Abstract: A method of processing data and related apparatuses. The method relies on an optical finite impulse response (FIR) filter. This optical FIR filter comprises several delay stages having weights set in accordance with parameters of a transformation to be applied by the optical FIR filter. Each of the delay stages is configured to impose a delay matched to a given input data period corresponding to a given input sample rate. According to the method, an optical signal is coupled into the optical FIR filter. The optical signal carries a data stream of input samples encoded at the given input sample rate; the data stream represents the data to be processed. Next, output samples are collected from an output data stream carried by an output optical signal obtained in output of the optical FIR filter. A set of output samples are obtained, which are representative of processed data.

Abstract: An electrical memristive device has a layer structure. The later structure comprises two electrodes and a bilayer material arrangement that connects the two electrodes. The bilayer material arrangement may, for example, be sandwiched by the two electrodes, in direct contact therewith. The bilayer material arrangement includes an HfOy layer, where 1.3±0.1?y<1.9±0.1, as well as a WOx layer in direct contact with the HfOy layer, where 2.5±0.1?x<2.9±0.1. The bilayer arrangement involves sub-stoichiometric layers of HfOy and WOx, where the WOx layer may advantageously have a polycrystalline structure in the monoclinic phase, while the HfOy layer is preferably amorphous.

Abstract: A method, system, and computer program product for using photorefractive material for analog optic storage and other applications of optical neuromorphic systems. The method may include coupling electromagnetic radiation into a first optical input and a second optical input, where the first optical input and the second optical input are part of an integrated optical device, the integrated optical device including: a first optical mode coupler connected to a first pair of optical ports including a first optical input and output; a second optical mode coupler connected to a second pair of optical ports including a second optical input and output, and the first optical mode coupler connected to the second optical mode coupler using a pair of arms (including a photorefractive material). The method may also include obtaining an optical interference pattern in the photorefractive material of each arm of the integrated optical device.

Abstract: A method, system, and computer program product for using photorefractive material for analog optic storage and other applications of optical neuromorphic systems. The method may include coupling electromagnetic radiation into a first optical input and a second optical input, where the first optical input and the second optical input are part of an integrated optical device, the integrated optical device including: a first optical mode coupler connected to a first pair of optical ports including a first optical input and output; a second optical mode coupler connected to a second pair of optical ports including a second optical input and output, and the first optical mode coupler connected to the second optical mode coupler using a pair of arms (including a photorefractive material). The method may also include obtaining an optical interference pattern in the photorefractive material of each arm of the integrated optical device.

Abstract: The invention relates to a wafer prober including an optical waveguide, the optical waveguide having a first optical coupling end segment with a first optical coupling surface being devoid of cladding. The first optical coupling end segment being configured to provide an adiabatic optical coupling to a second optical coupling end segment of a second optical waveguide of a photonic integrated circuit on a semiconductor wafer when the optical waveguide is aligned with respect to the semiconductor wafer according to a set of alignment requirements. The second optical coupling end segment having a second optical coupling surface that is devoid of cladding. The second optical coupling surface is parallel to a wafer surface of the semiconductor wafer. An alignment system configured to align the optical waveguide with respect to the semiconductor wafer according to the set of alignment requirements.

Abstract: A chip packaging includes a first part comprising a support; and a core polymer layer transversally structured so as to exhibit distinct residual portions comprising: first waveguide cores each having a first height and disposed within said inner region; and one or more first alignment structures disposed within said outer region. A second part of the packaging comprises: second waveguide cores, each having a same second height; and one or more second alignment structures complementarily shaped with respect to the one or more first alignment structures, and wherein, the first part structured such that said inner region is recessed with respect to the outer region, to enable: the second waveguide cores to contact the first waveguide cores; and the one or more second alignment structures to respectively receive, at least partly, the one or more first alignment structures. The invention is further directed to related passive alignment methods.

Abstract: A chip packaging includes a first part comprising a support; and a core polymer layer transversally structured so as to exhibit distinct residual portions comprising: first waveguide cores each having a first height and disposed within said inner region; and one or more first alignment structures disposed within said outer region. A second part of the packaging comprises: second waveguide cores, each having a same second height; and one or more second alignment structures complementarily shaped with respect to the one or more first alignment structures, and wherein, the first part structured such that said inner region is recessed with respect to the outer region, to enable: the second waveguide cores to contact the first waveguide cores; and the one or more second alignment structures to respectively receive, at least partly, the one or more first alignment structures. The invention is further directed to related passive alignment methods.

Abstract: The invention relates to a wafer prober including an optical waveguide, the optical waveguide having a first optical coupling end segment with a first optical coupling surface being devoid of cladding. The first optical coupling end segment being configured to provide an adiabatic optical coupling to a second optical coupling end segment of a second optical waveguide of a photonic integrated circuit on a semiconductor wafer when the optical waveguide is aligned with respect to the semiconductor wafer according to a set of alignment requirements. The second optical coupling end segment having a second optical coupling surface that is devoid of cladding. The second optical coupling surface is parallel to a wafer surface of the semiconductor wafer. An alignment system configured to align the optical waveguide with respect to the semiconductor wafer according to the set of alignment requirements.

Abstract: A chip packaging includes a first part comprising a support; and a core polymer layer transversally structured so as to exhibit distinct residual portions comprising: first waveguide cores each having a first height and disposed within said inner region; and one or more first alignment structures disposed within said outer region. A second part of the packaging comprises: second waveguide cores, each having a same second height; and one or more second alignment structures complementarily shaped with respect to the one or more first alignment structures, and wherein, the first part structured such that said inner region is recessed with respect to the outer region, to enable: the second waveguide cores to contact the first waveguide cores; and the one or more second alignment structures to respectively receive, at least partly, the one or more first alignment structures. The invention is further directed to related passive alignment methods.

Abstract: The invention relates to a wafer prober including an optical waveguide, the optical waveguide having a first optical coupling end segment with a first optical coupling surface being devoid of cladding. The first optical coupling end segment being configured to provide an adiabatic optical coupling to a second optical coupling end segment of a second optical waveguide of a photonic integrated circuit on a semiconductor wafer when the optical waveguide is aligned with respect to the semiconductor wafer according to a set of alignment requirements. The second optical coupling end segment having a second optical coupling surface that is devoid of cladding. The second optical coupling surface is parallel to a wafer surface of the semiconductor wafer. An alignment system configured to align the optical waveguide with respect to the semiconductor wafer according to the set of alignment requirements.

Abstract: The invention relates to a wafer prober including an optical waveguide, the optical waveguide having a first optical coupling end segment with a first optical coupling surface being devoid of cladding. The first optical coupling end segment being configured to provide an adiabatic optical coupling to a second optical coupling end segment of a second optical waveguide of a photonic integrated circuit on a semiconductor wafer when the optical waveguide is aligned with respect to the semiconductor wafer according to a set of alignment requirements. The second optical coupling end segment having a second optical coupling surface that is devoid of cladding. The second optical coupling surface is parallel to a wafer surface of the semiconductor wafer. An alignment system configured to align the optical waveguide with respect to the semiconductor wafer according to the set of alignment requirements.

Abstract: A chip packaging includes a first part comprising a support; and a core polymer layer transversally structured so as to exhibit distinct residual portions comprising: first waveguide cores each having a first height and disposed within said inner region; and one or more first alignment structures disposed within said outer region. A second part of the packaging comprises: second waveguide cores, each having a same second height; and one or more second alignment structures complementarily shaped with respect to the one or more first alignment structures, and wherein, the first part structured such that said inner region is recessed with respect to the outer region, to enable: the second waveguide cores to contact the first waveguide cores; and the one or more second alignment structures to respectively receive, at least partly, the one or more first alignment structures. The invention is further directed to related passive alignment methods.

Abstract: A computer program product or hardware description language (“HDL”) design structure in a computer-aided design system for generating a functional design model of an integrated circuitry structure including generating a functional representation of at least first and second regions of the integrated circuitry structure, generating a functional representation of an optical layer comprising optical waveguides, and generating a functional representation of a heat-conductive material for transferring heat from at least the second region through the optical layer to a heat sink.

Abstract: A method and spacer for assembling flexible optical waveguide ribbons and assembled stack of such ribbons. The method includes the steps of: providing at least two optical waveguide ribbons and a spacer, which includes at least two calibrated spaces; positioning a ribbon stack in the spacer, where the ribbon stack includes the at least two optical waveguide ribbons stacked on top of each other; constraining positioned ribbon stack in one of the calibrated spaces; and fixing constrained ribbon stack in the calibrated spaces.

Abstract: A method and spacer for assembling flexible optical waveguide ribbons and assembled stack of such ribbons. The method includes the steps of: providing at least two optical waveguide ribbons and a spacer, which includes at least two calibrated spaces; positioning a ribbon stack in the spacer, where the ribbon stack includes the at least two optical waveguide ribbons stacked on top of each other; constraining positioned ribbon stack in one of the calibrated spaces; and fixing constrained ribbon stack in the calibrated spaces.

Abstract: A method and spacer for assembling flexible optical waveguide ribbons and assembled stack of such ribbons. The method includes the steps of: providing at least two optical waveguide ribbons and a spacer, which includes at least two calibrated spaces; positioning a ribbon stack in the spacer, where the ribbon stack includes the at least two optical waveguide ribbons stacked on top of each other; constraining positioned ribbon stack in one of the calibrated spaces; and fixing constrained ribbon stack in the calibrated spaces.

Abstract: A computer program product or hardware description language (“HDL”) design structure in a computer-aided design system for generating a functional design model of an integrated circuitry structure including generating a functional representation of at least first and second regions of the integrated circuitry structure, generating a functional representation of an optical layer comprising optical waveguides, and generating a functional representation of a heat-conductive material for transferring heat from at least the second region through the optical layer to a heat sink.

Abstract: An integrated circuitry structure includes at least first and second regions. An optical layer includes optical waveguides. A heat-conductive material transfers heat from at least the second region through the optical layer to a heat sink.

Abstract: A method in a computer-aided design system for generating a functional design model of an integrated circuitry structure including generating a functional representation of at least first and second regions of the integrated circuitry structure, generating a functional representation of an optical layer comprising optical waveguides, and generating a functional representation of a heat-conductive material for transferring heat from at least the second region through the optical layer to a heat sink.

Abstract: An integrated circuit coupling device includes an integrated circuit package; and an optical data transmission medium connected to the integrated circuit package, and comprising a movable coolant, adapted to remove heat from the integrated circuit package, in operation.