Patents by Inventor Roger Robichaud

Roger Robichaud has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sealed electronic input/output module
    Patent number: 7203070
    Abstract: An electronic module includes an insulative housing and at least one circuit board contained within the housing. A plurality of connectors are coupled to the circuit board, and at least some of the connectors accessible through a surface of the housing. At least one fuse is electrically connected to the circuit board, and an insulative fuse door is sealingly engaged to the housing and positionable with respect to the housing to provide access to the fuse from an exterior of the housing.
    Type: Grant
    Filed: December 3, 2003
    Date of Patent: April 10, 2007
    Assignee: Tyco Electronics Canada, Ltd.
    Inventors: Adam Weisz-Margulescu, Alan Albino, Roger Robichaud
  • Encapsulated electronic sensor package
    Patent number: 7126063
    Abstract: An electronic package includes a circuit board and a capsule layer encasing the circuit board and forming an immersible electronic module. A housing receives the electronic module and forms a protective shell around the electronic module.
    Type: Grant
    Filed: September 29, 2003
    Date of Patent: October 24, 2006
    Assignee: Tyco Electronics Canada, Ltd.
    Inventors: Adam Weisz-Margulescu, Alan Albino, Roger Robichaud
  • Sealed electronic input/output module
    Publication number: 20050122696
    Abstract: An electronic module includes an insulative housing and at least one circuit board contained within the housing. A plurality of connectors are coupled to the circuit board, and at least some of the connectors accessible through a surface of the housing. At least one fuse is electrically connected to the circuit board, and an insulative fuse door is sealingly engaged to the housing and positionable with respect to the housing to provide access to the fuse from an exterior of the housing.
    Type: Application
    Filed: December 3, 2003
    Publication date: June 9, 2005
    Inventors: Adam Weisz, Alan Albino, Roger Robichaud
  • Encapsulated electronic senson package
    Publication number: 20050068746
    Abstract: An electronic package includes a circuit board and a capsule layer encasing the circuit board and forming an immersible electronic module. A housing receives the electronic module and forms a protective shell around the electronic module.
    Type: Application
    Filed: September 29, 2003
    Publication date: March 31, 2005
    Inventors: Adam Weisz-Margulescu, Alan Albino, Roger Robichaud