Patents by Inventor Roger S. DeVilbiss
Roger S. DeVilbiss has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8418478Abstract: A cooling apparatus for removing heat having a low profile unitary member. The low profile unitary member has an evaporator portion and a condenser portion. The evaporator portion is thermally exposed to a heat generating component. The condenser portion is disposed at an elevated angle with respect to the evaporator portion. A plurality of microtubes are disposed within the first low profile extrusion. The plurality of microtubes have a heat transfer fluid contained therein. A second plurality of low profile extrusion members are mounted as fins on the evaporator section of the low profile unitary member. Heat is transferred from the heat generating component to the heat transfer fluid contained with the microtubes located within the evaporator portion. The heat transfer fluid to which the heat was transferred migrates to the condenser portion of the low profile unitary member by way of the microtubes. The heat transfer fluid is cooled in the condenser portion of the low profile unitary member.Type: GrantFiled: August 30, 2010Date of Patent: April 16, 2013Assignee: ThermoTek, Inc.Inventors: Overton L. Parish, IV, Roger S. DeVilbiss
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Publication number: 20110209856Abstract: A cooling apparatus for removing heat having a low profile unitary member. The low profile unitary member has an evaporator portion and a condenser portion. The evaporator portion is thermally exposed to a heat generating component. The condenser portion is disposed at an elevated angle with respect to the evaporator portion. A plurality of microtubes are disposed within the first low profile extrusion. The plurality of microtubes have a heat transfer fluid contained therein. A second plurality of low profile extrusion members are mounted as fins on the evaporator section of the low profile unitary member. Heat is transferred from the heat generating component to the heat transfer fluid contained with the microtubes located within the evaporator portion. The heat transfer fluid to which the heat was transferred migrates to the condenser portion of the low profile unitary member by way of the microtubes. The heat transfer fluid is cooled in the condenser portion of the low profile unitary member.Type: ApplicationFiled: August 30, 2010Publication date: September 1, 2011Inventors: Overton L. Parish, IV, Roger S. DeVilbiss
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Patent number: 7802436Abstract: A method for removing heat from a heat generating component using a low profile extrusion with a plurality of micro tubes extended there through. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid removes heat via an adiabatic process.Type: GrantFiled: January 20, 2006Date of Patent: September 28, 2010Assignee: Thermotek, Inc.Inventors: Overton L. Parish, IV, Roger S. DeVilbiss
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Patent number: 7686069Abstract: A cooling apparatus has a low profile extrusion with a plurality of micro tubes extended there through. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid removes heat via an adiabatic process.Type: GrantFiled: December 28, 2007Date of Patent: March 30, 2010Assignee: ThermoTek, Inc.Inventors: Overton L. Parish, IV, Roger S. DeVilbiss
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Publication number: 20080184710Abstract: In one embodiment of the invention, a system for controlling the temperature of water in a water reservoir includes a water reservoir, an inlet operable to deliver water to the water reservoir, an outlet operable to dispense at least a portion of the water from the water reservoir, and a staged water cooler having a first thermoelectric cooler stage coupled to a second thermoelectric cooler stage, the staged water cooler operable to control the temperature of the water in the water reservoir.Type: ApplicationFiled: February 6, 2007Publication date: August 7, 2008Inventor: Roger S. DeVilbiss
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Patent number: 7322400Abstract: A cooling apparatus has a low profile extrusion with a plurality of micro tubes extended there through. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid removes heat via an adiabatic process.Type: GrantFiled: December 23, 2002Date of Patent: January 29, 2008Assignee: ThermoTek, Inc.Inventors: Overton L. Parish, IV, Roger S. DeVilbiss
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Patent number: 6988315Abstract: A method for removing heat from a heat generating component using a low profile extrusion with a plurality of micro tubes extended there through. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid removes heat via an adiabatic process.Type: GrantFiled: December 23, 2002Date of Patent: January 24, 2006Assignee: Thermotek, Inc.Inventors: Overton L. Parish, IV, Roger S. DeVilbiss
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Patent number: 6981322Abstract: A cooling apparatus has a low profile extrusion with a plurality of micro tubes extended there through. In the caps interconnect the ends of the micro tubes in fluid communications and to inlet and outlet tubes. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid is circulated through the micro tubes of the low profile extrusion, and a heat exchanger removes the heat from the heat transfer fluid.Type: GrantFiled: December 31, 2002Date of Patent: January 3, 2006Assignee: Thermotek, Inc.Inventors: Overton L. Parish, IV, Roger S. DeVilbiss
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Patent number: 6935409Abstract: A cooling apparatus has a low profile extrusion with a plurality of micro tubes extended there through. In the caps interconnect the ends of the micro tubes in fluid communications and to inlet and outlet tubes. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid is circulated through the micro tubes of the low profile extrusion, and a heat exchanger removes the heat from the heat transfer fluid.Type: GrantFiled: June 8, 1999Date of Patent: August 30, 2005Assignee: Thermotek, Inc.Inventors: Overton L. Parish IV, Roger S. DeVilbiss
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Patent number: 6834712Abstract: A stacked array of low profile heat pipes each with a plurality of micro tubes extended therethrough. The stacked low profile heat pipes are placed into thermal connection with heat producing components. A heat transfer fluid is contained in the micro tubes of the low profile heat pipes and removes the heat from the heat producing components.Type: GrantFiled: November 26, 2002Date of Patent: December 28, 2004Assignee: Thermotek, Inc.Inventors: Overton L. Parish, Roger S. DeVilbiss
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Publication number: 20030136548Abstract: A stacked array of low profile heat pipes each with a plurality of micro tubes extended therethrough. The stacked low profile heat pipes are placed into thermal connection with heat producing components. A heat transfer fluid is contained in the micro tubes of the low profile heat pipes and removes the heat from the heat producing components.Type: ApplicationFiled: November 26, 2002Publication date: July 24, 2003Inventors: Overton L. Parish, Roger S. DeVilbiss
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Publication number: 20030127215Abstract: A cooling apparatus has a low profile extrusion with a plurality of micro tubes extended there through. In the caps interconnect the ends of the micro tubes in fluid communications and to inlet and outlet tubes. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid is circulated through the micro tubes of the low profile extrusion, and a heat exchanger removes the heat from the heat transfer fluid.Type: ApplicationFiled: December 31, 2002Publication date: July 10, 2003Applicant: THERMOTEK, INC.Inventors: Overton L. Parish, Roger S. DeVilbiss
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Publication number: 20030089486Abstract: A cooling apparatus has a low profile extrusion with a plurality of micro tubes extended there through. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid removes heat via an adiabatic process.Type: ApplicationFiled: December 23, 2002Publication date: May 15, 2003Applicant: Thermotek, Inc.Inventors: Overton L. Parish, Roger S. DeVilbiss
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Publication number: 20030089487Abstract: A method for removing heat from a heat generating component using a low profile extrusion with a plurality of micro tubes extended there through. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid removes heat via an adiabatic process.Type: ApplicationFiled: December 23, 2002Publication date: May 15, 2003Applicant: ThermoTek, Inc.Inventors: Overton L. Parish, Roger S. DeVilbiss
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Patent number: 6462949Abstract: A cooling apparatus using “low profile extrusions” is disclosed. The cooling apparatus of the present invention may be incorporated into a closed loop liquid cooling system which is particularly well suited to heat removal from electronic components in applications where space is limited. A cooling system in accordance with the present invention is illustrated for use in a typical wireless telecommunication base station for removing heat from power amplifiers and other electronic components. Cooling is carried out by drawing heat away from the electronic components and into at least one low profile extrusion attached directly to the heat generating components or a heat sink, and transferring the removed heat to a cooling fluid circulating through a plurality of micro tubes or channels within each low profile extrusion.Type: GrantFiled: August 7, 2000Date of Patent: October 8, 2002Assignee: Thermotek, Inc.Inventors: Overton L. Parish, IV, Roger S. DeVilbiss
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Publication number: 20020134544Abstract: An air conditioning apparatus and method for cooling enclosures containing electronic equipment. More particularly, one aspect of the present invention comprises a low cost passive heat removal system that utilizes a plurality of flat tubing or low profile extrusions. The flat tubing or low profile extrusions are arranged in parallel to create an air-to-air passive heat exchanger which may be incorporated into an air conditioning apparatus constructed in accordance with the present invention. The flat tubes or low profile extrusions offer a greater surface area and more efficient cooling than conventional folded fin designs having the same overall dimensions or volume. Moreover, the flat tubes or low profile extrusions may be manufactured with dimples, fins, or other surface enhancements with little additional labor or manufacturing steps. The air-to-air passive heat exchanger may be arranged in various configurations including cross flow, counterflow or concurrent flow.Type: ApplicationFiled: September 6, 2001Publication date: September 26, 2002Applicant: Thermotek, Inc.Inventors: Roger S. DeVilbiss, Kathryn Ostrom, Overton L. Parish, Tony Quisenberry
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Patent number: 6058712Abstract: A system for conditioning the air within an enclosure which houses heat producing equipment. The system includes a passive heat removal system, for precooling the air, and a thermoelectric temperature control system used in conjunction with the passive heat removal system to achieve the necessary temperature control. A power control system includes a programmable control means which receives signals, from a temperature sensor, which are indicative of the temperature of the air in the enclosure. Based upon these signals, the power control system controls the activation of thermoelectric devices in the thermoelectric temperature control system and controls the activation of fans to remove a desired amount of heat from the air in the enclosure and discharge the unwanted heat to the outside air. A switching device operates to apply battery power to the power control system if the electrical power source for the thermoelectric temperature control system fails.Type: GrantFiled: July 12, 1996Date of Patent: May 9, 2000Assignee: Thermotek, Inc.Inventors: Sathya Rajasubramanian, Roger S. DeVilbiss, Thomas C. Dedmon, Tony M. Quisenberry
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Patent number: 5989285Abstract: A temperature controlled blanket and a temperature controlled bedding system have provision of both recirculating temperature controlled fluid and temperature controlled gas to enhance performance for convectively heating or cooling a patient. Counter flow or co-flow heat exchanging principles between the temperature controlled liquid and the temperature controlled gas achieves temperature uniformity across different sections of the blanket and the bedding system. Drapes in the temperature controlled bedding system provide a gas envelope around a person using the bedding system. In a further embodiment of the bedding system, the air portion of the bedding system is provided for use with a patient bed which supplies the fluid portion of the overall bedding system. In a further embodiment of the bedding system, the fluid portion of the bedding system is provided for use with a patient bed which supplies the air portion of the overall bedding system.Type: GrantFiled: August 15, 1996Date of Patent: November 23, 1999Assignee: Thermotek, Inc.Inventors: Roger S. DeVilbiss, Tony M. Quisenberry, Sathya Rajasubramanian
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Patent number: 5890371Abstract: A system for conditioning the air within an enclosure which houses heat producing equipment. The system includes a passive heat removal system, for precooling the air, and a thermoelectric temperature control system used in conjunction with the passive heat removal system to achieve additional cooling, temperature control and heating. The passive heat removal system includes a heat pipe system. A power control system includes a programmable control means which receives signals, from a temperature sensor, which are indicative of the temperature of the air in the enclosure. Based upon these signals, the power control system controls the activation of thermoelectric devices in the thermoelectric temperature control system and controls the activation of fans to remove a desired amount of heat from the air in the enclosure and discharge the unwanted heat to the outside air.Type: GrantFiled: July 11, 1997Date of Patent: April 6, 1999Assignee: Thermotek, Inc.Inventors: Sathya Rajasubramanian, Roger S. DeVilbiss, Thomas C. Dedmon, Tony M. Quisenberry, Ronald Borman, Allen D. Boger, Jr.
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Patent number: 5711155Abstract: An improved thermoelectric temperature control system for selectively heating or cooling a temperature control fluid to be provided through an exit conduit to an external thermal load and returned to the system through an inlet conduit. The system having at least a first liquid heat exchanger, a thermoelectric module in thermal conductivity with the liquid heat exchanger, a heat sink in thermal conductivity with the thermoelectric module, a pump and connecting conduits to move the temperature control fluid from the inlet conduit through the pump and liquid heat exchanger to the exit conduit and power and control electronics to activate the pump and thermoelectric module.Type: GrantFiled: December 19, 1995Date of Patent: January 27, 1998Assignee: Thermotek, Inc.Inventors: Roger S. DeVilbiss, Tony M. Quisenberry, Sathya Rajasubramanian, Thomas C. Dedmon