Patents by Inventor Roger McQuaid

Roger McQuaid has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interconnects through dielectric vias
    Patent number: 9780028
    Abstract: A dielectric layer includes a reflow via. The reflow via is formed by reflow of the dielectric layer away from a raised feature. An interconnect is in contact with the raised feature through the reflow via.
    Type: Grant
    Filed: November 29, 2016
    Date of Patent: October 3, 2017
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Kevin Dooley, Roger McQuaid, Liam Cheevers, David Fitzpatrick, Lorraine Byrne
  • INTERCONNECTS THROUGH DIELECTRIC VIAS
    Publication number: 20170084533
    Abstract: A dielectric layer includes a reflow via. The reflow via is formed by reflow of the dielectric layer away from a raised feature. An interconnect is in contact with the raised feature through the reflow via.
    Type: Application
    Filed: November 29, 2016
    Publication date: March 23, 2017
    Inventors: Kevin Dooley, Roger McQuaid, Liam Cheevers, David Fitzpatrick, Lorraine Byrne
  • Interconnects through dielecric vias
    Patent number: 9583432
    Abstract: A dielectric layer includes a reflow via. The reflow via is formed by reflow of the dielectric layer. An interconnect is in contact through the reflow via.
    Type: Grant
    Filed: January 29, 2013
    Date of Patent: February 28, 2017
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Kevin Dooley, Roger McQuaid, Liam Cheevers, David Fitzpatrick, Lorraine Byrne
  • INTERCONNECTS THROUGH DIELECRIC VIAS
    Publication number: 20160104675
    Abstract: A dielectric layer includes a reflow via. The reflow via is formed by reflow of the dielectric layer. An interconnect is in contact through the reflow via.
    Type: Application
    Filed: January 29, 2013
    Publication date: April 14, 2016
    Inventors: Kevin Dooley, Roger McQuaid, Liam Cheevers, David Fitzpatrick, Lorraine Byrne