Patents by Inventor Roger D. Meredith

Roger D. Meredith has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Durable bond pad structure for electrical connection to extreme environment microelectronic integrated circuits
    Patent number: 10256202
    Abstract: A durable bond pad structure is described that facilitates highly durable electrical connections to semiconductor microelectronics chips (e.g., silicon carbide (SiC) chips) to enable prolonged operation over very extreme temperature ranges.
    Type: Grant
    Filed: January 25, 2018
    Date of Patent: April 9, 2019
    Assignee: The United States of America as Represented by the Administrator of National Aeronautics and Space Administration
    Inventors: David J. Spry, Dorothy Lukco, Philip G. Neudeck, Carl W. Chang, Liangyu Chen, Roger D. Meredith, Kelley M. Moses, Charles A. Blaha, Jose M. Gonzalez, Glenn M. Beheim, Kimala L. Laster