Abstract: A flip chip architecture providing a hermetic seal. A flip chip die is assembled so as to be in contact with a package substrate. A pre-form of seal material is placed such that it surrounds the flip chip die and is in contact with the package substrate. The pre-form material is then processed so that it becomes a hermetic seal between the flip chip die and the substrate.

Abstract: The inventions presented herein provide a electronically controlled phase shifters that incorporate analog and digital phase shift architectures in a novel manner that realizes the best advantages of each architecture. This combination of complementary phase shift architectures provides the high-performance and low loss characteristics of switched digital phase shift architectures with the high resolution and precision of continuous analog phase shift architectures. The circuit embodiments are electronically controlled, which simplifies implementation of what is a complex circuit. The analog phase shift elements comprise electronically-tuned varactors, which provide fine resolution and enables the incorporation of active compensation for manufacturing variation before use or for environmental conditions during use.