Patents by Inventor Roger P. Stout

Roger P. Stout has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low thermal resistance semiconductor device and method therefor
    Patent number: 7138315
    Abstract: A semiconductor device is formed to have a shape that reduces the thermal resistance of the semiconductor device.
    Type: Grant
    Filed: October 14, 2004
    Date of Patent: November 21, 2006
    Assignee: Semiconductor Components Industries, L.L.C.
    Inventors: Narayan Raja, Roger P. Stout
  • Method of forming a low thermal resistance device and structure
    Patent number: 7022564
    Abstract: A semiconductor device is formed to have a shape that reduces the thermal resistance of the semiconductor device.
    Type: Grant
    Filed: October 14, 2004
    Date of Patent: April 4, 2006
    Assignee: Semiconductor Components Industries, L.L.C.
    Inventors: Narayan Raja, Roger P. Stout
  • Apparatus for and methods of die bonding
    Patent number: 4876791
    Abstract: This invention relates to apparatus for and methods of bonding a component to a substrate. More particularly, this invention relates to apparatus for and methods of removing small components, such a dies or other electrical components, from a wafer and bonding the components to a substrate.
    Type: Grant
    Filed: March 21, 1988
    Date of Patent: October 31, 1989
    Assignee: Kulicke & Soffa Industries, Inc.
    Inventors: Gerard H. Michaud, James H. Graham, Roger P. Stout
  • Apparatus for and methods of die bonding
    Patent number: 4797994
    Abstract: Apparatus for and methods of bonding electrical components or semiconductor chips to a substrate or lead frame is disclosed. According to the present invention, a sawn semiconductor wafer is held upside down in a first substantially horizontal plane and the substrate or lead frame to which it is to be bound is held in a second plane which is below and substantially parallel to the first plane. A die eject head located above the sawn wafer cooperates with a die bond head located between the wafer and the substrate to remove an individual die from the sawn wafer. The die bond head then rotates about an axis which is parallel to both planes and places the die on the lead frame. Also included is a transducer means which is responsive to electrical stimulus for actuating the die eject head and the die bond head such that the interactive force between the heads and the component may be precisely controlled.
    Type: Grant
    Filed: March 21, 1988
    Date of Patent: January 17, 1989
    Assignee: Kulicke & Soffa Industries, Inc.
    Inventors: Gerard H. Michaud, James H. Graham, Roger P. Stout
  • Die pick mechanism for automatic assembly of semiconductor devices
    Patent number: 4749329
    Abstract: Automatic assembly equipment for semiconductor devices comprises die or chip selection, transport, and bonding operations coordinated to obtain high production rates. Die selection means comprises a capillary and a needle, positioned on opposite sides of the wafer, which act together to lift the chip out of the plane of the wafer and load the capillary. The transport mechanism comprises a sheave driven carriage for transporting the chip without subjecting the chip to excessive acceleration. The bonding apparatus comprises a slot and gear arrangement for transporting and locating a lead frame and a heater for bonding the chip to the appropriate part of the lead frame.
    Type: Grant
    Filed: December 6, 1982
    Date of Patent: June 7, 1988
    Assignee: Motorola, Inc.
    Inventor: Roger P. Stout
  • Voice coil linear motor with integral capacitor
    Patent number: 4498023
    Abstract: A voice coil linear motor is described in which the armature is supported on a linear bearing attached to the magnet assembly. The magnet assembly comprises a permanent magnet attached to two cup-shaped members which define a gap in which the armature travels. The armature comprises a coil, capacitive position sensing means, and a spindle for a chuck or other device.
    Type: Grant
    Filed: October 31, 1983
    Date of Patent: February 5, 1985
    Assignee: Motorola, Inc.
    Inventor: Roger P. Stout