Patents by Inventor Roger Mock

Roger Mock has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness
    Publication number: 20070069348
    Abstract: An integrated circuit package includes a first non-conductive substrate having a first inner surface and a second non-conductive substrate having a second inner surface. A die having a first thickness is disposed between the first and second inner surfaces. A leadframe includes a member having a proximal end and a distal end. The proximal end has a second thickness less than the first thickness. The distal end is disposed between the first and second inner surfaces. The distal end is undulated such that the distal end has an effective thickness greater than the second thickness.
    Type: Application
    Filed: October 5, 2006
    Publication date: March 29, 2007
    Inventors: Roger Mock, Erich Gerbsch
  • Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness
    Publication number: 20050179123
    Abstract: An integrated circuit package includes a first non-conductive substrate having a first inner surface and a second non-conductive substrate having a second inner surface. A die having a first thickness is disposed between the first and second inner surfaces. A leadframe includes a member having a proximal end and a distal end. The proximal end has a second thickness less than the first thickness. The distal end is disposed between the first and second inner surfaces. The distal end is undulated such that the distal end has an effective thickness greater than the second thickness.
    Type: Application
    Filed: February 17, 2004
    Publication date: August 18, 2005
    Inventors: Roger Mock, Erich Gerbsch