Abstract: A chip-to-chip digital transmission circuit includes a differential driver portion, a pair of differential signal transmission lines connected to the driver portion, and a receiver portion connected to the transmission lines, an output node of which reproduces a digital bit stream originally presented to a driver side input node, wherein the transmission lines carry both transmitted signal information and DC power for the receiver portion. The driver portion is configured to adjust both the transmitted signal magnitude and the DC power delivered to the receiver portion.

Abstract: Methods, systems, and computer program products are disclosed for acquiring test data from an electronic circuit by mounting a probe adjacent to a capture point on an electronic circuit board, capturing by the probe an electronic signal of the electronic circuit, digitizing by the probe the captured signal, and transmitting by the probe the digitized signal from the probe through a data communications connection to a remote device. Acquiring test data from an electronic circuit also includes storing by the probe the digitized signal in the probe. Acquiring test data from an electronic circuit may include processing by the probe the digitized signal. Acquiring test data from an electronic circuit also may include synchronizing acquisition of test data by the probe with acquisition of test data by one or more other probes.

Abstract: Methods, systems, and computer program products are disclosed for acquiring test data from an electronic circuit by mounting a probe adjacent to a capture point on an electronic circuit board, capturing by the probe an electronic signal of the electronic circuit, digitizing by the probe the captured signal, and transmitting by the probe the digitized signal from the probe through a data communications connection to a remote device. Acquiring test data from an electronic circuit also includes storing by the probe the digitized signal in the probe. Acquiring test data from an electronic circuit may include processing by the probe the digitized signal. Acquiring test data from an electronic circuit also may include synchronizing acquisition of test data by the probe with acquisition of test data by one or more other probes.

Abstract: A method and structures are provided for implementing customizable dielectric printed circuit card traces. A void is defined near selected signal traces. The void is then filled with a dielectric material having a predefined dielectric property. The dielectric material is selected to alter at least one predefined electrical property of the selected signal traces, such as, coupling, propagation delay and attenuation. In one embodiment, an outer layer of a printed circuit card includes a plurality of signal traces and a mating circuit card layer including a plurality of matching signal traces is attached to the outer layer of the printed circuit card to create a cavity near selected signal traces. The cavity is filled with the selected dielectric material. In another embodiment, dielectric material is selectively removed near signal traces on an outer layer of the printed circuit card to define a void near selected signal traces.

Abstract: A method and structures are provided for implementing customizable dielectric printed circuit card traces. A void is defined near selected signal traces. The void is then filled with a dielectric material having a predefined dielectric property. The dielectric material is selected to alter at least one predefined electrical property of the selected signal traces, such as, coupling, propagation delay and attenuation. In one embodiment, an outer layer of a printed circuit card includes a plurality of signal traces and a mating circuit card layer including a plurality of matching signal traces is attached to the outer layer of the printed circuit card to create a cavity near selected signal traces. The cavity is filled with the selected dielectric material. In another embodiment, dielectric material is selectively removed near signal traces on an outer layer of the printed circuit card to define a void near selected signal traces.

Abstract: A method, apparatus and computer program product are provided for implementing automated detection of excess aggressor shape capacitance coupling in printed circuit board layouts. A PCB design file containing an electronic representation of a printed circuit board design is received. A list of candidate shapes is identified. The candidate shapes are disposed on layers adjacent to aggressor planes. A capacitance coupling the candidate shapes to adjacent aggressor planes is calculated. A ratio of the calculated capacitance and a decoupling capacitance connecting the candidate shapes to a reference plane is determined.