Abstract: Methods and apparatus for processing a substrate are provided herein. For example, an apparatus for processing a substrate comprises a process chamber configured to process a substrate, a substrate support comprising a heat sink configured to cool the substrate support during operation and a water trap panel comprising a pumping ring configured to cool the water trap panel such that the water trap panel condenses water vapor molecules and drops a process chamber pressure during operation, and a chiller operably coupled to the substrate support and configured to supply a cooling fluid to the substrate support via a cooling fluid line that connects to the heat sink and the pumping ring via a serial configuration or a parallel configuration.

Abstract: A wafer handling system for a wafer processing apparatus includes a wafer load lock chamber, a wafer processing chamber and a transfer chamber operatively coupled to the wafer load lock chamber and the wafer processing chamber. The transfer chamber includes a wafer transfer mechanism comprising a transfer arm pivotably coupled to a portion of the transfer chamber which forms an axis. The transfer arm is operable to rotate about the axis to transfer a wafer between the wafer load lock chamber and the process chamber in a single axis wafer movement. The invention also includes a method of transferring a wafer to a wafer processing apparatus. The method includes loading a wafer into a wafer load lock chamber and rotating a transfer arm into the wafer load lock chamber to retrieve the wafer therein.

Abstract: A wafer handling system for a wafer processing apparatus includes a wafer load lock chamber, a wafer processing chamber and a transfer chamber operatively coupled to the wafer load lock chamber and the wafer processing chamber. The transfer chamber includes a wafer transfer mechanism comprising a transfer arm pivotably coupled to a portion of the transfer chamber which forms an axis. The transfer arm is operable to rotate about the axis to transfer a wafer between the wafer load lock chamber and the process chamber in a single axis wafer movement. The invention also includes a method of transferring a wafer to a wafer processing apparatus. The method includes loading a wafer into a wafer load lock chamber and rotating a transfer arm into the wafer load lock chamber to retrieve the wafer therein.

Abstract: A wafer processing apparatus includes a processing chamber having a top chamber portion and a bottom chamber portion, respectively. The apparatus further includes an annular ring valve associated with one of the top chamber portion and the bottom chamber portion which is operable to close the processing chamber for processing in a first position and open the processing chamber for access thereto in a second position. The ring valve, in the first position, provides a substantially uniform surface about an inner periphery of the closed processing chamber, and thereby facilitates uniform processing conditions. A method of accessing a wafer processing apparatus is also disclosed and includes moving an annular ring valve within a processing chamber between two positions.