Patents by Inventor Roger Hsieh

Roger Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11355276
    Abstract: An electronic device including a core, at least a wire and a magnetic material is provided. The core includes a pillar, a top board and a bottom board. The pillar is disposed between the top board and the bottom board. A winding space is formed among the top board, the bottom board and the pillar. The wire is wound around the pillar and located in the winding space. The magnetic material fills the winding space to encapsulate the wire. The magnetic material includes a resin and a magnetic powder, wherein an average particle diameter of the magnetic powder is smaller than 20 ?m.
    Type: Grant
    Filed: June 6, 2019
    Date of Patent: June 7, 2022
    Assignee: CYNTEC CO., LTD.
    Inventors: Tsung-Chan Wu, Roger Hsieh, Yi-Min Huang, Lan-Chin Hsieh, Yu-Ching Kuo
  • Patent number: 11017937
    Abstract: A variable coupled inductor comprises a first core having a first protrusion, a second protrusion, a third protrusion, a first conducting-wire groove and a second conducting-wire groove on the top surface of the first core, wherein the second protrusion is disposed between the first protrusion and the third protrusion, wherein a first conducting wire is disposed in the first conducting-wire groove, and a second conducting wire is disposed in the second conducting-wire groove, wherein a second core, disposed over the first core, wherein a magnetic structure is integrally formed with the second core and protruded on the bottom surface of the second core, wherein the bottom surface of the magnetic structure is located over the top surface of the second protrusion.
    Type: Grant
    Filed: May 7, 2018
    Date of Patent: May 25, 2021
    Assignee: CYNTEC CO., LTD.
    Inventors: Lan-Chin Hsieh, Cheng-Chang Lee, Chih-Hung Chang, Chih-Siang Chuang, Tsung-Chan Wu, Roger Hsieh
  • Patent number: 10658102
    Abstract: A method for manufacturing an electronic device, the method comprising: providing a conducting wire; forming a mixture with the conducting wire buried therein, wherein the mixture comprises: a first magnetic powder and a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is greater than the mean particle diameter of the second magnetic powder, and the Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder by a first hardness difference; and performing a molding process on the conducting wire and the mixture, wherein the mixture and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of the conducting wire.
    Type: Grant
    Filed: June 25, 2019
    Date of Patent: May 19, 2020
    Assignee: CYNTEC CO., LTD.
    Inventors: Wen-Hsiung Liao, Roger Hsieh, Hideo Ikuta, Yueh-Lang Chen
  • Patent number: 10614945
    Abstract: A choke includes a single-piece core entirely made of a same material, the single-piece core having two boards and a pillar located between the two boards, a winding space being located among the two boards and the pillar, wherein the pillar has a non-circular and non-rectangular cross section along a direction substantially perpendicular to an axial direction of the pillar, the cross section of the pillar has a first axis and a second axis intersecting with each other at a center of the cross section of the pillar and are substantially perpendicular with each other, the first axis is longer than the second axis, and the cross section of the pillar is substantially symmetrical to both of the first axis and the second axis.
    Type: Grant
    Filed: June 20, 2019
    Date of Patent: April 7, 2020
    Assignee: CYNTEC CO., LTD.
    Inventors: Tsung-Chan Wu, Roger Hsieh, Yi-Min Huang, Lan-Chin Hsieh, Yu-Ching Kuo
  • Publication number: 20190311837
    Abstract: A method for manufacturing an electronic device, the method comprising: providing a conducting wire; forming a mixture with the conducting wire buried therein, wherein the mixture comprises: a first magnetic powder and a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is greater than the mean particle diameter of the second magnetic powder, and the Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder by a first hardness difference; and performing a molding process on the conducting wire and the mixture, wherein the mixture and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of the conducting wire.
    Type: Application
    Filed: June 25, 2019
    Publication date: October 10, 2019
    Inventors: Wen-Hsiung Liao, Roger Hsieh, Hideo Ikuta, Yueh-Lang Chen
  • Publication number: 20190311836
    Abstract: A choke includes a single-piece core entirely made of a same material, the single-piece core having two boards and a pillar located between the two boards, a winding space being located among the two boards and the pillar, wherein the pillar has a non-circular and non-rectangular cross section along a direction substantially perpendicular to an axial direction of the pillar, the cross section of the pillar has a first axis and a second axis intersecting with each other at a center of the cross section of the pillar and are substantially perpendicular with each other, the first axis is longer than the second axis, and the cross section of the pillar is substantially symmetrical to both of the first axis and the second axis.
    Type: Application
    Filed: June 20, 2019
    Publication date: October 10, 2019
    Inventors: Tsung-Chan Wu, Roger Hsieh, Yi-Min Huang, Lan-Chin Hsieh, Yu-Ching Kuo
  • Publication number: 20190287709
    Abstract: An electronic device including a core, at least a wire and a magnetic material is provided. The core includes a pillar, a top board and a bottom board. The pillar is disposed between the top board and the bottom board. A winding space is formed among the top board, the bottom board and the pillar. The wire is wound around the pillar and located in the winding space. The magnetic material fills the winding space to encapsulate the wire. The magnetic material includes a resin and a magnetic powder, wherein an average particle diameter of the magnetic powder is smaller than 20 ?m.
    Type: Application
    Filed: June 6, 2019
    Publication date: September 19, 2019
    Inventors: Tsung-Chan Wu, Roger Hsieh, Yi-Min Huang, Lan-Chin Hsieh, Yu-Ching Kuo
  • Patent number: 10366818
    Abstract: A choke includes a single-piece core entirely made of a same material, the single-piece core having two boards and a pillar located between the two boards, a winding space being located among the two boards and the pillar, wherein the pillar has a non-circular and non-rectangular cross section along a direction substantially perpendicular to an axial direction of the pillar, the cross section of the pillar has a first axis and a second axis intersecting with each other at a center of the cross section of the pillar and are substantially perpendicular with each other, the first axis is longer than the second axis, and the cross section of the pillar is substantially symmetrical to both of the first axis and the second axis.
    Type: Grant
    Filed: August 7, 2017
    Date of Patent: July 30, 2019
    Assignee: CYNTEC CO., LTD
    Inventors: Tsung-Chan Wu, Roger Hsieh, Yi-Min Huang, Lan-Chin Hsieh, Yu-Ching Kuo
  • Patent number: 10354789
    Abstract: An electronic device including a core, at least a wire and a magnetic material is provided. The core includes a pillar, a top board and a bottom board. The pillar is disposed between the top board and the bottom board. An area of the top board is smaller than an area of the bottom board. A winding space is formed among the top board, the bottom board and the pillar. The wire is winded around the pillar and located in the winding space. The magnetic material fills the winding space to encapsulate the wire. The magnetic material includes a resin and a metallic powder, wherein an average particle diameter of the magnetic powder is smaller than 20 ?m.
    Type: Grant
    Filed: December 11, 2013
    Date of Patent: July 16, 2019
    Assignee: CYNTEC CO., LTD.
    Inventors: Tsung-Chan Wu, Roger Hsieh, Yi-Min Huang, Lan-Chin Hsieh, Yu-Ching Kuo
  • Publication number: 20190148050
    Abstract: A method for manufacturing an electronic device, the method comprising: providing a conducting wire; forming a mixture with the conducting wire buried therein, wherein the mixture comprises: a first magnetic powder and a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is greater than the mean particle diameter of the second magnetic powder, and the Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder by a first hardness difference; and performing a molding process on the conducting wire and the mixture, wherein by means of the first hardness difference of the first magnetic powder and the second magnetic powder, the mixture and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of the conducting wire.
    Type: Application
    Filed: January 16, 2019
    Publication date: May 16, 2019
    Inventors: Wen-Hsiung Liao, Roger Hsieh, Hideo Ikuta, Yueh-Lang Chen
  • Patent number: 10204730
    Abstract: A method for manufacturing an electronic device, the method comprising: providing a conducting wire; forming a mixture with the conducting wire buried therein, wherein the mixture comprises: a first magnetic powder and a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder, and the Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder by a first hardness difference; and performing a molding process on the conducting wire and the mixture, wherein by means of the first hardness difference of the first magnetic powder and the second magnetic powder, the mixture and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of the conducting wire.
    Type: Grant
    Filed: October 3, 2016
    Date of Patent: February 12, 2019
    Assignee: CYNTEC CO., LTD.
    Inventors: Wen-Hsiung Liao, Roger Hsieh, Hideo Ikuta, Yueh-Lang Chen
  • Publication number: 20180254137
    Abstract: A variable coupled inductor comprises a first core having a first protrusion, a second protrusion, a third protrusion, a first conducting-wire groove and a second conducting-wire groove on the top surface of the first core, wherein the second protrusion is disposed between the first protrusion and the third protrusion, wherein a first conducting wire is disposed in the first conducting-wire groove, and a second conducting wire is disposed in the second conducting-wire groove, wherein a second core, disposed over the first core, wherein a magnetic structure is integrally formed with the second core and protruded on the bottom surface of the second core, wherein the bottom surface of the magnetic structure is located over the top surface of the second protrusion.
    Type: Application
    Filed: May 7, 2018
    Publication date: September 6, 2018
    Inventors: Lan-Chin Hsieh, Cheng-Chang Lee, Chih-Hung Chang, Chih-Siang Chuang, Tsung-Chan Wu, Roger Hsieh
  • Patent number: 9991041
    Abstract: A variable coupled inductor includes a first core, two conducting wires, a second core and a magnetic structure. The first core includes two first protruding portions, a second protruding portion and two grooves, wherein the second protruding portion is located between the two first protruding portions and each of the grooves is located between one of the first protruding portions and the second protruding portion. Each of the conducting wires is disposed in one of the grooves. The second core is disposed on the first core. A first gap is formed between each of the first protruding portions and the second core and a second gap is formed between the second protruding portion and the second core. The magnetic structure is disposed between the second protruding portion and the second core and distributed symmetrically with respect to a centerline of the second protruding portion.
    Type: Grant
    Filed: December 13, 2015
    Date of Patent: June 5, 2018
    Assignee: CYNTEC CO., LTD.
    Inventors: Lan-Chin Hsieh, Cheng-Chang Lee, Chih-Hung Chang, Chih-Siang Chuang, Tsung-Chan Wu, Roger Hsieh
  • Publication number: 20170338026
    Abstract: A choke includes a single-piece core entirely made of a same material, the single-piece core having two boards and a pillar located between the two boards, a winding space being located among the two boards and the pillar, wherein the pillar has a non-circular and non-rectangular cross section along a direction substantially perpendicular to an axial direction of the pillar, the cross section of the pillar has a first axis and a second axis intersecting with each other at a center of the cross section of the pillar and are substantially perpendicular with each other, the first axis is longer than the second axis, and the cross section of the pillar is substantially symmetrical to both of the first axis and the second axis.
    Type: Application
    Filed: August 7, 2017
    Publication date: November 23, 2017
    Inventors: Tsung-Chan Wu, Roger Hsieh, Yi-Min Huang, Lan-Chin Hsieh, Yu-Ching Kuo
  • Patent number: 9805860
    Abstract: A magnetic device comprises a lead frame, a first core body and a coil. The lead frame has a first portion and a second portion spaced apart from the first portion. A first core body is disposed on the lead frame, wherein the first core body comprises a first through opening and a second through opening. A coil is disposed on the first core body, wherein the coil has a first terminal and a second terminal, wherein the first portion is electrically connected with the first terminal via the first through opening, and the second portion is electrically connected with the second terminal via the second through opening, respectively.
    Type: Grant
    Filed: January 19, 2017
    Date of Patent: October 31, 2017
    Assignee: CYNTEC CO., LTD.
    Inventors: Roger Hsieh, Cheng-Chang Lee, Chun-Tiao Liu, Yi-Min Huang, Chih-Siang Chuang
  • Patent number: 9754713
    Abstract: A choke includes a single-piece core made of a same material, the single-piece core having a first board, a second board, and a pillar located between the first and second boards, a winding space located among the first board, the second board and the pillar, wherein the pillar has a non-circular and non-rectangular cross section having a first axis and a second axis substantially perpendicularly intersecting with each other at a center of the cross section of the pillar, and wherein a circumference of the cross section of the pillar includes two arc edges, four first substantially straight edges substantially parallel to the first axis, and two second substantially straight edges substantially parallel to the second axis, each of the first substantially straight edges being a joint of and in direct contact with one of the arc edges and one of the second substantially straight edges.
    Type: Grant
    Filed: July 8, 2015
    Date of Patent: September 5, 2017
    Assignee: CYNTEC CO., LTD.
    Inventors: Tsung-Chan Wu, Roger Hsieh, Yi-Min Huang, Lan-Chin Hsieh, Yu-Ching Kuo, Chia-Hui Lai
  • Patent number: 9728331
    Abstract: A method to form a choke is disclosed, wherein the method comprises: encapsulating a hollow coil by a molding body; forming a first core, wherein the first core comprises a pillar; and disposing at least one first portion of the pillar inside the encapsulated hollow coil. The method avoids the overflow or vertical flow issue during a molding process for encapsulating a coil that has been wound on a core already.
    Type: Grant
    Filed: December 10, 2014
    Date of Patent: August 8, 2017
    Assignee: CYNTEC CO., LTD.
    Inventors: Lan-Chin Hsieh, Roger Hsieh, Yu-Ching Kuo, Chun-Tiao Liu
  • Publication number: 20170133149
    Abstract: A magnetic device comprises a lead frame, a first core body and a coil. The lead frame has a first portion and a second portion spaced apart from the first portion. A first core body is disposed on the lead frame, wherein the first core body comprises a first through opening and a second through opening. A coil is disposed on the first core body, wherein the coil has a first terminal and a second terminal, wherein the first portion is electrically connected with the first terminal via the first through opening, and the second portion is electrically connected with the second terminal via the second through opening, respectively.
    Type: Application
    Filed: January 19, 2017
    Publication date: May 11, 2017
    Inventors: Roger Hsieh, Cheng-Chang Lee, Chun-Tiao Liu, Yi-Min Huang, Chih-Siang Chuang
  • Patent number: 9576710
    Abstract: A magnetic device comprises a lead frame, a first core body and a coil. The lead frame has a first portion and a second portion spaced apart from the first portion. A first core body is disposed on the lead frame, wherein the first core body comprises a first through opening and a second through opening. A coil is disposed on the first core body, wherein the coil has a first terminal and a second terminal, wherein the first portion is electrically connected with the first terminal via the first through opening, and the second portion is electrically connected with the second terminal via the second through opening, respectively.
    Type: Grant
    Filed: August 7, 2015
    Date of Patent: February 21, 2017
    Assignee: CYNTEC CO., LTD.
    Inventors: Roger Hsieh, Cheng-Chang Lee, Chun-Tiao Liu, Yi-Min Huang, Chih-Siang Chuang
  • Patent number: RE48472
    Abstract: A choke includes a single-piece core entirely made of a same material, the single-piece core having two boards and a pillar located between the two boards, a winding space being located among the two boards and the pillar, wherein the pillar has a non-circular and non-rectangular cross section along a direction substantially perpendicular to an axial direction of the pillar, the cross section of the pillar has a first axis and a second axis intersecting with each other at a center of the cross section of the pillar and are substantially perpendicular with each other, the first axis is longer than the second axis, and the cross section of the pillar is substantially symmetrical to both of the first axis and the second axis.
    Type: Grant
    Filed: August 29, 2017
    Date of Patent: March 16, 2021
    Assignee: CYNTEC CO., LTD.
    Inventors: Tsung-Chan Wu, Roger Hsieh, Yi-Min Huang, Lan-Chin Hsieh, Yu-Ching Kuo