Abstract: A heat transfer interface structure and a method of manufacturing the same are disclosed. A substrate has a plurality of raised features formed on at least one surface the substrate. The raised features are deformable under a compressive force and have respective openings at end portions thereof. A thickness of a raised feature at the end portion thereof is smaller than a thickness of the raised feature at an intermediate portion of the raised feature.

Abstract: Method of manufacture, comprising forming a heat-transfer structure. Forming the heat-transfer structure includes forming a metallic planar substrate having a front surface and a back surface, the back surface being opposite the front surface. Forming the heat-transfer structure also includes forming an array of metallic raised features located directly on each of the front and back surfaces. Respective portions of the raised features are configured to be mechanically bend or buckle plastically deformable via a compressive force applied between a first substrate and a second substrate.

Abstract: An apparatus comprising a first substrate having a first surface, a second substrate having a second surface facing the first surface and an array of metallic raised features being in contact with the first surface to the second surface, a portion of the raised features having a mechanical bend or buckle plastic deformation produced therein via a compressive force. One or more of the metallic raised features has one or more surface singularities therein prior to the mechanical bend or the buckle plastic deformation produced by the compressive force.

Abstract: An apparatus 100 comprising a first substrate 130 having a first surface 125, a second substrate 132 having a second surface 127 facing the first surface and an array 170 of metallic raised features 170 being located on the first surface, each raised feature being in contact with the first surface to the second surface, a portion of the raised features being deformed via a compressive force 305.

Abstract: An apparatus comprising a first substrate having a first surface, a second substrate having a second surface facing the first surface and an array of metallic raised features being in contact with the first surface to the second surface, a portion of the raised features having a mechanical bend or buckle plastic deformation produced therein via a compressive force. One or more of the metallic raised features has one or more surface singularities therein prior to the mechanical bend or the buckle plastic deformation produced by the compressive force.

Abstract: An apparatus 100 comprising a first substrate 130 having a first surface 125, a second substrate 132 having a second surface 127 facing the first surface and an array 170 of metallic raised features 170 being located on the first surface, each raised feature being in contact with the first surface to the second surface, a portion of the raised features being deformed via a compressive force 305.