Patents by Inventor Roger Chiu

Roger Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Leadless semiconductor package
    Patent number: 6400004
    Abstract: A leadless semiconductor package mainly comprises a semiconductor chip disposed on a die pad and electrically connected to a plurality of leads arranged around the die pad. There are a plurality of tie bars connected to the die pad. The lower surface of each lead has an indentation formed corresponding to one of the bottom edges of the package. The semiconductor chip, the leads and the tie bars are encapsulated in a package body wherein the lower surface of each lead is exposed from the bottom surface of the package except the indentation thereof.
    Type: Grant
    Filed: August 17, 2000
    Date of Patent: June 4, 2002
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Alex Fan, Daniel Chen, Rick Chiu, Jack Kuo, Roger Chiu, Jim Li