Abstract: The present invention provides an integrated cooling device employing heat pipes for cooling an electronic component and a method of manufacturing the same. In one embodiment, the integrated cooling device includes a plate couplable to and supportable by the electronic component. The plate has at least one channel therein that presents an enhanced surface area. The cooling device further includes a sealed heat pipe having a heat-receiving portion fitted within the channel such that the enhanced surface area in contact with the heat pipe experiences an increased thermal communication between the plate and the heat pipe. The heat pipe also has a heat-removing portion that is distal from the heat receiving portion. Inside the heat pipe, a fluid, initially located in the heat-receiving portion of the heat pipe as a liquid, receives heat and evaporates to form a vapor that travels to the heat-removing portion.

Abstract: The present invention provides a miniature liquid transfer pump. The pump has a housing that includes first and second blocks joinable to form a leak-resistant impeller chamber with a drive shaft aperture, an inlet and an outlet. An impeller is located in the impeller chamber and a micro-motor with a drive shaft extending therefrom is mounted to the housing. The drive shaft on the micro-motor passes through the drive shaft aperture and engages the impeller. The micro-motor drives the impeller to draw liquid through the inlet and eject the liquid through the outlet.

Abstract: A header containing a semiconductor die, method of manufacture thereof and electronic device employing the same. In one embodiment, the header includes first and second contacts, and an intermediate body. The intermediate body includes an insulated section interposed between the first and second contacts and has a cavity therein. The intermediate body also includes a semiconductor die, located within the cavity, adapted to condition a signal passing through at least a portion of the header.

Abstract: An electronics case, a method of manufacturing the same and a power module incorporating the case. In one embodiment, the case includes: (1) an enclosure including a metal substrate that forms walls of the enclosure and a dielectric material located on inner surfaces of the walls that insulate the substrate from electronics components located within the enclosure and (2) an electrically conductive pin, affixed to a sidewall of the enclosure substrate and extending to without the enclosure, that allows the substrate to be electrically coupled to a structure supporting the case for EMI (electromagnetic interference) shielding or case-grounding purposes.

Abstract: The present invention provides an encapsulant structure for retaining an electronic circuit having heat-generating components within a case that at least partially surrounds the electronic circuit. In one advantageous embodiment, the encapsulant structure provides for a thermally conductive insert to be located within the case proximate the heat-generating components. The insert increases the heat transfer efficiency from the electronic circuit to the case.

Abstract: An improved circuit board apparatus configured for mounting electronic components in a circuit arrangement. The apparatus comprises a metal substrate having a first side and a second side, a first-side laminar structure and a second-side laminar structure. The first-side laminar structure includes at least one first-side conductive stratum alternated with at least one first-side dielectric stratum affixed at the first side The second-side laminar structure includes at least one second-side conductive stratum alternated with at least one second-side dielectric stratum affixed at the second side of the metal substrate. The apparatus further comprises a plurality of electrically conductive interside courses intermediate selected first-side strata of the at least one first-side conductive stratum and selected second-side strata of the at least one second-side conductive stratum.

Abstract: An integrated cooling device for use in cooling an electronic component or an integrated circuit and a method of manufacturing the same. In one embodiment, the device includes: (1) a plate couplable to and supportable by the electronic component, the plate having at least one channel therein, (2) a closed-circuit circulation pipe having a heat-receiving portion disposed in the at least one channel to place the heat-receiving portion in thermal communication with the plate, the circulation pipe further having a heat-removing portion distal from the heat receiving portion, (3) a coolant located within the circulation pipe and (4) a pump coupled to the circulation pipe, supported by the plate and operable to cause the coolant to circulate through the circulation pipe.

Abstract: For use with a plate having a via located therethrough an electrical connector configured to transfer an electrical signal from one major surface of a plate to the other major surface, a method of manufacturing the electrical connector and a board mounted power supply utilizing the same. In one embodiment, the electrical connector comprises a dielectric layer coating a peripheral wall of the via and extending therefrom to coat portions of the opposing major surfaces of the plate adjacent the via. The electrical connector further comprises a conductive contact layer that covers a portion of the dielectric layer and extends to portions of the opposing major surfaces to form opposing contacts thereon.

Abstract: An electronics case, a method of manufacturing the same and a power module incorporating the case. In one embodiment, the case includes: (1) an enclosure including a metal substrate and a dielectric material located on inner surfaces of the enclosure that insulate the substrate from electronics components located within the enclosure, the enclosure having an aperture on a major surface thereof and (2) an electrically conductive pin, passing through the aperture and an interior of the enclosure to emerge from the enclosure at a point opposite the major surface, the pin functioning both as a heat sink mount for the case and a case ground pin for the substrate.