Abstract: A write head includes a cavity configured to couple a laser diode to the write head. A bottom of the cavity includes a heat conductive element configured to contact the laser diode, a plurality of thermal studs disposed below the heat conductive element, and a substrate disposed below the thermal studs. The heat conductive element, thermal studs, and substrate are thermally coupled to draw heat from the laser diode.

Abstract: The presently disclosed technology describes systems and methods for attaining a ball bond using less than 1 thousandth of an inch diameter gold wire using ultrasonic bonding energy and without heating an underlying bonding pad. The ball bond allows the use of particularly small bonding pads that are particularly close to adjacent microelectronic structures that limit the use of other bonding techniques that have shallow take-off angles.

Abstract: A write head includes a cavity configured to couple a laser diode to the write head. A bottom of the cavity includes a heat conductive element configured to contact the laser diode, a plurality of thermal studs disposed below the heat conductive element, and a substrate disposed below the thermal studs. The heat conductive element, thermal studs, and substrate are thermally coupled to draw heat from the laser diode.

Abstract: A write head includes a cavity configured to couple a laser diode to the write head. A bottom of the cavity includes a heat conductive element configured to contact the laser diode, a plurality of thermal studs disposed below the heat conductive element, and a substrate disposed below the thermal studs. The heat conductive element, thermal studs, and substrate are thermally coupled to draw heat from the laser diode.

Abstract: A wafer is formed having a plurality of laser-to-slider submount features on a first surface. An etching process is used to form scribe lines between the submounts on the first surface of the wafer. The wafer is separated at the scribe lines to form the submounts.

Abstract: An apparatus includes a crystalline substrate. A cleaving guide on the substrate is positioned over a cleave plane of the crystalline substrate and positioned in a known location with respect to a feature of an electronic device on the substrate. Cleaving of the substrate along the cleave plane changes a physical characteristic of the cleaving guide and measurement of the physical characteristic provides a parameter representative of the relative position of the cleave plane and the cleaving guide.

Abstract: An apparatus includes a structure including a waveguide and a pocket adjacent to an input facet of the waveguide. A laser has an output facet and is positioned in the pocket. A stop is included one at least one of the laser and a wall of the pocket. The stop is positioned at an interface between the laser and the wall of the pocket such that the output facet of the laser and the input facet of the waveguide are separated by a gap.

Abstract: A fluid dynamic bearing formed by a microelectromechanical systems (MEMS) wafer-level batch-fabrication process is provided. The process results in a high performance and high reliability fluid dynamic bearing having features including higher bearing lifetime at high RPM, improved bearing stiffness, durability and thrust/restoring forces capabilities. The present invention is especially useful with small form factor disc drive memory devices having constraints in motor height, such as a 2.5 inch disc drive, requiring high performance including high rotational speed and large areal density. A sacrificial layer is utilized in the process to simultaneously form symmetrical facing surfaces of relatively rotatable components. The facing surfaces define, therebetween, a desired feature, such as a journal bearing, a thrust bearing, a fluid channel, a fluid reservoir, a capillary seal, pressure generating grooves, and other profile geometries.

Abstract: A write head includes a cavity configured to couple a laser diode to the write head. A bottom of the cavity includes a heat conductive element configured to contact the laser diode, a plurality of thermal studs disposed below the heat conductive element, and a substrate disposed below the thermal studs. The heat conductive element, thermal studs, and substrate are thermally coupled to draw heat from the laser diode.

Abstract: An apparatus includes a structure including a waveguide and a pocket adjacent to an input facet of the waveguide. A laser has an output facet and is positioned in the pocket. A stop is included one at least one of the laser and a wall of the pocket. The stop is positioned at an interface between the laser and the wall of the pocket such that the output facet of the laser and the input facet of the waveguide are separated by a gap.

Abstract: An apparatus includes a crystalline substrate. A cleaving guide on the substrate is positioned over a cleave plane of the crystalline substrate and positioned in a known location with respect to a feature of an electronic device on the substrate. Cleaving of the substrate along the cleave plane changes a physical characteristic of the cleaving guide and measurement of the physical characteristic provides a parameter representative of the relative position of the cleave plane and the cleaving guide.

Abstract: A fluid dynamic bearing formed by a microelectromechanical systems (MEMS) wafer-level batch-fabrication process is provided. The process results in a high performance and high reliability fluid dynamic bearing having features including higher bearing lifetime at high RPM, improved bearing stiffness, durability and thrust/restoring forces capabilities. The present invention is especially useful with small form factor disc drive memory devices having constraints in motor height, such as a 2.5 inch disc drive, requiring high performance including high rotational speed and large areal density. A sacrificial layer is utilized in the process to simultaneously form symmetrical facing surfaces of relatively rotatable components. The facing surfaces define, therebetween, a desired feature, such as a journal bearing, a thrust bearing, a fluid channel, a fluid reservoir, a capillary seal, pressure generating grooves, and other profile geometries.

Abstract: The application discloses processes for fabricating a slider or head for a data storage device. The processes disclosed provide a transducer portion that is separated from a slider body by a gap. In an illustrated embodiment, actuator elements are fabricated in the gap to adjust a position of the transducer portion relative to the slider body.

Abstract: A device comprises a fluid bearing including a textured fluid bearing surface and a second surface and a recordable disc. The recordable disc includes a substrate, a recordable media layer on the substrate, and at least one of the textured fluid bearing surface and the second surface. The device may be manufactured using MEMS techniques. MEMS techniques provide the high precision necessary to create the textured fluid bearing surface. MEMS techniques also allow the recordable disc to be batch-fabricated with one or more additional recordable discs.

Abstract: A disc drive head actuator includes a suspension structure and a slider integrated with the suspension structure. The actuator is one of at least two actuator assemblies batch-fabricated on a common substrate. The head actuator may be fabricated using mircofabrication techniques. The head actuator may have a reduced size, including package height relative to conventionally manufactured disc drives. Using mircofabrication and/or batch fabrication techniques provides reduced tolerances, which allows for increased actuation forces and/or reduced power consumption. Some embodiments include four-bar linkage actuators, which increase lateral stiffness of the actuator, allowing for a precise motion of the head relative to a media surface.

Abstract: A device comprises a recordable disc, a substrate adjacent to the recordable disc, and an actuation mechanism fixed to the substrate. The recordable disc includes a base layer and a recordable layer on the base layer. Additional electrodes or magnetic components may be placed on the base layer to provide electromagnetic or electrostatic forces to rotate the recordable disc when acted on by the actuation mechanism. As an example, the invention may utilize MEMS techniques in order to integrate a disc and motor of a disc drive as a common component.

Abstract: In general, the invention is directed to techniques for integrated interconnects with a set of disc drives. The interconnects allow for a set of disc drives to be positioned in an array; for example, as set of disc drives may be stacked to communicate with a device through a single interface of the device. The interconnects may be formed as vias within the housing of the disc drives. Vias may produced using MEMS techniques, e.g., electroplating, as part of the manufacturing processes of the disc drive itself.

Abstract: A micro-electromechanical systems (MEMS) disc drive includes high-precision and integrated components to allow for increased functionality, robustness and reduced size as compared to currently produced disc drives. Integrating multiple subcomponents of the disc drive using batch processing provides low manufacturing costs. Furthermore, using MEMS techniques, new features can be added to disc drives. For example, an environmental control component, an accelerometer and/or a thermometer may be integrated into the housing of the disc drive.

Abstract: A transducer-level microactuator selectively positions a transducer portion of a slider radially with respect to circumferential data tracks of a rotatable disc. The slider includes a slider body having a leading edge and a trailing edge, a transducer body and a flexure body. The transducer body is spaced from the trailing edge of the sliding body and includes at least one transducer element. The flexure body extends from the trailing edge of the slider body and includes a first anchor point connected to the slider body and a second anchor point connected to the transducer body. The basecoat layer is deposited on the trailing edge of the slider body and substantially surrounds the flexure body wherein a gap separates the flexure body from the basecoat. A first actuation assembly is formed on the basecoat and a second actuation assembly is formed on the transducer body adjacent the slider body.

Abstract: A method is used for fabricating sliders for use in a disc drive actuation system, the sliders having bonds pads formed on either a top surface or side faces of the slider. The method comprises providing a substrate having a top surface. Trenches are formed in the substrate and filled with a bond pad material to form slider bond pads. Excess bond pad material is removed from the trenches such that the slider bond pads are flush with the top surface of the substrate. A transducer is fabricated on the top surface of the substrate. Finally, the slider bond pads are exposed.