Abstract: System and method are provided for removing condensate from an air-to-liquid heat exchanger of a combined air/liquid enclosed apparatus for cooling rack-mounted electronic equipment. The condensate removal system includes a condensate collector for collecting liquid condensate from the air-to-liquid heat exchanger, and a vaporizing chamber in fluid communication with the condensate collector for receiving collected liquid therefrom. An actively controlled vaporizer vaporizes collected liquid within the vaporizing chamber and a vapor exhaust is in communication with the vaporizing chamber for venting vapor from the vaporizing chamber outside the cabinet containing the combined air/liquid cooling apparatus and rack-mounted electronic equipment.

Abstract: Method, system and program product are provided for monitoring coolant within a cooling system designed to provide system coolant to one or more electronics subsystems. The monitoring technique includes employing at least one pressure transducer to obtain multiple pressure measurements related to an amount of coolant within an expansion tank of the cooling system, and determining a rate of volume change of coolant within the expansion tank employing the multiple pressure measurements. Successive pressure measurements can be taken at a known time interval to determine the rate of volume change of coolant within the expansion tank. An automatic determination can also be made on the immediacy of action to be taken for service of the cooling system based on the rate of volume change of coolant within the expansion tank.

Abstract: A cooling fluid distribution assembly for a plurality of electronic modules, using a composite cold plate structure. One cold plate is associated with each electronic module requiring liquid cooling. Each cold plate includes a high thermal conductivity base sealably fastened to a cover, the cover having at least one fluid inlet and at least one fluid outlet. Cover fluid inlets and outlets are connected via a plurality of flexible, nonmetallic conduits, the conduits being bonded to the cover inlets and outlets. Each cold plate cover is formed of a material that is capable of being bonded to the flexible, nonmetallic conduits, covers are therefore formed of a different material than the material comprising the cold plate base. Cold plate structures preferably include internal fluid distribution structures. The resulting cooling fluid distribution assembly provides reliable fluid connections and is sufficiently flexible to adjust for variances in module height etc.

Abstract: Method, system and program product are provided for facilitating operation of a cooling system designed to provide system coolant to one or more electronics subsystems of a computing environment. The technique includes automatically checking at least one coolant loop of the cooling system for a leak. The automatically checking includes isolating the at least one coolant loop from coolant flow through the cooling system and checking for drop in coolant pressure within the at least one coolant loop. Upon detection of a drop in coolant pressure, isolation of the coolant loop is retained thereby allowing operation of the cooling system to continue notwithstanding detection of a leak in the at least one coolant loop.

Abstract: A cooling system is provided employing at least two modular cooling units (MCUs). Each MCU is capable of providing system coolant to multiple electronics subsystems to be cooled, and each includes a heat exchanger, a first cooling loop with at least one control valve, and a second cooling loop. The first cooling loop receives chilled facility coolant from a source and passes at least a portion thereof through the heat exchanger, with the portion being controlled by the at least one control valve. The second cooling loop provides cooled system coolant to the multiple electronics subsystems, and expels heat in the heat exchanger from the multiple electronics subsystems to the chilled facility coolant in the first cooling loop. The at least one control valve allows regulation of facility coolant flow through the heat exchanger, thereby allowing control of temperature of system coolant in the second cooling loop.

Abstract: A cooling system is provided employing multiple coolant conditioning units (CCUs). Each CCU, which is coupled to a different, associated electronics rack of multiple electronics racks to be cooled, includes a heat exchanger, a first cooling loop with a control valve, and a second cooling loop. The first cooling loop receives chilled facility coolant from a source and passes at least a portion thereof via the control valve through the heat exchanger. The second cooling loop provides cooled system coolant to the associated electronics rack, and expels heat in the heat exchanger from the electronics rack to the chilled facility coolant in the first cooling loop. The control valve allows regulation of the facility coolant flow through the heat exchanger, thereby allowing independent control of temperature of the system coolant in the second cooling loop. Various CCU and associated component redundancies of the cooling system are also provided.

Abstract: A thermal dissipation assembly and method, and a cooled multi-drawer electronics rack are provided having a first cooling loop and a second cooling loop. The first cooling loop is disposed substantially within an electronics drawer and positioned to extract heat from an electronics module within the drawer. The first cooling loop further includes a first planar heat transfer surface. The second cooling loop is disposed substantially external to the electronics drawer and includes a second planar heat transfer surface. A biasing mechanism mechanically forces the first planar heat transfer surface and the second heat transfer surface coplanar when the electronics drawer is in a docked position in the electronics rack to facilitate the transfer of heat from the first cooling loop to the second cooling loop.

Abstract: The present invention relates to an epoxy ester coating copolymer resin which is useful in the preparation of an air curable, high solids coating, which resin is the reaction product of components (I), (II) and (III); wherein (I) is a polymerizable base of (a) a fatty acid having free radical polymerizable double bonds and (b) a vinyl monomer selected from the group consisting of styrenes, vinyl toluene and mixtures thereof; (II) is an epoxy resin and (III) is a monobasic acid. The epoxy ester copolymer resin of the invention is prepared by the reaction of (I), (II) and (III) at an elevated temperature to an acid number below 10.

Abstract: Epoxy polyol resins which are copolymerized with a blend of monomers having polymerizable double bonds are described as suitable water dispersible polymeric vehicles for coating compositions.

Abstract: Water reducible phenolic modified resins are described for use as binders in coating compositions which are non-lifting, recoatable with improved metal adhesion and corrosion resistance.

Abstract: A water reducible alkyd vinyl copolymer resin having an acid number in the range of from about 30 to about 70, a method for making the copolymer resin and coating compositions which include the resin are described wherein the copolymer resin is the reaction product offrom about 10 to about 90 percent by weight, based upon the weight of monomers and initiator which provide the alkyd vinyl copolymer resin, of an alkyd resin which is the product of a polymerization reaction and which has an acid number in the range of from about 30 to about 70; andfrom about 10 to about 90 percent by weight based upon the weight of the monomers and initiator which provide the alkyd vinyl copolymer resin, of a vinyl resin which has an acid number in the range of about 30 to about 70.

Abstract: Water reducible phenolic modified resins are described for use as binders in coating compositions which are non-lifting, recoatable with improved metal adhesion and corrosion resistance.