Patents by Inventor Roger Dickerhoof

Roger Dickerhoof has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mold assembly and method of molding a component
    Patent number: 11077590
    Abstract: A mold assembly includes a first upper portion, a second upper portion, and a base removably coupled to each other. A method of manufacturing an electrical connector with the mold assembly includes preheating a resin, mixing the resin with a hardener, preheating the mold assembly, injecting the resin hardener mixture into the mold assembly, and curing the resin hardener mixture.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: August 3, 2021
    Assignee: The United States of America, as represented by the Secretary of the Navy
    Inventors: David Bartlett, Elizabeth O'Neill, Robert Moser, Roger Dickerhoof, Carl Miller, Joshua Jeffers, Bryan Woosley, James Merryfield
  • MOLD ASSEMBLY AND METHOD OF MOLDING A COMPONENT
    Publication number: 20200108534
    Abstract: A mold assembly includes a first upper portion, a second upper portion, and a base removably coupled to each other. A method of manufacturing an electrical connector with the mold assembly includes preheating a resin, mixing the resin with a hardener, preheating the mold assembly, injecting the resin hardener mixture into the mold assembly, and curing the resin hardener mixture.
    Type: Application
    Filed: March 26, 2019
    Publication date: April 9, 2020
    Inventors: David Bartlett, Elizabeth O'Neill, Robert Moser, Roger Dickerhoof, Carl Miller, Joshua Jeffers, Bryan Woosley, James Merryfield
  • Mold assembly and method of molding a component
    Patent number: 10279519
    Abstract: A mold assembly includes a first upper portion, a second upper portion, and a base removably coupled to each other. A method of manufacturing an electrical connector with the mold assembly includes preheating a resin, mixing the resin with a hardener, preheating the mold assembly, injecting the resin hardener mixture into the mold assembly, and curing the resin hardener mixture.
    Type: Grant
    Filed: December 30, 2015
    Date of Patent: May 7, 2019
    Assignee: The United States of America, as represented by the Secretary of the Navy
    Inventors: David Bartlett, Elizabeth O'Neill, Robert Moser, Roger Dickerhoof, Carl Miller, Joshua Jeffers, Bryan Woosley, James Merryfield
  • MOLD ASSEMBLY AND METHOD OF MOLDING A COMPONENT
    Publication number: 20170190082
    Abstract: A mold assembly includes a first upper portion, a second upper portion, and a base removably coupled to each other. A method of manufacturing an electrical connector with the mold assembly includes preheating a resin, mixing the resin with a hardener, preheating the mold assembly, injecting the resin hardener mixture into the mold assembly, and curing the resin hardener mixture.
    Type: Application
    Filed: December 30, 2015
    Publication date: July 6, 2017
    Inventors: David Bartlett, Elizabeth O'Neill, Robert Moser, Roger Dickerhoof, Carl Miller, Joshua Jeffers, Bryan Woosley, James Merryfield