Patents by Inventor Roger Nguyen

Roger Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mobile turbine blade with an improved design for an aircraft turbomachine
    Patent number: 10526906
    Abstract: A turbine blade for an aircraft turbomachine including a root, an airfoil and a platform inserted between the airfoil and the root and delimiting a gas circulation flowpath, the platform having two axial ends each forming an angel wing of which at least one has an internal cavity that will be supplied with air from the root of the blade. At least one of the two angel wings is drilled with at least one bleed hole for passage of a bleed flow from the internal cavity that will limit/prevent gas recirculation outside the flowpath.
    Type: Grant
    Filed: March 25, 2016
    Date of Patent: January 7, 2020
    Assignee: SNECMA
    Inventors: David Thien-Roger Nguyen, Franck Boisnault, Maurice Guy Judet, Laetitia Person
  • Vacuum pallet reflow
    Patent number: 9839142
    Abstract: A soldering device and method of soldering are disclosed. The device may include at least one soldering pallet assembly. The pallet assembly may be subjected to a first atmosphere configured within the soldering pallet assembly and a second atmosphere configured external to the pallet assembly, the second atmosphere is an ambient atmosphere. At least one solder element may be positioned within the first atmosphere, and the solder element may be configured to attach an electrical component to an integrated circuit chip that is positioned within the pallet assembly.
    Type: Grant
    Filed: August 6, 2015
    Date of Patent: December 5, 2017
    Assignee: IMI USA, Inc.
    Inventors: Timothy P. Patterson, William Lutap, Roger Nguyen
  • MOBILE TURBINE BLADE WITH AN IMPROVED DESIGN FOR AN AIRCRAFT TURBOMACHINE
    Publication number: 20160281525
    Abstract: A turbine blade for an aircraft turbomachine including a root, an airfoil and a platform inserted between the airfoil and the root and delimiting a gas circulation flowpath, the platform having two axial ends each forming an angel wing of which at least one has an internal cavity that will be supplied with air from the root of the blade. At least one of the two angel wings is drilled with at least one bleed hole for passage of a bleed flow from the internal cavity that will limit/prevent gas recirculation outside the flowpath.
    Type: Application
    Filed: March 25, 2016
    Publication date: September 29, 2016
    Applicant: SNECMA
    Inventors: David Thien-Roger NGUYEN, Franck Boisnault, Maurice Guy Judet, Laetitia Person
  • Vacuum Pallet Reflow
    Publication number: 20150342061
    Abstract: A soldering device and method of soldering are disclosed. The device may include at least one soldering pallet assembly. The pallet assembly may be subjected to a first atmosphere configured within the soldering pallet assembly and a second atmosphere configured external to the pallet assembly, the second atmosphere is an ambient atmosphere. At least one solder element may be positioned within the first atmosphere, and the solder element may be configured to attach an electrical component to an integrated circuit chip that is positioned within the pallet assembly.
    Type: Application
    Filed: August 6, 2015
    Publication date: November 26, 2015
    Inventors: Timothy P. Patterson, William Lutap, Roger Nguyen
  • VACUUM PALLET REFLOW
    Publication number: 20120273559
    Abstract: A soldering device and method of soldering are disclosed. The device may include at least one soldering pallet assembly. The pallet assembly may be subjected to a first atmosphere configured within the soldering pallet assembly and a second atmosphere configured external to the pallet assembly, the second atmosphere is an ambient atmosphere. At least one solder element may be positioned within the first atmosphere, and the solder element may be configured to attach an electrical component to an integrated circuit chip that is positioned within the pallet assembly.
    Type: Application
    Filed: April 27, 2012
    Publication date: November 1, 2012
    Inventors: Timothy P. Patterson, William Lutap, Roger Nguyen