Abstract: A robotic sorting system, method, and device is disclosed. The robotic sorting system includes a communication interface, and one or more processors coupled to the communication interface. The one or more processors are configured to (a) obtain item data via the communication interface, the item data including an indication of one or more items to be routed across a plurality of outbound stations, (b) obtain capability data for the plurality of outbound stations, the capability data indicating one or more capabilities for at least one outbound station, (c) determine a plan to route a selected item to a destination outbound station selected from among the plurality of outbound station, the plan being determined based at least in part on the item data and the capability data for the destination outbound station, and (d) cause the plan to be implemented to route the item to a particular handling path associated with the destination outbound station.

Abstract: A containerized robotic system is disclosed. The containerized robotic system includes a base having a first attachment area configured to securely mount a robot and a second attachment area configured to securely mount a compressor, the base further including a set of one or more channels to provide an electrical connection to supply power to the robot and the compressor, respectively, and to provide compressed air from the compressor to the robot, a detachable superstructure configured to be removably connected to the base to define an enclosed space of sufficient size to accommodate at least the robot and the compressor, and a power distribution unit secured to the base and coupled to receive electrical power as input and to provide electrical power to the robot and the compressor via the set of one or more channels.

Abstract: Techniques are disclosed to use robotic system simulation to control a robotic system. In various embodiments, a communication indicating an action to be performed by a robotic element is received from a robotic control system. Performance of the action by the robotic element is simulated. A state tracking data is updated to reflect a virtual change to one or more state variables as a result of simulated performance of the action. Successful completion of the action by the robotic element is reported to the robotic control system.

Abstract: Techniques are disclosed to perform robotic handling of soft products in non-rigid packaging. In various embodiments, sensor data associated with a workspace is received. An action to be performed in the workspace using one or more robotic elements is determined, the action including moving an end effector of one of the robotic elements relatively quickly to a location in proximity to an item to be grasped; actuating a grasping mechanism of the end effector to grasp the item using an amount of force and structures associated with minimized risk of damage to one or both of the item and its packaging; and using sensor data generated subsequent to the item being grasped to ensure the item has been grasped securely. Control communications are sent to the robotic element via the communication interface to cause robotic element to perform the action.

Abstract: Techniques are disclosed to perform robotic handling of soft products in non-rigid packaging. In various embodiments, sensor data associated with a workspace is received. An action to be performed in the workspace using one or more robotic elements is determined, the action including moving an end effector of one of the robotic elements relatively quickly to a location in proximity to an item to be grasped; actuating a grasping mechanism of the end effector to grasp the item using an amount of force and structures associated with minimized risk of damage to one or both of the item and its packaging; and using sensor data generated subsequent to the item being grasped to ensure the item has been grasped securely. Control communications are sent to the robotic element via the communication interface to cause robotic element to perform the action.

Abstract: A containerized robotic system is disclosed. The containerized robotic system includes a base having a first attachment area configured to securely mount a robot and a second attachment area configured to securely mount a compressor, the base further including a set of one or more channels to provide an electrical connection to supply power to the robot and the compressor, respectively, and to provide compressed air from the compressor to the robot, a detachable superstructure configured to be removably connected to the base to define an enclosed space of sufficient size to accommodate at least the robot and the compressor, and a power distribution unit secured to the base and coupled to receive electrical power as input and to provide electrical power to the robot and the compressor via the set of one or more channels.

Abstract: Techniques are disclosed to use robotic system simulation to control a robotic system. In various embodiments, a communication indicating an action to be performed by a robotic element is received from a robotic control system. Performance of the action by the robotic element is simulated. A state tracking data is updated to reflect a virtual change to one or more state variables as a result of simulated performance of the action. Successful completion of the action by the robotic element is reported to the robotic control system.

Abstract: Techniques are disclosed to perform robotic handling of soft products in non-rigid packaging. In various embodiments, sensor data associated with a workspace is received. An action to be performed in the workspace using one or more robotic elements is determined, the action including moving an end effector of one of the robotic elements relatively quickly to a location in proximity to an item to be grasped; actuating a grasping mechanism of the end effector to grasp the item using an amount of force and structures associated with minimized risk of damage to one or both of the item and its packaging; and using sensor data generated subsequent to the item being grasped to ensure the item has been grasped securely. Control communications are sent to the robotic element via the communication interface to cause robotic element to perform the action.

Abstract: An improved electronic module assembly and method of fabrication is disclosed. A patterned array of adhesive is deposited on a laminate, to which a chip is attached. Each region of adhesive is referred to as a lid tie. A lid is placed on the laminate, and is in contact with the lid ties. The lid ties serve to add stability to the laminate and reduce flexing during thermal processing and mechanical stress.

Abstract: An improved electronic module assembly and method of fabrication is disclosed. A patterned array of adhesive is deposited on a laminate, to which a chip is attached. Each region of adhesive is referred to as a lid tie. A lid is placed on the laminate, and is in contact with the lid ties. The lid ties serve to add stability to the laminate and reduce flexing during thermal processing and mechanical stress.

Abstract: An improved electronic module assembly and method of fabrication is disclosed. A patterned array of adhesive is deposited on a laminate, to which a chip is attached. Each region of adhesive is referred to as a lid tie. A lid is placed on the laminate, and is in contact with the lid ties. The lid ties serve to add stability to the laminate and reduce flexing during thermal processing and mechanical stress.

Abstract: An improved electronic module assembly and method of fabrication is disclosed. A patterned array of adhesive is deposited on a laminate, to which a chip is attached. Each region of adhesive is referred to as a lid tie. A lid is placed on the laminate, and is in contact with the lid ties. The lid ties serve to add stability to the laminate and reduce flexing during thermal processing and mechanical stress.

Abstract: Disclosed is a method, system, and computer program storage product for optimizing land grid array site geometry on an electronic assembly mounting. A first member including at least one convex region is aligned with a first portion of an electronic assembly mounting. A second member is aligned with a second portion of the electronic assembly mounting. The second portion includes at least one concave region corresponding to the convex region of the first portion. The second member includes a dome-shaped region having a predefined geometry. Heat is applied to at least one of the electronic assembly mounting, the first member, and the second member. Pressure is applied to at least one of the first member and the second member to reshape the convex region into a substantially flat surface. Applying pressure also reshapes the concave region into a geometry corresponding to the predefined geometry of the dome-shaped region.

Abstract: Disclosed is a method, system, and computer program storage product for optimizing land grid array site geometry on an electronic assembly mounting. A first member including at least one convex region is aligned with a first portion of an electronic assembly mounting. A second member is aligned with a second portion of the electronic assembly mounting. The second portion includes at least one concave region corresponding to the convex region of the first portion. The second member includes a dome-shaped region having a predefined geometry. Heat is applied to at least one of the electronic assembly mounting, the first member, and the second member. Pressure is applied to at least one of the first member and the second member to reshape the convex region into a substantially flat surface. Applying pressure also reshapes the concave region into a geometry corresponding to the predefined geometry of the dome-shaped region.

Abstract: A communication and intelligence gathering system and method for monitoring a crisis scene from a remote command post. The system includes an access node positioned within communication range of multiple observation platforms that each provide information relating to the crisis scene, such as a video feed. The access node communicates with a main transfer module that relays the audio/video/data from the crisis scene to a main transfer module remotely positioned. A second main transfer module communicates with a field command post such that personnel at the field command post can monitor, react to and manage the crisis situation from the remote location. The access node position near the crisis scene also communications video and relevant information to field agents such that the field agents can monitor the video and information from a hand held/portable device.

Abstract: An apparatus for applying solder to an electronic circuit board substrate includes a solder wave device for generating a molten wave of solder and, above that, a movable substrate holder. The substrate holder includes a support for an electronic circuit board substrate inclined at an angle with respect to the direction and an opening on a bottom thereof for access of a protruding connector disposed near an end of the substrate to the molten solder wave. The angle of incline is sufficient to prevent a component disposed at a distance from the end of the substrate from contacting the molten solder wave when the substrate holder is moved over the solder wave device. A shield in the substrate holder prevents the component not to be soldered from contacting the molten solder wave.

Abstract: A heat sink attachment structure includes an integrated circuit chip mounted on a substrate surface, and a thermal interface layer in contact with the integrated circuit chip. A heat sink is in contact with the thermal interface layer, and at least one spacer member is in contact between the substrate surface and the heat sink, wherein the at least one spacer member is provided with an adhesive material on top and bottom surfaces thereof.

Abstract: An apparatus for applying solder to an electronic circuit board substrate includes a solder wave device for generating a molten wave of solder and, above that, a movable substrate holder. The substrate holder includes a support for an electronic circuit board substrate inclined at an angle with respect to the direction and an opening on a bottom thereof for access of a protruding connector disposed near an end of the substrate to the molten solder wave. The angle of incline is sufficient to prevent a component disposed at a distance from the end of the substrate from contacting the molten solder wave when the substrate holder is moved over the solder wave device. A shield in the substrate holder prevents the component not to be soldered from contacting the molten solder wave.

Abstract: A method in which an alignment tool consisting of a nest and guide tool is used to align an LGA module in the nest and then the LGA module is removed from the nest and aligned with a circuit card by the use of the guide tool.

Abstract: A method in which an alignment tool consisting of a nest and guide tool is used to align an LGA module in the nest and then the LGA module is removed from the nest and aligned with a circuit card by the use of the guide tool.