Abstract: The present invention relates to a resin composition comprising an at least bifunctional prepolymer (A) curable under the action of heat, a telechelic elastomer and a particulate material having an elastomeric core and a thermoplastic shell. Layers and patterns which are produced using the formulation according to the invention have excellent adhesion properties, chemical stability, good electrical properties and high resistance to rapid temperature ranges. The compositions are suitable in particular as solder resists in the production of circuit boards.

Abstract: The invention relates to a composition compriseing an at least bifunctional acidic prepolymer (A) curable under the action of heat an compound of the formula (I) in which A is a mono- to tetravalent, saturated or unsaturated alkyl group having 1 to 60 carbon atoms, a mono- to tetravalent aryl group, a mono- or diaiylamino group having 1 to 4 carbon atoms, an alkenylene group having 2 to 4 carbon atoms, a carboxyalkylene group or an alkoxycarbonylalkylene group having 1 to 4 carbon atoms, n is 1 or 2, m is 2-n, q is a number from 0 to 3, R1 is hydrogen or an alkyl group having 1 to 5 carbon atoms or a hydroxyalkyl group having 1 to 5 carbon atoms and X is a radical of the formula in which R3 and R4 are identical or different and, independently of one another, are hydrogen, a straight-chain or branched alkyl group or hydroxyalkyl group having 1 to 5 carbon atoms, or R3 and R4, together with the carbon atom to which they are bonded, form a cycloaliphatic ring.

Abstract: The claimed invention relates to a method for coating a substrate, preferably a printed circuit board, comprising the step of applying to said substrate surface a photopolymerizable water-borne aqueous-alkaline developable coating composition. The novel composition comprises a certain film-forming, acid group-containing acrylated derivative of an epoxy resin which is sufficiently neutralized with ammonia or an amine or an inorganic base to promote the formation of the corresponding ammonium or amine or inorganic base carboxylates by a neutralization reaction; a photoinitiator; water; and, optional components; as well as one or more additional optional (meth)acrylate monomer or (meth)acrylate oligomer or a vinyl compound that can be crosslinked with light. The method produces coated substrates that are non-tacky after drying and that have good edge coverage.

Abstract: Photopolymerisable compositions are described which comprisea) 20 to 80% by weight of a specific film-forming, acid group-containing acrylate of higher molecular weight which is neutralised with ammonia or an amine or an inorganic base, at least 10% by weight of component a) consisting of a acrylate of higher molecular weight which is derived from a reaction product of a polymolecular epoxy resin that is advanced with a bisphenol and an ethylenically unsaturated monocarboxylic acid and after subsequent reaction with a cyclic anhydride of an organic polycarboxylic acid,b) 0.1 to 15% by weight of a photoinitiator,c) 1 to 25% by weight of optional components, andd) water, as well ase) at least one additional optional (meth)acrylate monomer or (meth)acrylate oligomer or a vinyl compound that can be crosslinked with light.The compositions contain no additional polymolecular polymer binders and which can be used as aqueous applicable photoresist compositions, preferably for coating printed circuit boards.

Abstract: There are disclosed photosensitive compositions based on water as solvent and/or dispersant for the components of said compositions, comprising 10-50% by weight of water-soluble and/or water-dispersible solid, crosslinkable film-forming polymers as binder, 4-50% by weight of water-soluble and/or water-dispersible photopolymerisable acrylate and/or methacrylate monomers and/or corresponding oligomers, 0.1 to 10% by weight of water-soluble and/or water-dispersible photoinitiator compounds for the photopolymerisable acrylate and/or methacrylate monomers and/or corresponding oligomers, and if the binder contains non-selfcrosslinking polymers, 2.5-40% by weight of water-soluble and/or water-dispersible crosslinking agents for the polymeric binder as thermal hardener, selected from the group consisting of epoxy resins, melamine resins and blocked polyisocyanates.