Abstract: The invention relates to sensor systems and related data manipulation methods and software and use thereof, for instance amongst others, in surveillance systems, e.g. fall detection, more in particular systems and methods for capturing data of a scene is provided, comprising a first sensor, providing a first data set; a second sensor, spatially arranged with respect to the first sensor in a predetermined arrangement, the second sensor providing a second data set; and data manipulation means using said first and/or second data set to support enhanced data computations on one or both of said data sets to generate said scene data.

Abstract: The invention relates to sensor systems and related data manipulation methods and software and use thereof, for instance amongst others, in surveillance systems, e.g. fall detection, more in particular systems and methods for capturing data of a scene is provided, comprising a first sensor, providing a first data set; a second sensor, spatially arranged with respect to the first sensor in a predetermined arrangement, the second sensor providing a second data set; and data manipulation means using said first and/or second data set to support enhanced data computations on one or both of said data sets to generate said scene data.

Abstract: Elements of a sensor system are encapsulated into a single package. The sensor elements are covered with a flexible gel coat and then inserted into a molding tool cavity. Each element may be individually coated with a gel blob, or all elements may by coated with a single gel blob. One or more retractable pins are incorporated into the molding tool and in their normal position are each in contact with the gel. A molding compound is injected into the cavity so as to encapsulate the device and gel coat. When the pins are extracted and the device ejected from the molding cavity, one or more passageways in the molding are left defined by the pins. The passageways expose the flexible gel covering the device elements to the atmosphere. For pressure sensitive elements, the gel, being flexible, transfers the local air pressure to the pressure sensitive element. For optical elements, the exposed gel is preferably removed to allow for the passage of radiation to and from the device elements.

Abstract: Elements of a sensor system are encapsulated into a single package. The sensor elements are covered with a flexible gel coat and then inserted into a molding tool cavity. Each element may be individually coated with a gel blob, or all elements may by coated with a single gel blob. One or more retractable pins are incorporated into the molding tool and in their normal position are each in contact with the gel. A molding compound is injected into the cavity so as to encapsulate the device and gel coat. When the pins are extracted and the device ejected from the molding cavity, one or more passageways in the molding are left defined by the pins. The passageways expose the flexible gel covering the device elements to the atmosphere. For pressure sensitive elements, the gel, being flexible, transfers the local air pressure to the pressure sensitive element. For optical elements, the exposed gel is preferably removed to allow for the passage of radiation to and from the device elements.

Abstract: Elements of a sensor system are encapsulated into a single package. The sensor elements are covered with a flexible gel coat and then inserted into a molding tool cavity. Each element may be individually coated with a gel blob, or all elements may by coated with a single gel blob. One or more retractable pins are incorporated into the molding tool and in their normal position are each in contact with the gel. A molding compound is injected into the cavity so as to encapsulate the device and gel coat. When the pins are extracted and the device ejected from the molding cavity, one or more passageways in the molding are left defined by the pins. The passageways expose the flexible gel covering the device elements to the atmosphere. For pressure sensitive elements, the gel, being flexible, transfers the local air pressure to the pressure sensitive element. For optical elements, the exposed gel is preferably removed to allow for the passage of radiation to and from the device elements.

Abstract: Elements of a sensor system are encapsulated into a single package. The sensor elements are covered with a flexible gel coat and then inserted into a molding tool cavity. Each element may be individually coated with a gel blob, or all elements may by coated with a single gel blob. One or more retractable pins are incorporated into the molding tool and in their normal position are each in contact with the gel. A molding compound is injected into the cavity so as to encapsulate the device and gel coat. When the pins are extracted and the device ejected from the molding cavity, one or more passageways in the molding are left defined by the pins. The passageways expose the flexible gel covering the device elements to the atmosphere. For pressure sensitive elements, the gel, being flexible, transfers the local air pressure to the pressure sensitive element. For optical elements, the exposed gel is preferably removed to allow for the passage of radiation to and from the device elements.

Abstract: A temperature control system includes an integrated circuit that combines magnetic sensitive elements and infra red sensors to detect user temperature settings and measure temperature, respectively. Integration of the various sensors results in a very cost-effective and reliable temperature control system suitable for consumer applications.

Abstract: An integrated circuit combines micro-machined elements, piezoelectric elements and signal processing components as part of a compensated oscillating gyroscopic sensor for angular motion detection. An oscillating mass is supported on a number of flexible beams micro-machined into an integrated circuit device, such as a silicon CMOS device. Several Piezo-electric elements, deposited on the beams, are provided to excite the mass and to measure the accelerations. Integrated in the device are electronic circuitry that initiates and maintains the oscillation and electronic circuitry that detects and measures the subsequent motion. Additional circuitry is also provided to eliminate the effects of quadrature oscillation and to determine the Coriolis acceleration and thus the magnitude of the external perturbing velocity.

Abstract: A self-calibrating infrared (IR) sensing device having the capability to measure the attenuation effects of surface contamination on the transmission window and to adjust the gain of the sensor accordingly so as to counter the attenuation. The IR sensing device includes an IR sensor mounted in a housing having an IR transparent window that allows IR radiation originating from outside the housing to be directed toward the sensor. The IR sensor includes a thermally isolated area of IR-absorbing material coupled to a temperature measuring unit. IR radiation impinging on the sensor is absorbed, thereby raising the temperature of the IR absorbing material. The temperature measuring unit measures the increase in temperature and generates a proportional electronic signal indicative of the temperature. The electronic signal is received and processed by a processor. An IR radiator is also included within the sensing device housing.

Abstract: A temperature control system includes an integrated circuit that combines magnetic sensitive elements and infra red sensors to detect user temperature settings and measure temperature, respectively. Integration of the various sensors results in a very cost-effective and reliable temperature control system suitable for consumer applications.

Abstract: A self-calibrating infrared (IR) sensing device having the capability to measure the attenuation effects of surface contamination on the transmission window and to adjust the gain of the sensor accordingly so as to counter the attenuation. The IR sensing device includes an IR sensor mounted in a housing having an IR transparent window that allows IR radiation originating from outside the housing to be directed toward the sensor. The IR sensor includes a thermally isolated area of IR-absorbing material coupled to a temperature measuring unit. IR radiation impinging on the sensor is absorbed, thereby raising the temperature of the IR absorbing material. The temperature measuring unit measures the increase in temperature and generates a proportional electronic signal indicative of the temperature. The electronic signal is received and processed by a processor. An IR radiator is also included within the sensing device housing.

Abstract: A temperature control system includes an integrated circuit that combines magnetic sensitive elements and infrared sensors to detect user temperature settings and measure temperature, respectively. Integration of the various sensors results in a very cost-effective and reliable temperature control system suitable for consumer applications.

Abstract: A self-calibrating infrared (IR) sensing device having the capability to measure the attenuation effects of surface contamination on the transmission window and to adjust the gain of the sensor accordingly so as to counter the attenuation. The IR sensing device includes an IR sensor mounted in a housing having an IR transparent window that allows IR radiation originating from outside the housing to be directed toward the sensor. The IR sensor includes a thermally isolated area of IR-absorbing material coupled to a temperature measuring unit. IR radiation impinging on the sensor is absorbed, thereby raising the temperature of the IR absorbing material. The temperature measuring unit measures the increase in temperature and generates a proportional electronic signal indicative of the temperature. The electronic signal is received and processed by a processor. An IR radiator is also included within the sensing device housing.

Abstract: A capacitive position sensor employs conventional printed circuit board (PCB) technology to detect capacitive changes caused by the movement of a ball along conductive tracks. A recessed region (or through hole) is stamped on the PCB with well controlled dimensions. Electrically conductive tracks are laid around the region and connect to a capacitance detection circuit on the PCB. As the PCB experiences inclination or acceleration the ball moves along the axis of the recessed region causing variations in the measured capacitance.