Patents by Inventor Roger D. Wellington

Roger D. Wellington has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrical contact with improved means for solder wicking and degassing
    Patent number: 4296993
    Abstract: An electrical contact adapted to be mounted in a plated-through hole and having means to improve solder wicking and degassing. A conical transitional surface between the bottom of the contact body and the solder tail is provided with a plurality of projecting ribs. When inserted in a plated-through hole, because the body is larger than the hole, the ribs rest on the rim of the hole and provide degassing paths between them. The contact may be mounted individually in electrical panel boards, or in arrays in insulators wherein the contacts receive the leads of dual-in-line packages or other electronic components.
    Type: Grant
    Filed: January 7, 1980
    Date of Patent: October 27, 1981
    Assignee: Augat Inc.
    Inventor: Roger D. Wellington
  • Electrical contact with improved means for solder wicking and degassing
    Patent number: 4236776
    Abstract: An electrical contact adapted to be mounted in a plated-through hole and having means to improve solder wicking and degassing. A conical transitional surface between the bottom of the contact body and the solder tail is provided with a plurality of projecting ribs. When inserted in a plated-through hole, because the body is larger than the hole, the ribs rest on the rim of the hole and provide degassing paths between them. The contact may be mounted individually in electrical panel boards, or in arrays in insulators wherein the contacts receive the leads of dual-in-line packages or other electronic components.
    Type: Grant
    Filed: August 24, 1978
    Date of Patent: December 2, 1980
    Assignee: Augat Inc.
    Inventor: Roger D. Wellington
  • Method for mounting socket contacts to dual-in-line package leads and for mounting the combination onto pre-drilled printed circuit boards
    Patent number: 3983623
    Abstract: A method for mounting socket contacts to the leads of electronic component packages having a dual-in-line configuration, and for one-step mounting of the pre-socketed packages to dual-in-line arrays of holes in a panel board. Dual-in-line packages (DIP) are fed to a processor where a plurality of socket contacts are separated into two parallel spaced rows and the leads of the DIP are inserted into the sockets. The thus pre-socketed DIP's are repackaged for further handling, to ultimately be assembled to a panel board wherein dual-in-line arrays of holes have been drilled. The ends of the socket contacts projecting from the back side of the board are normally wave soldered for permanent electrical connection, while the IC remains in position secured to the board by means of the socket contacts.
    Type: Grant
    Filed: June 30, 1975
    Date of Patent: October 5, 1976
    Assignee: Augat, Inc.
    Inventor: Roger D. Wellington