Patents by Inventor Roger M. Arbuthnot

Roger M. Arbuthnot has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGE
    Publication number: 20110169152
    Abstract: In one embodiment, a semiconductor package is formed to include a leadframe that includes a plurality of die attach areas for attaching a semiconductor die to the leadframe. The leadframe is positioned to overlie another leadframe that forms some of the external terminals or leads of the package.
    Type: Application
    Filed: March 22, 2011
    Publication date: July 14, 2011
    Inventors: Stephen St. Germain, Roger M. Arbuthnot, Frank Tim Jones
  • Method of forming a semiconductor package and structure therefor
    Patent number: 7935575
    Abstract: In one embodiment, a semiconductor package is formed to include a leadframe that includes a plurality of die attach areas for attaching a semiconductor die to the leadframe. The leadframe is positioned to overlie another leadframe that forms some of the external terminals or leads of the package.
    Type: Grant
    Filed: April 7, 2008
    Date of Patent: May 3, 2011
    Assignee: Semiconductor Components Industries, LLC
    Inventors: Stephen St. Germain, Roger M. Arbuthnot, Frank Tim Jones
  • METHOD OF FORMING A SEMICONDUCTOR PACKAGE AND STRUCTURE THEREFOR
    Publication number: 20090250794
    Abstract: In one embodiment, a semiconductor package is formed to include a leadframe that includes a plurality of die attach areas for attaching a semiconductor die to the leadframe. The leadframe is positioned to overlie another leadframe that forms some of the external terminals or leads of the package.
    Type: Application
    Filed: April 7, 2008
    Publication date: October 8, 2009
    Inventors: STEPHEN ST. GERMAIN, Roger M. Arbuthnot, Frank Tim Jones