Abstract: A method of making a thin-film multi-layer micro-wire structure includes providing a substrate and a layer on the substrate with one or more micro-channels having a width less than or equal to 20 microns. A conductive material including silver nano-particles and having a percent ratio of silver that is greater than or equal to 40% by weight is located in the micro-channels and cured to form an electrically conductive micro-wire. The electrically conductive micro-wire has a width less than or equal to 20 microns and a depth less than or equal to 20 microns. Each micro-wire is electrolessly plated to form a plated layer located at least partially within each micro-channel between the micro-wire and the layer surface in electrical contact with the micro-wire. The plated layer has a thickness less than a thickness of the micro-wire so that the micro-wire and plated layer form the thin-film multi-layer micro-wire.

Abstract: A touch-screen device is disclosed having a touch-sensitive area that includes a plurality of patterned driver electrodes, each having a plurality of patterned conductive electrically connected driver micro-wires. An unpatterned conductive layer that is unpatterned in the touch-sensitive area is in electrical contact with the driver micro-wires of the driver electrodes. A plurality of patterned sensor electrodes each includes a plurality of patterned conductive electrically connected sensor micro-wires. A dielectric layer is located between the driver electrodes and the sensor electrodes.

Abstract: A thin-film multi-layer micro-wire structure includes a substrate and a layer located on the substrate or forming a part of the substrate. One or more micro-channels are located in the layer. Each micro-channel has a width less than or equal to 20 microns. A cured electrically conductive micro-wire is located only within each micro-channel. The micro-wire has a thickness less than or equal to 20 microns, including silver nano-particles, and having a percent ratio of silver that is greater than or equal to 40% by weight. An electrolessly plated layer is located at least partially within each micro-channel between the micro-wire and the layer surface and in electrical contact with the micro-wire. The plated layer has a thickness less than a thickness of the micro-wire so that the micro-wire and plated layer form the thin-film multi-layer micro-wire.

Abstract: A method of making a thin-film multi-layer micro-wire structure includes providing a substrate and a layer on the substrate with one or more micro-channels having a width less than or equal to 20 microns. A conductive material including silver nano-particles and having a percent ratio of silver that is greater than or equal to 40% by weight is located in the micro-channels and cured to form an electrically conductive micro-wire. The electrically conductive micro-wire has a width less than or equal to 20 microns and a depth less than or equal to 20 microns. Each micro-wire is electrolessly plated to form a plated layer located at least partially within each micro-channel between the micro-wire and the layer surface in electrical contact with the micro-wire. The plated layer has a thickness less than a thickness of the micro-wire so that the micro-wire and plated layer form the thin-film multi-layer micro-wire.

Abstract: A thin-film multi-layer micro-wire structure includes a substrate and a layer located on the substrate or forming a part of the substrate. One or more micro-channels are located in the layer. Each micro-channel has a width less than or equal to 20 microns. A cured electrically conductive micro-wire is located only within each micro-channel. The micro-wire has a thickness less than or equal to 20 microns, including silver nano-particles, and having a percent ratio of silver that is greater than or equal to 40% by weight. An electrolessly plated layer is located at least partially within each micro-channel between the micro-wire and the layer surface and in electrical contact with the micro-wire. The plated layer has a thickness less than a thickness of the micro-wire so that the micro-wire and plated layer form the thin-film multi-layer micro-wire.

Abstract: A capacitive touch-screen device with force detection of a deformable touch element includes drive and sense electrode arrays and a touch-detection circuit connected to the electrodes for detecting capacitance at a touch location. The touch-detection circuit senses no-touch capacitance, light-touch capacitance, and heavy-touch capacitance at the touch location in response to forcible deformation of the deformable touch element proximate to the touch. The touch-detection circuit reports a force signal.

Abstract: A method for force detection of a deformable touch element with a capacitive touch-screen device includes providing drive and sense electrode arrays and a touch-detection circuit connected to the electrodes for detecting capacitance at a touch location. No-touch capacitance, light-touch capacitance, and heavy-touch capacitance are sensed with the touch-detection circuit at the touch location in response to forcible deformation of the deformable touch element proximate to the touch and a force signal reported.

Abstract: A touch-screen device is disclosed having a touch-sensitive area that includes a plurality of patterned driver electrodes, each having a plurality of patterned conductive electrically connected driver micro-wires. An unpatterned conductive layer that is unpatterned in the touch-sensitive area is in electrical contact with the driver micro-wires of the driver electrodes. A plurality of patterned sensor electrodes each includes a plurality of patterned conductive electrically connected sensor micro-wires. A dielectric layer is located between the driver electrodes and the sensor electrodes.

Abstract: A capacitive touch-screen device with force detection of a deformable touch element includes drive and sense electrode arrays and a touch-detection circuit connected to the electrodes for detecting capacitance at a touch location. The touch-detection circuit senses no-touch capacitance, light-touch capacitance, and heavy-touch capacitance at the touch location in response to forcible deformation of the deformable touch element proximate to the touch. The touch-detection circuit reports a force signal.

Abstract: A method for force detection of a deformable touch element with a capacitive touch-screen device includes providing drive and sense electrode arrays and a touch-detection circuit connected to the electrodes for detecting capacitance at a touch location. No-touch capacitance, light-touch capacitance, and heavy-touch capacitance are sensed with the touch-detection circuit at the touch location in response to forcible deformation of the deformable touch element proximate to the touch and a force signal reported.

Abstract: A method of characterizing an array of resistive heaters, a first resistive heater of the array having a nominal sheet resistance, a first nominal length and a first nominal width, the method includes (a) providing a first configuration test resistor disposed proximate the first resistive heater, the first configuration test resistor including a second nominal length and a second nominal width, wherein the second nominal length is different from the first nominal length; (b) measuring a resistance of the first resistive heater; (c) measuring a resistance of the first configuration test resistor; and (d) determining the actual sheet resistance and the actual length of the first resistive heater based on the measured resistances of the first resistive heater and the first configuration test resistor.

Abstract: A method of characterizing an array of resistive heaters, a first resistive heater of the array having a nominal sheet resistance, a first nominal length and a first nominal width, the method includes (a) providing a first configuration test resistor disposed proximate the first resistive heater, the first configuration test resistor including a second nominal length and a second nominal width, wherein the second nominal length is different from the first nominal length; (b) measuring a resistance of the first resistive heater; (c) measuring a resistance of the first configuration test resistor; and (d) determining the actual sheet resistance and the actual length of the first resistive heater based on the measured resistances of the first resistive heater and the first configuration test resistor.

Abstract: An inkjet printhead includes an array of drop ejectors, a first drop ejector of the array including a first resistive heater having a first nominal length and a first nominal width; and a first configuration test resistor disposed proximate the first resistive heater, the first configuration test resistor including a second nominal length and a second nominal width, wherein the second nominal length is different from the first nominal length.

Abstract: A liquid drop ejector is provided. The ejector includes a liquid chamber and a liquid supply. Portions of the liquid chamber define a nozzle bore. A liquid supply passageway is positioned between the liquid chamber and the liquid supply. The liquid supply passageway is in fluid communication with the liquid chamber and the liquid supply. A plurality of pillars is suspended in the liquid supply passageway. A wall of the liquid chamber can extend to the liquid supply passageway. A center pillar can also be included with a portion of the center pillar being positioned in the liquid chamber and another portion of the center pillar being positioned in the liquid supply passageway.

Abstract: A thermally-conductive fluid ejector carriage device is used to dissipate heat from a thermal fluid ejector module in a fluid ejection device. The thermally-conductive fluid ejector carriage device is molded from a polymer, or a polymer material including at least one thermally-conductive filler material. The thermal fluid ejector module is brought into contact with the thermally-conducting polymer carriage to dissipate heat. The polymer can be a highly thermally-conductive polymer. A method of manufacturing the thermally-conductive polymer carriage includes molding the carriage at least partially from a polymer that includes thermally-conductive filler materials, and contacting the thermally-conducting polymer carriage with the fluid ejector module. A method for use of the thermally-conductive fluid ejector carriage device includes establishing a heat flow path from the fluid ejector module to ambient air through the thermally-conductive fluid ejector carriage device.

Abstract: A system, method and structures for dissipating heat away from a thermal fluid ejector modules through a thermally-conductive carriage molded from a polymer to the ambient air surrounding the structure upon which the thermally-conductive fluid ejector carriage translates. The heat is transferred via conduction and convection from the thermally-conductive fluid ejector carriage across a thin volume of air trapped between a thermally-conductive carriage rod guide, enclosed on each end by thermally-conductive carriage rod guide bearings, and the thermal contact of the thermally-conductive carriage rod guide bearings with the surface of at least one thermally-conductive carriage guide rod which the thermally-conductive fluid ejector carriage translates.

Abstract: Methods and apparatus provide for automatic fluid ejector alignment and performance evaluation and modification in one or multiple planes. A fluid ejector fires a drop through a drop detection module. A signal indicating drop presence or absence is sent to a computer. The computer analyzes the data, and makes a compensation determination of a preferred method of using the fluid ejector. The compensation determination may include electronically modifying the image data to be printed, physically manipulating the fluid ejector, completely skipping the fluid ejector during printing operations, or in some other way modifying the fluid ejector or image data such that apparent printed image error due to fluid ejector alignment or performance error is reduced.

Abstract: An independent hardware pixel counter counts bits of print data in regions of interest. The independent pixel counter can be an application specific integrated circuit (ASIC), and is separate from a control processor. The independent hardware pixel counter selectively monitors a data bus carrying image data to or from a memory. Once the pixels of the image data have been counted, the count data can be sent to the control processor in order to implement a print strategy. The pixel counter counts the print data at a point when image data is being sent to the memory, since at that point the image data is both uncompressed and in a raster format, and thus can be easily analyzed. Additionally, because the image data is stored in the memory until enough print data has accumulated for printing, the processor is provided with sufficient time to gather and use print information before the counted image data is printed.

Abstract: A method and apparatus prevents satellite induced banding caused in bi-directional printing in which a print head alternatively moves in a first printing direction and in a second printing direction opposite to the first printing direction. The ink jet printer includes a controller that performs at least one of (i) selectively removing pixels in the first printing direction in order to lighten an image, and (ii) selectively adding pixels in the second printing direction in order to darken the image.

Abstract: The present invention provides a method for referencing the position of a moving component. The method includes generating a first signal in response to the relative movement between a first sensor and encoder strip having a repeating pattern of fiducial marks, the first signal including a plurality of transitions corresponding to the repeating pattern; generating a second signal in response to the relative movement of a second sensor and the encoder strip, the second signal including a plurality of transitions corresponding to the repeating pattern; estimating a position of the moving component based upon the transitions within the first sensor signal; and identifying a direction of movement of the moving component in response to the first and second signals.