Abstract: A pin array is connectively disposed between a surface region of a heat sink and a surface region of an entity to be cooled. Cooling fluid flows between the heat sink's surface region and the entity's surface region, the fluid flowing adjacent each surface region and through the space occupied by the pins, the fluid thereby being agitated by the pins. Frequent inventive practice attributes the pins with supportability of the entity. The pins can be made to be thermally nonconductive, the heat transfer thus being primarily founded on thermally convective principles involving the cooling fluid, the invention thus being effective in the absence of significant heat conduction from the entity to the heat sink. Typical inventive practice prescribes that a given array is patterned in an orderly fashion, all pins therein are parallel and each pin therein has the same cross-sectional geometry; however, there can be disparity between or among pins in any or all such respects.