel deposit with phosphate ions and an oxidizer. An aqueous solution comprises ammonium ions, phosphate ions and an oxidizing agent present in amounts effective to strip nickel. An aqueous solution comprises about 1% to about 10% by weight hydrogen peroxide and about 5% to about 30% by weight of an ammonium phosphate. A method of pre-treating a copper substrate comprises providing a printed wiring board having a copper substrate and contacting the copper substrate with phosphate ions, and an oxidizer. A method of neutralizing permanganate on a printed wiring board comprises providing a printed wiring board with a permanganate residue on the printed wiring board and contacting the permanganate residue with phosphate ions, and an oxidizer.

Abstract: The invention is directed to a solution and process for improving the solderability of a metal surface. In one embodiment, the invention is a silver deposit solution comprising an acid, a source of silver ions, and an additive selected from among pyrroles, triazoles, and tetrazoles, as well as derivatives and mixtures of those components. In another embodiment, the silver deposit solution also includes a 6-membered heterocyclic ring compound, wherein three members of the 6-membered heterocyclic ring are nitrogen atoms. Still another embodiment is a process for improving the solderability of a metal surface which involves applying a silver deposit solution as previously described to a metal surface.

Abstract: The invention is directed to a method and composition for providing roughened copper surfaces suitable for subsequent multilayer lamination. A smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition consisting essentially of an oxidizer, a pH adjuster, a topography modifier, and a uniformity enhancer. A coating promoter may be used in place of the uniformity enhancer or in addition to the uniformity enhancer. The adhesion promoting composition does not require a surfactant. The process may further comprise the step of contacting the uniform roughened copper surface with a post-dip, wherein the post-dip comprises an azole or silane compound or a combination of said azole and said silane. The post-dip may further comprise, alone or in combination, a titanate, zirconate, and an aluminate. The pH adjuster is preferably sulfuric acid and the oxidizer is preferably hydrogen peroxide.

Abstract: The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, a topography modifier, and a sulfur-containing coating stabilizer. In another embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, and a topography modifier. Then, in a subsequent step, the roughened copper surface is contacted with an acid resistance promoting composition.

Abstract: The invention is directed to a method and composition for providing roughened copper surfaces suitable for subsequent multilayer lamination. A smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition consisting essentially of an oxidizer, a pH adjuster, a topography modifier, and a uniformity enhancer. A coating promoter may be used in place of the uniformity enhancer or in addition to the uniformity enhancer. The adhesion promoting composition does not require a surfactant. The process may further comprise the step of contacting the uniform roughened copper surface with a post-dip, wherein the post-dip comprises an azole or silane compound or a combination of said azole and said silane. The post-dip may further comprise, alone or in combination, a titanate, zirconate, and an aluminate. The pH adjuster is preferably sulfuric acid and the oxidizer is preferably hydrogen peroxide.