Patents by Inventor Roger Paul STOUT

Roger Paul STOUT has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SUBSTRATE STRUCTURES AND METHODS OF MANUFACTURE
    Publication number: 20220375833
    Abstract: Implementations of semiconductor packages may include a metallic baseplate, a first insulative layer coupled to the metallic baseplate, a first plurality of metallic traces, each metallic trace of the first plurality of metallic traces coupled to the electrically insulative, one or more semiconductor devices coupled to each one of the first plurality of metallic traces, a second plurality of metallic traces coupled to the one or more semiconductor devices, and a second insulative layer coupled to the metallic traces of the second plurality of metallic traces.
    Type: Application
    Filed: August 1, 2022
    Publication date: November 24, 2022
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Yusheng LIN, Roger Paul STOUT, Chee Hiong CHEW, Sadamichi TAKAKUSAKI, Francis J. CARNEY
  • Substrate structures and methods of manufacture
    Patent number: 11437304
    Abstract: Implementations of semiconductor packages may include a metallic baseplate, a first insulative layer coupled to the metallic baseplate, a first plurality of metallic traces, each metallic trace of the first plurality of metallic traces coupled to the electrically insulative, one or more semiconductor devices coupled to each one of the first plurality of metallic traces, a second plurality of metallic traces coupled to the one or more semiconductor devices, and a second insulative layer coupled to the metallic traces of the second plurality of metallic traces.
    Type: Grant
    Filed: February 23, 2017
    Date of Patent: September 6, 2022
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Yusheng Lin, Roger Paul Stout, Chee Hiong Chew, Sadamichi Takakusaki, Francis J. Carney
  • HEATSINK FOR THERMAL RESPONSE CONTROL FOR INTEGRATED CIRCUITS
    Publication number: 20210320054
    Abstract: A semiconductor device package includes a leadframe, and a heatsink bonded to the leadframe. A semiconductor device may be mounted using the leadframe and positioned such that heat generated by the semiconductor device is conducted by the heatsink, with molding that encapsulates the leadframe, the heatsink, and the semiconductor device.
    Type: Application
    Filed: April 13, 2020
    Publication date: October 14, 2021
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Hiroshi INOGUCHI, Takashi NAGASHIMA, Roger Paul STOUT, Namrata KANTH
  • SUBSTRATE STRUCTURES AND METHODS OF MANUFACTURE
    Publication number: 20170162481
    Abstract: Implementations of semiconductor packages may include a metallic baseplate, a first insulative layer coupled to the metallic baseplate, a first plurality of metallic traces, each metallic trace of the first plurality of metallic traces coupled to the electrically insulative, one or more semiconductor devices coupled to each one of the first plurality of metallic traces, a second plurality of metallic traces coupled to the one or more semiconductor devices, and a second insulative layer coupled to the metallic traces of the second plurality of metallic traces.
    Type: Application
    Filed: February 23, 2017
    Publication date: June 8, 2017
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Yusheng LIN, Roger Paul STOUT, Chee Hiong CHEW, Sadamichi TAKAKUSAKI, Francis J. CARNEY