Abstract: The present invention provides techniques for monitoring mobile communications. In one aspect, a method of monitoring mobile telephone usage is provided. The method comprises the step of relaying usage information pertaining to one or more mobile telephones to one or more other mobile telephones.

Abstract: A manufacturing method, in which two device bars are bonded prior to facet coating to form a stacked bar pair. In one embodiment, each of the device bars has a p-side and an n-side, each side having a plurality of bonding pads, with at least some bonding pads located at the p-side of the first device bar adapted for mating with the corresponding bonding pads located at the p-side of the second device bar. Solder material deposited onto the p-side bonding pads adapted for mating is liquefied in a reflow oven, wherein surface tension of the liquefied solder self-aligns the device bars with respect to each other and keeps them in alignment until the solder is solidified to form a solder bond between the mated bonding pads. Two or more instances of the bonded bar pair are further stacked such that bonding pads located at the n-sides of adjacent bar pairs are mated in a relatively tight fit.

Abstract: An amplifier includes a signal splitter operable to receive an input signal and generate at least first and second split signals, a first amplifier adapted to receive the first split signal and to generate a first amplified signal, and a second amplifier adapted to receive the second split signal and to generate a second amplified signal. A combining circuit is adapted to generate an output signal which is a sum of the first amplified signal and the second amplified signal. The amplifier further includes a phase control circuit arranged in a signal path of one of the first and second amplifiers, the phase control circuit comprising at least one thin film ferroelectric element. The amount of phase shift provided by the phase control circuit is selectively variable as a function of a control signal applied thereto.

Abstract: An optical assembly comprises a first semiconductor optical device and a second semiconductor optical device. The first and second semiconductor optical devices may, for example, be laser diodes or light-emitting diodes. In addition, the optical assembly includes an active cooling device that is in thermal contact with the first and second semiconductor optical devices. Advantageously, the active cooling device is operative to regulate the temperatures of both the first and second semiconductor optical devices.

Abstract: A communication method providing audio notification that can indicate to the recipient the relative importance of a particular email message. In one embodiment, a communication method of the invention enables the sender of an email message to provide for the message an audio tag that specifies a notification sound that can be produced at the recipient's email-enabled device, e.g., instead of a default notification sound. In another embodiment, the recipient's device is configured to produce a notification sound based on at least one of (i) priority level of the email message and (ii) the audio tag provided with the message. Embodiments of the invention enhance the recipient's ability to screen email messages without looking at the message content, which can advantageously reduce occurrences of unnecessary toggling between email and other user applications, thereby improving the recipient's productivity.

Abstract: A manufacturing method, in which two device bars are bonded prior to facet coating to form a stacked bar pair. In one embodiment, each of the device bars has a p-side and an n-side, each side having a plurality of bonding pads, with at least some bonding pads located at the p-side of the first device bar adapted for mating with the corresponding bonding pads located at the p-side of the second device bar. Solder material deposited onto the p-side bonding pads adapted for mating is liquefied in a reflow oven, wherein surface tension of the liquefied solder self-aligns the device bars with respect to each other and keeps them in alignment until the solder is solidified to form a solder bond between the mated bonding pads. Two or more instances of the bonded bar pair are further stacked such that bonding pads located at the n-sides of adjacent bar pairs are mated in a relatively tight fit.

Abstract: RFID tags include circuitry operable to receive an input signal from a common transceiver and generate at least first and second signals, a first signal adapted to transmit information to the common transceiver and a second signal adapted to transmit information to adjacent RFID tags. The second adapted signal is received by the adjacent RFID tags and used to control their operation wherein they are temporarily disabled. During the time that the adjacent RFID tags are disabled, the first RFID tag communicates with the common transceiver via the first signal. When communication is complete the first RFID tags temporarily disable themselves allowing the adjacent RFID tags to be enabled and communicate with the common transceiver. In this manner only limited numbers of RFID tags are transmitting at one time thereby limiting the amount of RF power impinging upon the common transceiver.

Abstract: A comparator-based driver has a configurable inverter that inverts one of the comparator output signals for application to the gate of a driver transistor used to generate the driver output signal. The configurable inverter can be selectively configured to provide any one of at least two different inverter logic threshold levels. In one possible operational scenario, the configurable inverter is configured such that the inverter logic threshold level is equivalent to the comparator's differential common-mode voltage to provide relatively high driver symmetry. The configurable inverter is then configured to provide a different inverter logic threshold level that is greater than the comparator's differential common-mode voltage to inhibit chattering in the driver output signal.

Abstract: A multi-chip electronic module comprises a multiplicity of integrated circuit chips arranged in a vertical stack. Each chip includes at least one first electrical terminal, with at least a first subset of the first terminals being disposed at different heights relative to the stack. A multiplicity of second electrical terminals is disposed on a support member, and a multiplicity of first electrical conductors (e.g., wirebonds) is connected between the first subset and at least a second subset of the second terminals. In order to reduce the skew produced at relatively high frequencies, all of the first conductors have substantially the same inductive impedance at the frequency of operation of the module. Our invention is particularly well suited to modules that operate at frequencies of about 500 MHz or higher.

Abstract: A circuit for audibly indicating at least one state of a television receiver includes memory operative to store at least one audio file, and a controller. The controller is operative during a power-on interval of the television receiver to forward the at least one audio file to an audio indicating device associated with the television receiver for audibly indicating the at least one state of the television receiver.

Abstract: Communication techniques are provided. For example, in one aspect, a communication method comprises the step of inputting information, at the time of placing of a telephone call, that directs a receiving telephone to produce one or more of a plurality of incoming call indicators. The incoming call indicator, which may comprise a particular ring tone, can be used to signify one or more of an identity of a caller, a nature of the call and an importance of the call.

Abstract: The present invention provides techniques for monitoring mobile communications. In one aspect, a method of monitoring mobile telephone usage is provided. The method comprises the step of relaying usage information pertaining to one or more mobile telephones to one or more other mobile telephones.

Abstract: An amplifier includes a signal splitter operable to receive an input signal and generate at least first and second split signals, a first amplifier adapted to receive the first split signal and to generate a first amplified signal, and a second amplifier adapted to receive the second split signal and to generate a second amplified signal. A combining circuit is adapted to generate an output signal which is a sum of the first amplified signal and the second amplified signal. The amplifier further includes a phase control circuit arranged in a signal path of one of the first and second amplifiers, the phase control circuit comprising at least one thin film ferroelectric element. The amount of phase shift provided by the phase control circuit is selectively variable as a function of a control signal applied thereto.

Abstract: The specification describes an improved mechanical electrode structure for MOS transistor devices with elongated runners. It recognizes that shrinking the geometry increases the likelihood of mechanical failure of comb electrode geometries. The mechanical integrity of a comb electrode is improved by interconnecting the electrode fingers in a cross-connected grid. In one embodiment, the transistor device is interconnected with gate fingers on a lower metaliization level, typically the first level metal, with the drain interconnected at a higher metal level. That allows the drain fingers to be cross-connected with a vertical separation between drain and gate comb electrodes. The cross-connect members may be further stabilized by adding beam extensions to the cross-connect members. The beam extensions may be anchored in an interlevel dielectric layer for additional support.

Abstract: A multi-chip electronic module comprises a multiplicity of integrated circuit chips arranged in a vertical stack. Each chip includes at least one first electrical terminal, with at least a first subset of the first terminals being disposed at different heights relative to the stack. A multiplicity of second electrical terminals is disposed on a support member, and a multiplicity of first electrical conductors (e.g., wirebonds) is connected between the first subset and at least a second subset of the second terminals. In order to reduce the skew produced at relatively high frequencies, all of the first conductors have substantially the same inductive impedance at the frequency of operation of the module. Our invention is particularly well suited to modules that operate at frequencies of about 500 MHz or higher.

Abstract: Several system diagnostic and network management tools are disclosed that, as a primary goal, support the consumer's ability to self diagnose and solve an existing problem. A non-intrusive diagnostic tool is provided that exposes system parameters of a consumer system for remote analysis by qualified personnel. Important data parameters of a given radio receiver are preferably predetermined and gathered directly at the receiver. Then, they are uploaded via the Internet from a removable memory placed into an Internet terminal (e.g., PC), or through a temporary docking station connected to an Internet terminal. This leads toward quick and efficient problem resolution with a properly informed customer service representative that is crucial to enriching the consumer's experience. The data collected relating to relevant system parameters may be used by service providers to enhance or even in some cases enable services.

Abstract: Accurate measurement of a signal at extremely high data rates such as OC192 is accomplished, to provide a high dynamic range. A data receiver comprises a limiting amplifier comprising a plurality of amplifier stages. A peak detector measures a voltage level of an input to the limiting amplifier. An input to the peak detector is connected directly to an input of a first stage of the limiting amplifier. Transmission lines used between the input to the peak detector and the input of the first stage of the limiting amplifier are impedance matched such that the peak detector appears as a load with insignificant capacitance with respect to the extremely high data rate of a signal on the input. Also, a same bias is provided to both the input stage of the limiting amplifier as well as to the peak detector.

Abstract: A write head for a magnetic storage system energizes a write coil for a plurality of bit intervals and selectively shutters the magnetic field to alter a magnetic domain of a magnetic storage medium for each bit interval. The position of the shutter may be controlled using a micro-electro mechanical system. Magnetic pole segments provide a loop between the write coil and the magnetic storage medium. Magnetic shielding on the shutter mechanisms controls the reflection of the magnetic fields. In a rewritable magnetic storage system, a first write coil generates a positive magnetic field and a second write coil generates a negative magnetic field. A shutter is associated with each write coil to selectively allow the positive or negative magnetic fields to alter the magnetic domain of the magnetic storage medium. The positive or negative magnetic fields can alter the magnetic domain in a collocated region of the magnetic storage medium to avoid jitter.

Abstract: Techniques for processing power transistor devices are provided. In one aspect, the curvature of a power transistor device comprising a device film formed on a substrate is controlled by thinning the substrate, the device having an overall residual stress attributable at least in part to the thinning step, and applying a stress compensation layer to a surface of the device film, the stress compensation layer having a tensile stress sufficient to counterbalance at least a portion of the overall residual stress of the device. The resultant power transistor device may be part of an integrated circuit.

Abstract: A mobile communication device comprises memory and at least one processor coupled to the memory. The at least one processor is operative: (i) to control establishment of a call with another communication device via a wireless communication channel; and (ii) to place the call in a hold state subsequent to establishment of the call. A call hold functionality for placing the call in the hold state is implemented substantially entirely within the mobile communication device, without requiring additional hold circuitry external to the device. The at least one processor may be further operative to control playing of an audio signal during at least a portion of a time the call is placed in the hold state.