Patents by Inventor Roger S. Lind

Roger S. Lind has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrates with dense metal vias
    Patent number: 4861641
    Abstract: Dense vias may be made with a metallizing composition containing tungsten, alumina, and either nickel or palladium. Further, an infiltration process ensures that vias in ceramic substrates are heremetic. Infiltrating materials, including metals and alloys, are applied to co-fired substrates and the composite is fired. The process may be repeated if necessary. Alternatively, the via holes may be bore-coated prior to infiltrating.
    Type: Grant
    Filed: May 22, 1987
    Date of Patent: August 29, 1989
    Assignee: Ceramics Process Systems Corporation
    Inventors: Brian C. Foster, Roger S. Lind
  • Tungsten paste for co-sintering with pure alumina and method for producing same
    Patent number: 4835039
    Abstract: A tungsten paste suitable for co-sintering with 98+% alumina substrate can be produced by adding selected compositions of glass to the paste. Circuit packages produced in accordance with the present invention exhibit superior thermal conductivity, low shrinkage variability, and smoother and more homogeneous surface finish. A preferred embodiment of the invention utilizes a substrate comprising narrow size range alumina powder, thus yielding lower sintering temperature and further improvements in shrinkage variability and surface finish.
    Type: Grant
    Filed: November 26, 1986
    Date of Patent: May 30, 1989
    Assignee: Ceramics Process Systems Corporation
    Inventors: Eric A. Barringer, Brian C. Foster, James D. Hodge, Roger S. Lind
  • Alumina materials for low temperature co-sintering with refractory metallization
    Patent number: 4769294
    Abstract: Substrates consisting of at least 98% narrow size distribution ceramic particles are co-sinterable with metallized paste to which selected compositions of glass have been added. Substrates produced in accordance with the present invention exhibit superior thermal conductivity, low shrinkage variability, and smoother and more homogeneous surface finish.
    Type: Grant
    Filed: November 26, 1986
    Date of Patent: September 6, 1988
    Assignee: Ceramics Process Systems Corp.
    Inventors: Eric A. Barringer, Roger S. Lind, Charles E. Swain, Ellen S. Tormey