Abstract: A combined pressure and temperature transducer (10) particularly adapted for high temperature fluids has a sensing element assembly mounted at the tip of a tubular probe (20) which is arranged for placement in a fluid flow path. A sensing element (12) includes a pressure responsive diaphragm (12g) closing the open end of the tubular probe and being provided with piezo-resistive gauge elements bonded to the diaphragm. Wires are bonded between the gauge elements and a first, heat resistant, printed circuit board (PCB). The first PCB, together with the piezo-resistive elements, form a Wheatstone bridge. An inner connector (26) mounts elongated, axial stress absorbing contacts connecting the first PCB at one end of the inner connector with a second printed circuit board (PCB) mounted at the opposite end of the inner connector physically removed from the sensing element and first PCB and away from the fluid flow path. The second PCB mounts signal conditioning and amplifying electronics.