Abstract: A cooler having a unitary construction including a channel portion including a plurality of fins on a base, the plurality of fins defining a plurality of microchannels therebetween, a tapered opening formed in a set of the plurality of fins, a manifold portion disposed on an edge portion of the base, the manifold portion including an inlet port and an outlet port disposed above the tapered opening in the plurality of fins, and a separator sheet including at least two elongated openings disposed between the channel portion and the manifold portion.

Abstract: A cooler having a unitary construction including a channel portion including a plurality of fins on a base, the plurality of fins defining a plurality of microchannels therebetween, a tapered opening formed in a set of the plurality of fins, a manifold portion disposed on an edge portion of the base, the manifold portion including an inlet port and an outlet port disposed above the tapered opening in the plurality of fins, and a separator sheet including at least two elongated openings disposed between the channel portion and the manifold portion.

Abstract: A cooler having a unitary construction including a channel portion including a plurality of fins on a base, the plurality of fins defining a plurality of microchannels therebetween, a tapered opening formed in a set of the plurality of fins, a manifold portion disposed on an edge portion of the base, the manifold portion including an inlet port and an outlet port disposed above the tapered opening in the plurality of fins, and a separator sheet including at least two elongated openings disposed between the channel portion and the manifold portion.

Abstract: Apparatus and methods are provided for packaging multi-chip modules with liquid cooling modules designed to provide different thermal resistances for effectively conducting heat from various chips with disparate cooling requirements while minimizing mechanical stresses in thermal bonds due to thermal excursions.

Abstract: A cooler having a unitary construction including a channel portion including a plurality of fins on a base, the plurality of fins defining a plurality of microchannels therebetween, a tapered opening formed in a set of the plurality of fins, a manifold portion disposed on an edge portion of the base, the manifold portion including an inlet port and an outlet port disposed above the tapered opening in the plurality of fins, and a separator sheet including at least two elongated openings disposed between the channel portion and the manifold portion.

Abstract: Apparatus and methods are provided for packaging multi-chip modules with liquid cooling modules designed to provide different thermal resistances for effectively conducting heat from various chips with disparate cooling requirements while minimizing mechanical stresses in thermal bonds due to thermal excursions.

Abstract: In a system for liquid cooling of electronics, where the electronics are subject to rotation in space, a liquid coolant storage tank includes a degassing and vortex-preventing structure to allow bubbles to float to the surface of the liquid inside the tank, and also to prevent vortices from forming near the outlet from the tank. The structure includes nested tubes or conduits. An inner conduit extends from the inlet into the tank, and its open end is covered by a second conduit with a baffle across its end, so that the flow is directed by the baffle to flow back along the outside of the inner conduit, and inside of the outer conduit. Especially at the inlet, a third conduit with large perforations surrounds the open end of the outer conduit. Smaller perforations on the inner conduit at the outlet side discourage any vortex from forming there. Reversal of the liquid flow, and the gradual increase in flow cross section prevent surging inside the tank.

Abstract: Apparatus and methods are provided for microchannel cooling of electronic devices such as IC chips, which enable efficient and low operating pressure microchannel cooling of high power density electronic devices. Apparatus for microchannel cooling include integrated microchannel heat sink devices and fluid distribution manifold structures that are designed to provide uniform flow and distribution of coolant fluid and minimize pressure drops along coolant flow paths.

Abstract: Apparatus and methods are provided for microchannel cooling of electronic devices such as IC chips, which enable efficient and low operating pressure microchannel cooling of high power density electronic devices having a non-uniform power density distribution, which are mounted face down on a package substrate. For example, integrated microchannel cooler devices (or microchannel heat sink devices) for cooling IC chips are designed to provide uniform flow and distribution of coolant fluid and minimize pressure drops along coolant flow paths, as well as provide variable localized cooling capabilities for high power density regions (or “hot spots”) of IC chips with higher than average power densities.

Abstract: An exemplary embodiment of the invention is a fixture for mounting a pin grid array device. The fixture includes a base plate and a first support plate movably mounted to the base plate. The first support plate has a hole therein for receiving a pin on the pin grid array device. The hole has a longitudinal axis in a first direction. A contact is positioned in the hole a drive mechanism moves the first support plate in a second direction substantially perpendicular to the first direction to move the contact. The contact engages the pin of the pin grid array device to establish electrical contact.

Abstract: A test probe head has a plurality of electrically conducting wire members held in place in a frame by movable plates. The wire members are threaded through apertures in the plates and the plates are moved relative to each other to bend the wires to thereby hold the wires in position in the frame. The wires are used to make physical contact with both a support substrate for the test probe head and an integrated circuit under test. The physical contact of the wires with both the substrate and the integrated circuit provides electrical connections between the pads in the support substrate and those on the integrated circuit to perform the testing of the integrated circuit. With this arrangement, there is no bonding of the wires to the pads of the support substrate. The elimination of the bonding to the pads of the support substrate eliminates a major cause of probe head failures.

Abstract: A method of cooling electronic devices in an electronic assembly is proposed where the said assembly has at least one board that houses electronic modules. The methodology comprises shaping a light weight plate with apertures as to compliment the geometric shape of the assembly and board to be cooled; affixing coolant passage tubes in the apertures of the plate and finally cooling the electronic assembly by placing the assembly in thermal contact with the plate and passage tubes after a coolant is introduced in the passages.

Abstract: A method of cooling electronic devices in an electronic assembly is proposed where the said assembly has at least one board that houses electronic modules. The methodology comprises shaping a light weight plate with apertures as to compliment the geometric shape of the assembly and board to be cooled; affixing coolant passage tubes in the apertures of the plate and finally cooling the electronic assembly by placing the assembly in thermal contact with the plate and passage tubes after a coolant is introduced in the passages.

Abstract: A specially designed cooling device is proposed comprising of a light weight plate with apertures. Thin walled coolant passage tubes are provided in the apertures for the passage of a coolant. The coolant passages are made out of a material, preferably different than the plate itself and are to provide better heat dissipation than the plate and also prohibit liquid leakage. The cooling device is specially designed to accommodate an electronic assembly's geometry.

Abstract: Heat pipes are employed in conjunction with flexible flap thermal conductors to provide a mechanism for cooling high-powered electronic circuit chip modules which cannot otherwise be cooled by conventional means because of their non-coplanarity and their inaccessibility. More particularly, the present invention provides a mechanism for cooling electronic circuit chip modules which are disposed on circuit boards which are in close proximity to one another which fact precludes air cooling of heat sink structures and/or the imposition of a liquid-cooled cold plate due to the non-coplanarity and/or due to the inaccessibility.

Abstract: A heat sink with fins that extend between first and second conductive plates is cooperatively combined with one or more heat pipes which act to directly transfer heat to an otherwise relatively inefficiently used portion of the cooling fins.